EN IEC 63287-2:2023

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.

Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des Einsatzprofils

Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification de la fiabilité - Partie 2: Concept de profil de mission

L’IEC 63287-2:2023 fournit des lignes directrices pour l'élaboration de plans de qualification de la fiabilité à l’aide du concept de profil de mission, sur la base des conditions environnementales et de l’utilisation prévue du produit. Le présent document n’est pas destiné aux applications militaires et spatiales.

Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2. del: Koncept profila namembnosti (IEC 63287-2:2023)

Ta del standarda IEC 63287 določa smernice za načrtovanje ocenjevanja zanesljivosti z uporabo koncepta profila namembnosti na podlagi okoljskega kondicioniranja in predlagane uporabe izdelka. Ta dokument ni namenjen za vojaško uporabo in uporabo v vesolju.

General Information

• Status: Published
• Publication Date: 11-May-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-May-2023
• Completion Date: 12-May-2023
• Ref Project: SIST EN IEC 63287-2:2023 - Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023)

Standards Content (Sample)

SLOVENSKI STANDARD
01-julij-2023
Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2.
del: Koncept profila namembnosti (IEC 63287-2:2023)
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of
mission profile (IEC 63287-2:2023)
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2:
Konzept des Einsatzprofils (IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification
de la fiabilité - Partie 2: Concept de profil de mission (IEC 63287-2:2023)
Ta slovenski standard je istoveten z: EN IEC 63287-2:2023
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 63287-2

NORME EUROPÉENNE
EUROPÄISCHE NORM May 2023
ICS 31.080.01
English Version
Semiconductor devices - Guidelines for reliability qualification
plans - Part 2: Concept of mission profile
(IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices Halbleiterbauelemente - Richtlinien für
concernant les plans de qualification de la fiabilité - Partie 2: Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des
Concept de profil de mission Einsatzprofils
(IEC 63287-2:2023) (IEC 63287-2:2023)
This European Standard was approved by CENELEC on 2023-05-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63287-2:2023 E

European foreword
The text of document 47/2796/FDIS, future edition 1 of IEC 63287-2, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63287-2:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-02-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-05-03
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document is read in conjunction with EN IEC 63287-1.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63287-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60068-2-1 NOTE Approved as EN 60068-2-1
IEC 60068-2-30 NOTE Approved as EN 60068-2-30
IEC 60749-11 NOTE Approved as EN 60749-11
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 63287-1 2021 Semiconductor devices - Generic EN IEC 63287-1 2021
semiconductor qualification guidelines -
Part 1: Guidelines for IC reliability
qualification
IEC 63287-2 ®
Edition 1.0 2023-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Guidelines for reliability qualification plans –

Part 2: Concept of mission profile

Dispositifs à semiconducteurs – Lignes directrices concernant les plans de

qualification de la fiabilité –

Partie 2: Concept de profil de mission

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01  ISBN 978-2-8322-6708-0

– 2 – IEC 63287-2:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Mission profile . 5
4.1 Concept of mission profile . 5
4.2 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (1) . 6
4.3 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (2) . 8
4.4 Example of reliability test plan considering the mission profile of automotive
cabin peripherals application . 9
5 Calculation examples of mission profiles (Calculation of sample and test time of
life tests) . 10
Bibliography . 15

Figure 1 – Example of mission profile for automotive application . 6

Table 1 – Trial calculation example of equivalent time under operating life test based
on consideration of the mission profile (automotive application in the engine
peripheral) . 7
Table 2 – Trial calculation example of number of samples/test time of operating life
test with consideration of the mission profile (Automotive application in the engine
peripheral) . 7
Table 3 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the engine peripheral) . 8
Table 4 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (Automotive application in the engine peripheral) . 9
Table 5 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the cabin peripheral) . 9
Table 6 – Trial calculation example of number of samples/test time of high temperature
operating life test with consideration of the mission profile (Automotive application in
the cabin peripheral) . 10
Table 7 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 11
Table 8 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 13

IEC 63287-2:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 63287 Part 2 has been prepared by IEC technical committee 47: Semiconductor devices.
It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2796/FDIS 47/2803/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 63287-2:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IE
...