CLC/TR 62258-4:2013

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen für Chip-Anwender und -Lieferanten

Produits de puces de semiconducteurs - Partie 4: Questionnaire destiné aux utilisateurs et fournisseurs de puces

La CEI/TR 62258-4:2012 a été élaborée afin de faciliter la production, la fourniture et l'utilisation de produits de puces de semiconducteurs, y compris: - les tranches; - les puces nues isolées; - les puces et les tranches avec leurs structures de connexion; - les puces et les tranches à encapsulation minimale ou partielle. Le présent rapport technique contient un questionnaire basé sur les exigences d'autres parties de la CEI 62258, qui peuvent être utilisées dans les négociations et les contrats entre fournisseurs et acheteurs de dispositifs à puces. Il est destiné à aider toutes les personnes impliquées dans la chaîne d'approvisionnement à se conformer aux exigences des normes CEI 62258-1:2009 et CEI 62258-2:2011. Il convient de noter que les tableaux contenus dans le présent rapport technique constituent une liste de contrôle d'informations qui peuvent potentiellement être fournies et il peut ne pas être approprié, voire ne pas être possible, de remplir tous les champs. Différents marchés peuvent nécessiter différents sous ensembles d'informations requises ici. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: La liste de contrôle des documents a été modifiée pour refléter exactement les exigences de la CEI 62258-1:2009.

Izdelki s polprevodniškimi čipi - 4. del: Vprašalnik za uporabnike in dobavitelje čipov

Ta del standarda IEC 62258 je namenjen lažji proizvodnji, dobavi in uporabi izdelkov s polprevodniškimi čipi, vključno z: – rezinami; – singularnimo polprevodniškimi integriranimi vezji brez ohišja; – polprevodniškimi integriranimi vezji in rezinami s pritrjenimi povezovalnimi strukturami; – polprevodniškimi integriranimi vezji in rezinami z minimalnimi ali delnimi ohišji. To tehnično poročilo vsebuje vprašalnik, ki temelji na zahtevah iz drugih delov standarda IEC 62258 in se lahko uporablja pri pogajanjih in pogodbah med dobavitelji in kupci naprav s polprevodniškimi čipi. Namenjen je pomoči osebam, vključenim v dobavno verigo naprav s polprevodniškimi čipi, pri izpolnjevanju zahtev standardov IEC 62258-1:2009 in IEC 62258-2:2011. Izpostaviti je treba, da preglednice iz tega tehničnega poročila sestavljajo kontrolni seznam z informacijami, ki se lahko navedejo, pri čemer ni nujno ali ni mogoče, da se izpolnijo vsa polja. Na različnih trgih se lahko zahtevajo različni podsklopi informacij iz seznama.

General Information

• Status: Published
• Publication Date: 10-Jan-2013
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 11-Jan-2013
• Completion Date: 11-Jan-2013
• Ref Project: SIST-TP CLC/TR 62258-4:2013 - Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Relations

• Replaces: CLC/TR 62258-4:2007 - Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-4:2013
01-marec-2013

,]GHONLVSROSUHYRGQLãNLPLþLSLGHO9SUDãDOQLN]DXSRUDEQLNHLQGREDYLWHOMH

þLSRY
Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen für Chip-Anwender und -Lieferanten

Produits de puces de semiconducteurs - Partie 4: Questionnaire destiné aux utilisateurs

et fournisseurs de puces
Ta slovenski standard je istoveten z: CLC/TR 62258-4:2013
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-4:2013 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST-TP CLC/TR 62258-4:2013
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SIST-TP CLC/TR 62258-4:2013
TECHNICAL REPORT
CLC/TR 62258-4
RAPPORT TECHNIQUE
January 2013
TECHNISCHER BERICHT
ICS 31.080.99 Supersedes CLC/TR 62258-4:2007
English version
Semiconductor die products -
Part 4: Questionnaire for die users and suppliers
(IEC/TR 62258-4:2012)
Produits de puces de semiconducteurs - Halbleiter-Chip-Erzeugnisse -
Partie 4: Questionnaire destiné Teil 4: Fragebogen für Chip-Anwender
aux utilisateurs et fournisseurs de puces und -Lieferanten
(CEI/TR 62258-4:2012) (IEC/TR 62258-4:2012)
This Technical Report was approved by CENELEC on 2012-09-12.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,

Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,

Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. CLC/TR 62258-4:2013 E
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SIST-TP CLC/TR 62258-4:2013
CLC/TR 62258-4:2013 - 2 -
Foreword

The text of document 47/2073A/DTR, future edition 2 of IEC/TR 62258-4, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as CLC/TR 62258-4:2013.
This document supersedes CLC/TR 62258-4:2007.

CLC/TR 62258-4:2013 includes the following significant technical changes with respect to

CLC/TR 62258-4:2007:

The document checklist was changed to mirror EN 62258-1:2010 requirements exactly.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such

patent rights.
Endorsement notice

The text of the International Standard IEC/TR 62258-4:2012 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC/TR 62258-7 NOTE Harmonised as CLC/TR 62258-7.
IEC/TR 62258-8 NOTE Harmonised as CLC/TR 62258-8.
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SIST-TP CLC/TR 62258-4:2013
- 3 - CLC/TR 62258-4:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
IEC 62258-1 2009 Semiconductor die products - EN 62258-1 2010
Part 1: Procurement and use
IEC 62258-2 2011 Semiconductor die products - EN 62258-2 2011
Part 2: Exchange data formats
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SIST-TP CLC/TR 62258-4:2013
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SIST-TP CLC/TR 62258-4:2013
IEC/TR 62258-4
Edition 2.0 2012-08
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
Semiconductor die products –
Part 4: Questionnaire for die users and suppliers
Produits de puces de semiconducteurs –
Partie 4: Questionnaire destiné aux utilisateurs et fournisseurs de puces
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.080.99 ISBN 978-2-83220-297-5

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST-TP CLC/TR 62258-4:2013
– 2 – TR 62258-4  IEC:2012
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope ............................................................................................................................... 6

2 Normative references ....................................................................................................... 6

3 Terms and definitions ....................................................................................................... 6

4 General ............................................................................................................................ 6

5 Data exchange ................................................................................................................. 7

Annex A (normative) Customer questionnaire on die devices ................................................. 8

Bibliography .......................................................................................................................... 18

Table A.1 – Basic data ............................................................................................................ 9

Table A.2 – Bare die and wafers ........................................................................................... 10

Table A.3 – Die and wafers with connection structures ......................................................... 11

Table A.4 – Minimally-packaged die devices ......................................................................... 12

Table A.5 – Quality, reliability and storage ............................................................................ 12

Table A.6 – Terminal data ..................................................................................................... 14

Table A.7 – Terminal geometries .......................................................................................... 14

Table A.8 – Polygon vertices ................................................................................................ 15

Table A.9 – Fiducial definitions ............................................................................................. 15

Table A.10 – Fiducial positions ............................................................................................. 16

Table A.11 – Simulator data .................................................................................................. 16

Table A.12 – Group definitions .............................................................................................. 17

Table A.13 – Permutations .................................................................................................... 17

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SIST-TP CLC/TR 62258-4:2013
TR 62258-4  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. However, a

technical committee may propose the publication of a technical report when it has collected

data of a different kind from that which is normally published as an International Standard, for

example "state of the art".

IEC 62258-4, which is a technical report, has been prepared by IEC technical committee 47:

Semiconductor devices.

This technical report contains attached files in the form of 47-62258-4-TR-E-worksheet.xls.

These files are intended to be used as a complement and do not form an integral part of the

technical report.

This second edition cancels and replaces the first edition published in 2007 and constitutes a

technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
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SIST-TP CLC/TR 62258-4:2013
– 4 – TR 62258-4  IEC:2012

The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/2073A/DTR 47/2108/RVC

Full information on the voting for the approval of this technical report can be found in the

report on voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62258 series, published under the general title Semiconductor

die products, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SIST-TP CLC/TR 62258-4:2013
TR 62258-4  IEC:2012 – 5 –
INTRODUCTION

This technical report is based on the work carried out in the ESPRIT 4th Framework Project

GOODDIE which resulted in the publication of the ES 59008 series of European specifications.

Organizations that helped prepare this document included the ESPRIT ENCAST and
ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.
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SIST-TP CLC/TR 62258-4:2013
– 6 – TR 62258-4  IEC:2012
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers
1 Scope

This part of IEC 62258 has been developed to facilitate the production, supply and use of

semiconductor die products, including:
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.

This technical report contains a questionnaire, based on the requirements of other parts of

IEC 62258, which may be used in negotiations and contracts between suppliers and

purchasers of die devices. It is intended to assist all those involved in the supply chain for die

devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011

standards.

It should be recognized that the tables contained in this technical report form a checklist of

information that can potentially be supplied and that it may not be relevant or possible to

complete all fields. Different markets may require different subsets of the information

requested herein.
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and

are indispensable for its application. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary (available at
http://www.electropedia.org)
IEC 62258-1:2009, Semiconductor die products – Part 1: Procurement and use
IEC 62258-2:2011 Semiconductor die products – Part 2: Exchange data formats
3 Terms and definitions

For the purposes of this document, the terms and definitions given in the IEC 60050 series

and IEC 62258-2:2011 apply.
4 General

To comply with IEC 62258-1:2009, that standard requires that suppliers of die devices furnish

information which is necessary and sufficient for users of the devices at all stages of design,

procurement, manufacture and test of the products containing them. The questionnaire in

Annex A provides a pro forma that can form a standard basis for supplying such information

and is intended as an aid to compliance with the standard.
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SIST-TP CLC/TR 62258-4:2013
TR 62258-4  IEC:2012 – 7 –

Where references are made in this technical report to clauses in IEC 62258-1:2009 and

IEC 62258-2:2011, they apply to those editions only. The tables in the annexes contain

requirements for information that is not yet covered by those parts of the standard but which

will be included in future issues. Furthermore, some of the terminology may not be exactly in

accordance with those standards. For example, the term “pad” is replaced by “terminal” in this

technical report.

Whilst it is expected that much of the information supplied will be in the public domain and

available from such sources as manufacturers’ data sheets, neither the standard nor the

questionnaire places an obligation on a supplier to make information public. Any information

that a supplier considers to be proprietary or commercially sensitive may be supplied under

the terms of a non-disclosure agreement.
5 Data exchange

In conjunction with the questionnaire tables in Annex A, a spreadsheet is available which

allows the info
...