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EN 60191-6-18:2010

(Main)

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

La CEI 60191-6-18:2010 fournit des dessins d'encombrement, des dimensions et des variations recommandées normalisés pour tous les boîtiers matriciels à billes de forme carrée (BGA), dont le pas de sortie est supérieur ou égal à 1 mm.

Mehanska standardizacija polprevodniških elementov - 6-18. del: Splošna pravila za izdelavo tehničnih risb naprav za pakiranje elementov za površinsko montažo - Navodilo za oblikovanje mreže krogličnih priključkov (BGA) (IEC 60191-6-18:2010)

Ta del IEC 60191 podaja standardne tehnične risbe, dimenzije in priporočene različice za vse mreže krogličnih priključkov (BGA), katerih konica je 1 mm ali večja.

General Information

Status
Published
Publication Date
25-Feb-2010
Withdrawal Date
31-Jan-2013
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
CLC/SR 47D - Mechanical standardization of semiconductor devices
Drafting Committee
IEC/SC 47D - IEC_SC_47D
Parallel Committee
IEC/SC 47D - IEC_SC_47D
Current Stage
6060 - Document made available - Publishing
Start Date
26-Feb-2010
Completion Date
26-Feb-2010
Ref Project
SIST EN 60191-6-18:2010 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packagers - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010)

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Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA) (IEC 60191-6-18:2010)Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA) (CEI 60191-6-18:2010)Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packagers - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010)31.240Mehanske konstrukcije za elektronsko opremoMechanical structures for electronic equipment31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in general01.100.25Electrical and electronics engineering drawingsICS:Ta slovenski standard je istoveten z:EN 60191-6-18:2010SIST EN 60191-6-18:2010en,fr01-april-2010SIST EN 60191-6-18:2010SLOVENSKI
STANDARD



SIST EN 60191-6-18:2010



EUROPEAN STANDARD EN 60191-6-18 NORME EUROPÉENNE
EUROPÄISCHE NORM February 2010
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: Avenue Marnix 17, B - 1000 Brussels
© 2010 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-18:2010 E
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices -
Part 6-18: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages -
Design guide for ball grid array (BGA) (IEC 60191-6-18:2010)
Normalisation mécanique
des dispositifs à semiconducteurs -
Partie 6-18: Règles générales
pour la préparation des dessins d'encombrement des dispositifs
à semiconducteurs
pour montage en surface -
Guide de conception pour les boîtiers matriciels à billes (BGA) (CEI 60191-6-18:2010)
Mechanische Normung
von Halbleiterbauelementen -
Teil 6-18: Allgemeine Regeln
für die Erstellung
von Gehäusezeichnungen
von SMD-Halbleitergehäusen -
Konstruktionsleitfaden
für Ball-Grid-Array (BGA) (IEC 60191-6-18:2010)
This European Standard was approved by CENELEC on 2010-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60191-6-18:2010



EN 60191-6-18:2010 - 2 -
Foreword The text of document 47D/753A/FDIS, future edition 1 of IEC 60191-6-18, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-18 on 2010-02-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2010-11-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2013-02-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60191-9-18:2010 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191-6-2 NOTE
Harmonized as EN 60191-6-2. IEC 60191-6-4 NOTE
Harmonized as EN 60191-6-4. IEC 60191-6-5 NOTE
Harmonized as EN 60191-6-5. __________
SIST EN 60191-6-18:2010



- 3 - EN 60191-6-18:2010
Annex ZA
(normative)
Normative references to international publications with their
...

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