EN 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement

Détermine la cohérence des matériaux et des méthodes d'essai utilisées pour fixer les pastilles à semiconducteurs aux embases de boîtiers ou autres substrats généralement applicable aux seuls boîtiers à cavité ou comme moniteur de processus.

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003)

Ta del IEC 60749 ugotavlja (glej opombo) celovitost materialov in postopkov, uporabljenih za priklop polprevodniških čipov na glave paketov ali druge substrate (za namen te preskusne metode, izraz »polprevodniški čipi« vključuje tudi pasivne elemente). Preskusna metoda na splošno velja samo za votle pakete ali kot nadzornik procesov. Ne velja za območja za čipe večja od 10 mm2. Prav tako ne velja za tehnologije Flip Chip ali za fleksibilne substrate. OPOMBA Ta ugotovitev je osnovana na izmeri moči, uporabljene na elementu, in če se zgodi napaka, na vrsti napake, ki se zgodi zaradi uporabe moči ter vizualnem zgledu preostalega medija za priklop čipa in metalizaciji glave/substrata.

General Information

• Status: Published
• Publication Date: 16-Apr-2003
• Withdrawal Date: 31-Mar-2006
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 17-Apr-2003
• Completion Date: 17-Apr-2003
• Ref Project: SIST EN 60749-19:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Relations

• Amended By: EN 60749-19:2003/A1:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-19:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear
strength (IEC 60749-19:2003)
ICS 31.080.01 Referenčna številka
SIST EN 60749-19:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-19
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2003

ICS 31.080.01


English version


Semiconductor devices –
Mechanical and climatic test methods
Part 19: Die shear strength
(IEC 60749-19:2002)


Dispositifs à semiconducteurs –  Halbleiterbauelemente –
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 19: Résistance de la pastille Teil 19: Prüfung der Chip-Bondfestigkeit
au cisaillement (IEC 60749-19:2002)
(CEI 60749-19:2002)



This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-19:2003 E

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EN 60749-19:2003 - 2 -
Foreword
The text of document 47/1664/FDIS, future edition 1 of IEC 60749-19, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-19 on 2003-04-01.
This mechanical and climatic test method, as it relates to die shear strength, is a complete rewrite of
the test contained in Clause 7, Chapter 2 of EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-04-01
__________
Endorsement notice
The text of the International Standard IEC 60749-19:2003 was approved by CENELEC as a European
Standard without any modification.
__________

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Die shear strength
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60749-19 © IEC:2003 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 19: Die shear strength
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
...