EN 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-4: Zyklische Biegeprüfung

Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-4: Essai de flexion cyclique

La méthode d'essai décrite dans la CEI 62137-1-4:2009 s'applique aux composants pour montage en surface avec un plan de base fin et large tel que les QFP ou les BGA. La présente méthode d'essai évalue l'endurance des joints de soudure situés entre les broches de raccordement et les plages de connexion sur un substrat par flexion cyclique de ce dernier. Cet essai évalue également les effets des contraintes mécaniques répétées, tels que le fait d'appuyer sur les touches d'un téléphone cellulaire, sur la résistance du joint de soudure situé entre les bornes du composant et les plages de connexion sur un substrat.

Tehnologija površinske montaže - Okoljski preskusi in preskusne metode za določanje zanesljivosti spajkanih spojev, izdelanih s površinsko montažo - 1-4. del: Ciklični preskus na upogib (IEC 62137-1-4:2009)

General Information

• Status: Published
• Publication Date: 19-Feb-2009
• Withdrawal Date: 31-Jan-2012
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 20-Feb-2009
• Completion Date: 20-Feb-2009
• Ref Project: SIST EN 62137-1-4:2009 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-4: Essai de flexion cycliqueSurface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test31.190Sestavljeni elektronski elementiElectronic component assemblies19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 62137-1-4:2009SIST EN 62137-1-4:2009en,fr,de01-junij-2009SIST EN 62137-1-4:2009SLOVENSKI
STANDARD



SIST EN 62137-1-4:2009



EUROPEAN STANDARD EN 62137-1-4 NORME EUROPÉENNE
EUROPÄISCHE NORM February 2009
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: avenue Marnix 17, B - 1000 Brussels
© 2009 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62137-1-4:2009 E
ICS 31.190
English version
Surface mounting technology -
Environmental and endurance test methods
for surface mount solder joint -
Part 1-4: Cyclic bending test (IEC 62137-1-4:2009)
Technologie de montage en surface -
Méthodes d'essais d'environnement
et d'endurance des joints brasés
montés en surface -
Partie 1-4: Essai de flexion cyclique (CEI 62137-1-4:2009)
Oberflächenmontage-Technik -
Verfahren zur Prüfung
auf Umgebungseinflüsse
und zur Prüfung der Haltbarkeit
von Oberflächen-Lötverbindungen -
Teil 1-4: Zyklische Biegeprüfung (IEC 62137-1-4:2009)
This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 62137-1-4:2009



EN 62137-1-4:2009
- 2 -
Foreword The text of document 91/815/FDIS, future edition 1 of IEC 62137-1-4, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-4 on 2009-02-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2009-11-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2012-02-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 62137-1-4:2009 was approved by CENELEC as a European Standard without any modification. __________
SIST EN 62137-1-4:2009



- 3 - EN 62137-1-4:2009 Annex ZA (normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1
-1) Environmental testing -
Part 1: General and guidance EN 60068-1 19942)
IEC 60194 -1) Printed board design, manufacture and assembly - Terms and definitions EN 60194 20062)
IEC 61188-5 Series Printed boards and printed board
assemblies - Design and use -
Part 5: Attachment (land/joint) considerations EN 61188-5 Series
IEC 61190-1-2 -1) Attachment materials for electronic
assembly -
Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly EN 61190-1-2 20072)
IEC 61190-1-3 -1) Attachment materials for electronic
assembly -
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 20072)
IEC 61249-2-7 -1) Materials for printed boards and other interconnecting structures -
Part 2-7: Reinfo
...