EN IEC 61760-3:2021
(Main)Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)
L’IEC 61760-3:2021 fournit un référentiel d’exigences et définit les conditions de procédé ainsi que les conditions d’essai correspondantes à utiliser pour élaborer les spécifications des composants électroniques destinés à être employés avec la technique du brasage par refusion à trous traversants (THR). L’objet du présent document est de s’assurer que les composants équipés de sorties destinées à la THR et les composants pour montage en surface peuvent être soumis aux mêmes procédés de placement et de montage. Ici, le présent document définit les essais et les exigences faisant nécessairement partie de toute spécification générique, intermédiaire ou particulière de composant, lorsqu’il s’agit de brasage par refusion à trous traversants. De plus, le présent document fournit aux utilisateurs de composants et à leurs fabricants un référentiel des conditions de procédés typiques utilisées dans le cadre de la technologie du brasage par refusion à trous traversants. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) modification de l’exigence relative à la tolérance de position (0,4 mm au maximum et entre 0,2 mm et 0,4 mm); b) introduction de la méthode du trou traversant vide comme méthode d’application de pâte à braser.
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo komponent za spajkanje "Through Hole Reflow" (THR)
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 61760-3:2021
01-junij-2021
Nadomešča:
SIST EN 61760-3:2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR)
Surface mounting technology - Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering
Technique du montage en surface - Partie 3 : Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow)
Ta slovenski standard je istoveten z: EN IEC 61760-3:2021
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61760-3:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 61760-3:2021
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SIST EN IEC 61760-3:2021
EUROPEAN STANDARD EN IEC 61760-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.190 Supersedes EN 61760-3:2010 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 3: Standard method for the
specification of components for through-hole reflow (THR)
soldering
(IEC 61760-3:2021)
Technique du montage en surface - Partie 3: Méthode Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren
normalisée relative à la spécification des composants pour zur Spezifizierung von Durchsteckmontage-Bauelementen
le brasage par refusion à trous traversants (THR, Through für das Aufschmelzlöten (THR)
Hole Reflow) (IEC 61760-3:2021)
(IEC 61760-3:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61760-3:2021 E
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SIST EN IEC 61760-3:2021
EN IEC 61760-3:2021 (E)
European foreword
The text of document 91/1684/FDIS, future edition 2 of IEC 61760-3, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-3:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
This document supersedes EN 61760-3:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61760-3:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-82:2019 NOTE Harmonized as EN IEC 60068-2-82:2019 (not modified)
IEC 62090 NOTE Harmonized as EN 62090
2
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SIST EN IEC 61760-3:2021
EN IEC 61760-3:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only
...
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