EN 61760-3:2010
(Main)Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)
La CEI 61760-3:2010 fournit un ensemble de références d'exigences indiquant les conditions de processus et d'essai correspondantes qui doivent être utilisées lors de l'élaboration des spécifications des composants électroniques qui sont destinés à être utilisés dans le cadre de la technologie du brasage par refusion à trous traversants. L'objet de la présente norme est de s'assurer que les composants comportant des sorties destinées à la THR et les composants pour montage en surface peuvent être soumis au même placement et au même processus de montage. Ici, la présente norme définit les essais et les exigences faisant nécessairement partie de toute spécification générique, intermédiaire ou particulière de composant, lorsqu'il s'agit de brasage par refusion à trou traversant. De plus, la présente norme fournit aux utilisateurs de composants et à leurs fabricants un ensemble de référence des conditions de processus typiques utilisées dans le cadre de la technologie du brasage par refusion à trou traversant.
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo komponent za spajkanje "Through Hole Reflow" (THR) (IEC 61760-3:2010)
Ta del IEC 61760 podaja referenčni sklop zahtev, procesnih pogojev in povezanih preskusnih pogojev, ki se uporabljajo pri zbiranju specifikacij elektronskih komponent, namenjenih uporabi pri tehnologiji spajkanja »Through Hole Reflow«. Namen tega standarda je zagotoviti, da za komponente z vodniki, namenjene »Through Hole Reflow«, in komponente za površinsko namestitev lahko veljajo enaki postopki namestitve in vgradnje. Pri tem ta standard opredeljuje preskus in zahteve, ki morajo biti del splošne, presečne ali podrobne specifikacije vsake komponente, kadar gre za spajkanje »Through Hole Reflow«. Nadalje standard uporabnikom in proizvajalcem komponent zagotavlja referenčni sklop značilnih procesnih pogojev, ki se uporabljajo pri tehnologiji spajkanja »Through Hole Reflow«.
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Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR) (IEC 61760-3:2010)
Surface mounting technology - Part 3: Standard method for the specification of
components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von
Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 61760-3:2010)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow) (CEI 61760-3:2010)
Ta slovenski standard je istoveten z: EN 61760-3:2010
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 61760-3
NORME EUROPÉENNE
April 2010
EUROPÄISCHE NORM
ICS 31.190
English version
Surface mounting technology -
Part 3: Standard method for the specification of components
for Through Hole Reflow (THR) soldering
(IEC 61760-3:2010)
Technique du montage en surface - Oberflächenmontagetechnik -
Partie 3: Méthode normalisée relative Teil 3: Genormtes Verfahren
à la spécification des composants pour zur Spezifizierung
le brasage par refusion à trous traversants von Durchsteckmontage-Bauelementen
(THR, Through Hole Reflow) für das Aufschmelzlöten (THR)
(CEI 61760-3:2010) (IEC 61760-3:2010)
This European Standard was approved by CENELEC on 2010-04-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-3:2010 E
Foreword
The text of document 91/856/CDV, future edition 1 of IEC 61760-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61760-3 on 2010-04-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-01-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-04-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61760-3:2010 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61760-3:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60062 - Marking codes for resistors and capacitors EN 60062 -
IEC 60068 Series Environmental testing EN 60068 Series
IEC 60068-2-20 - Environmental testing - EN 60068-2-20 -
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 60068-2-21 - Environmental testing - EN 60068-2-21 -
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-45 1980 Environmental testing - EN 60068-2-45 1992
+ A1 1993 Part 2: Tests - Test Xa and guidance: + A1 1993
Immersion in cleaning solvents
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 -
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-77 - Environmental testing - EN 60068-2-77 -
Part 2-77: Tests - Test 77: Body strength and
impact shock
IEC 60068-2-82 - Environmental testing - EN 60068-2-82 -
Part 2-82: Tests - Test XW1: Whisker test
methods for electronic and electric
components
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 60286 Series Packaging of components for automatic EN 60286 Series
handling
IEC 60286-3 - Packaging of components for automatic EN 60286-3 -
handling -
Part 3: Packaging of surface mount
components on continuous tapes
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling -
Part 4: Stick magazines for electronic
components encapsulated in packages of
form E and G
Publication Year Title EN/HD Year
IEC 60286-5 - Packaging of components for automatic EN 60286-5 -
handling -
Part 5: Matrix trays
IEC 60749-20 - Semiconductor devices - Mechanical and EN 60749-20 -
climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture and
soldering heat
IEC 61760-2 - Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide
IEC 62090 - Product package labels for electronic EN 62090 -
components using bar code and two-
dimensional symbologies
ISO 8601 - Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
IEC 61760-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 3: Standard method for the specification of components for through hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 2-8318-1083-9
– 2 – 61760-3 © IEC:2010
CONTENTS
FOREWORD.4
1 Scope and object.6
2 Normative references .6
3 Terms and definitions .7
4 Requirements to component design and component specifications .8
4.1 General requirement .8
4.2 Packaging .8
4.3 Labelling of product packaging .9
4.4 Component marking .9
4.5 Storage and transportation .10
4.6 Component outline and design .10
4.6.1 Drawing and specification.10
4.6.2 Pick-up area requirements.10
4.6.3 Bottom surface requirements .10
4.6.4 Requirements to terminals.10
4.6.5 Component height .14
4.6.6 Component weight.14
4.7 Mechanical stress .14
4.8 Component reliability.14
4.9 Additional requirements for compatibility with lead-free soldering .15
5 Specification of assembly process conditions .15
5.1 Mounting by soldering .15
5.2 Reflow soldering methods (recommended) .16
5.2.1 Vapour phase reflow soldering.16
5.2.2 Forced air convection reflow soldering.16
5.3 Cleaning (where applicable) .17
5.3.1 General .17
5.3.2 Fluid .17
5.3.3 Ultrasonic cleaning .17
5.3.4 Vapour .17
5.3.5 Spray.17
5.3.6 Plasma cleaning .17
5.4 Removal and/or replacement.17
5.4.1 Removal and/or replacement of soldered components .17
6 Typical process conditions.18
6.1 Printing of solder paste .18
6.2 Component insertion .18
6.3 Soldering processes, temperature/time profiles .18
6.3.1 Vapour phase soldering.19
6.3.2 Forced gas convection reflow soldering .20
6.4 Typical cleaning conditions for assemblies .21
6.5 Inspection of solder joints.21
7 Requirements for components and component specifications for THR soldering
processes.21
7.1 General .21
7.2 Wettability .21
61760-3 © IEC:2010 – 3 –
7.3 Dewetting .22
7.4 Resistance to soldering heat .22
7.5 Resistance to cleaning solvent .22
7.5.1 Solvent resistance of component .22
7.5.2 Solvent resistance of marking.22
7.6 Soldering profiles .22
7.7 Moisture sensitivity level (MSL) .22
Figure 1 – Example of a component with marked specific orientation put in tape and tray.9
Figure 2 – Example of components in a tape.9
Figure 3 – Examples for clearances (stand-off) .
...
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