EN 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quadrangulaires en céramique, scellement verre

La CEI 60191-6-8:2001 fournit les dessins d'encombrement et les dimensions courants de tous les types de structures et de matériaux composés de boîtiers plats quadrangulaires en céramique, scellement verre (appelés ci-après G-QFP). L'objectif du présent guide de conception est de normaliser les encombrements et d'obtenir l'interchangeabilité des G-QFP.

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001)

General Information

• Status: Published
• Publication Date: 21-Oct-2001
• Withdrawal Date: 30-Sep-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 22-Oct-2001
• Completion Date: 22-Oct-2001
• Ref Project: SIST EN 60191-6-8:2002 - Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2002
Mechanical standardization of semiconductor devices - Part 6-8: General rules for
the preparation of outline drawings of surface mounted semiconductor device
package - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191
-6-8:2001)
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Design guide for glass sealed ceramic quad flatpack (G-QFP)
Mechanische Normung von Halbleiterbauelementen -- Teil 6-8: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen -
Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP)
Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-8: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats
quadrangulaires en céramique, scellement verre
Ta slovenski standard je istoveten z: EN 60191-6-8:2001
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60191-6-8
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2001
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices
Part 6-8: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages -
Design guide for glass sealed ceramic quad flatpack (G-QFP)
(IEC 60191-6-8:2001)
Normalisation mécanique des dispositifs Mechanische Normung von
à semiconducteurs Halbleiterbauelementen
Partie 6-8: Règles générales pour Teil 6-8: Allgemeine Regeln für
la préparation des dessins die Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs à von SMD-Halbleitergehäusen -
semiconducteurs à montage en surface - Konstruktionsleitfaden für Glas-Keramik-
Guide de conception pour les boîtiers Quad-Flatpack (G-QFP)
plats quadrangulaires en céramique, (IEC 60191-6-8:2001)
scellement verre
(CEI 60191-6-8:2001)
This European Standard was approved by CENELEC on 2001-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-8:2001 E
Foreword
The text of document 47D/438/FDIS, future edition 1 of IEC 60191-6-8, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-8 on
2001-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2004-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-8:2001 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 60191-6-8:2001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191 Series Mechanical standardization of EN 60191 Series
semiconductor devices
INTERNATIONAL IEC
STANDARD
60191-6-8
First edition
2001-08
Mechanical standardization
of semiconductor devices –
Part 6-8:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for glass sealed ceramic quad
flatpack (G-QFP)
Normalisation mécanique des dispositifs à semiconducteurs
Partie 6-8:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs
à montage en surface –
Guide de conception pour les boîtiers plats quadrangulaires
en céramique, scellement verre
 IEC 2001  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
K
International Electrotechnical Commission
For price, see current catalogue

– 2 – 60191-6-8 © IEC:2001(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 6-8: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for glass sealed ceramic quad flatpack (G-QFP)
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or
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