EN 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quadrangulaires en céramique, scellement verre

La CEI 60191-6-8:2001 fournit les dessins d'encombrement et les dimensions courants de tous les types de structures et de matériaux composés de boîtiers plats quadrangulaires en céramique, scellement verre (appelés ci-après G-QFP). L'objectif du présent guide de conception est de normaliser les encombrements et d'obtenir l'interchangeabilité des G-QFP.

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001)

General Information

• Status: Published
• Publication Date: 21-Oct-2001
• Withdrawal Date: 30-Sep-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 22-Oct-2001
• Completion Date: 22-Oct-2001
• Ref Project: SIST EN 60191-6-8:2002 - Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-8:2002
01-september-2002
Mechanical standardization of semiconductor devices - Part 6-8: General rules for
the preparation of outline drawings of surface mounted semiconductor device
package - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191
-6-8:2001)
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Design guide for glass sealed ceramic quad flatpack (G-QFP)
Mechanische Normung von Halbleiterbauelementen -- Teil 6-8: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen -
Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP)
Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-8: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats
quadrangulaires en céramique, scellement verre
Ta slovenski standard je istoveten z: EN 60191-6-8:2001
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-8:2002 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 60191-6-8:2002

---------------------- Page: 2 ----------------------

SIST EN 60191-6-8:2002
EUROPEAN STANDARD EN 60191-6-8
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2001
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices
Part 6-8: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages -
Design guide for glass sealed ceramic quad flatpack (G-QFP)
(IEC 60191-6-8:2001)
Normalisation mécanique des dispositifs Mechanische Normung von
à semiconducteurs Halbleiterbauelementen
Partie 6-8: Règles générales pour Teil 6-8: Allgemeine Regeln für
la préparation des dessins die Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs à von SMD-Halbleitergehäusen -
semiconducteurs à montage en surface - Konstruktionsleitfaden für Glas-Keramik-
Guide de conception pour les boîtiers Quad-Flatpack (G-QFP)
plats quadrangulaires en céramique, (IEC 60191-6-8:2001)
scellement verre
(CEI 60191-6-8:2001)
This European Standard was approved by CENELEC on 2001-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-8:2001 E

---------------------- Page: 3 ----------------------

SIST EN 60191-6-8:2002
EN 60191-6-8:2001 - 2 -
Foreword
The text of document 47D/438/FDIS, future edition 1 of IEC 60191-6-8, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-8 on
2001-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2004-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-8:2001 was approved by CENELEC as a
European Standard without any modification.
__________

---------------------- Page: 4 ------------
...