EN 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Mechanische Normung von Halbleiterbauelemente - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-5: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels à billes et à pas fins (FBGA)

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)

General Information

• Status: Published
• Publication Date: 21-Oct-2001
• Withdrawal Date: 30-Sep-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 22-Oct-2001
• Completion Date: 22-Oct-2001
• Ref Project: SIST EN 60191-6-5:2002 - Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)Mechanische Normung von Halbleiterbauelemente -- Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA)Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-5: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels à billes et à pas fins (FBGA)Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)31.240Mehanske konstrukcije za elektronsko opremoMechanical structures for electronic equipment31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in general01.100.25Electrical and electronics engineering drawingsICS:Ta slovenski standard je istoveten z:EN 60191-6-5:2001SIST EN 60191-6-5:2002en01-september-2002SIST EN 60191-6-5:2002SLOVENSKI
STANDARD



SIST EN 60191-6-5:2002



EUROPEAN STANDARDEN 60191-6-5NORME EUROPÉENNEEUROPÄISCHE NORMOctober 2001CENELECEuropean Committee for Electrotechnical StandardizationComité Européen de Normalisation ElectrotechniqueEuropäisches Komitee für Elektrotechnische NormungCentral Secretariat: rue de Stassart 35, B - 1050 Brussels© 2001 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 60191-6-5:2001 EICS 31.080.01English versionMechanical standardization of semiconductor devicesPart 6-5: General rules for the preparation of outline drawings ofsurface mounted semiconductor device packages -Design guide for fine-pitch ball grid array (FBGA)(IEC 60191-6-5:2001)Normalisation mécanique des dispositifsà semiconducteursPartie 6-5: Règles générales pourla préparation des dessinsd'encombrement des dispositifs àsemiconducteurs à montage en surface -Guide de conception pour les boîtiersmatriciels à billes et à pas fins (FBGA)(CEI 60191-6-5:2001)Mechanische Normung vonHalbleiterbauelementeTeil 6-5: Allgemeine Regeln fürdie Erstellung von Gehäusezeichnungenvon SMD-Halbleitergehäusen -Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA)(IEC 60191-6-5:2001)This European Standard was approved by CENELEC on 2001-10-01. CENELEC members are bound tocomply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the Central Secretariat or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any otherlanguage made by translation under the responsibility of a CENELEC member into its own language andnotified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.SIST EN 60191-6-5:2002



EN 60191-6-5:2001- 2 -ForewordThe text of document 47D/437/FDIS, future edition 1 of IEC 60191-6-5, prepared by SC 47D,Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, wassubmitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-5 on2001-10-01.The following dates were fixed:–latest date by which the EN has to be implementedat national level by publication of an identicalnational standard or by endorsement(dop)2002-07-01–latest date by which the national standards conflictingwith the EN have to be withdrawn(dow)2004-10-01Annexes designated "normative" are part of the body of the standard. In this standard, annex ZA is normative.Annex ZA has been added by CENELEC.__________Endorsement noticeThe text of the International Standard IEC 60191-6-5:2001 was approved by CENELEC as aEuropean Standard without any modification.__________SIST EN 60191-6-5:2002



- 3 -EN 60191-6-5:2001Annex ZA(normative)Normative references to international publicationswith their corresponding European publicationsThis European Standard incorporates by dated or undated reference, provisions from otherpublications. These normative references are cited at the appropriate places in the text and thepublications are listed hereafter. For dated references, subsequent amendments to or revisions of anyof
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