EN 61190-1-3:2007/A1:2010
(Amendment)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Amandma A1:2010 je dodatek k standardu SIST EN 61190-1-3:2007
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique
Povezovalni materiali za elektronske sestave - 1-3. del: Zahteve za spajkalne zlitine ter za spajkalne žice s spajkalno tekočino in brez nje za uporabo v elektroniki - Dopolnilo A1 (IEC 61190-1-3:2007/A1:2010)
Amandma A1:2010 je dodatek k standardu SIST EN 61190-1-3:2007
Ta del IEC 61190 predpisuje zahteve in preskusne metode za spajkalne zlitine za uporabo v elektroniki, za spajkalni prah, pasto, trak in palice s spajkalno tekočino in brez nje, za uporabo v elektroniki in za “posebne” spajke za uporabo v elektroniki. Za rodovne specifikacije spajkalnih zlitin in tekočin glej ISO 9453, ISO 9454-1 in ISO 9454-2. Ta standard je dokument za nadzor kakovosti in ni namenjen temu, da bi se neposredno nanašal na obnašanje materiala v postopku proizvodnje. Posebne spajke za uporabo v elektroniki zajemajo vse spajke, ki ne ustrezajo popolnoma zahtevam standardnih spajkalnih zlitin in spajkalnih materialov, naštetih v tem dokumentu. Primeri posebnih spajk vključujejo anode, ingote, vnaprej oblikovane kose, palice s kavljem in zanko na koncu, spajkalne praške iz več zlitin itd.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 61190-1-3:2007/A1:2010
01-december-2010
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications (IEC 61190-1-3:2007/A1:2010)
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an
Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von
Elektronikprodukten (IEC 61190-1-3:2007/A1:2010)
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences
relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et
non fluxées pour les applications de brasage électronique (CEI 61190-1-
3:2007/A1:2010)
Ta slovenski standard je istoveten z: EN 61190-1-3:2007/A1:2010
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-3:2007/A1:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 61190-1-3:2007/A1:2010
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SIST EN 61190-1-3:2007/A1:2010
EUROPEAN STANDARD
EN 61190-1-3/A1
NORME EUROPÉENNE
September 2010
EUROPÄISCHE NORM
ICS 31.190
English version
Attachment materials for electronic assembly -
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
(IEC 61190-1-3:2007/A1:2010)
Matériaux de fixation Verbindungsmaterialien für Baugruppen
pour les assemblages électroniques - der Elektronik -
Partie 1-3: Exigences relatives Teil 1-3: Anforderungen an Elektroniklote
aux alliages à braser de catégorie und an Festformlote
électronique et brasures solides fluxées mit oder ohne Flussmittel für das Löten
et non fluxées pour les applications von Elektronikprodukten
de brasage électronique (IEC 61190-1-3:2007/A1:2010)
(CEI 61190-1-3:2007/A1:2010)
This amendment A1 modifies the European Standard EN 61190-1-3:2007; it was approved by CENELEC on
2010-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2007/A1:2010 E
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SIST EN 61190-1-3:2007/A1:2010
EN 61190-1-3:2007/A1:2010 - 2 -
Foreword
The text of document 91/920/FDIS, future amendment 1 to IEC 61190-1-3:2007, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 61190-1-3:2007 on 2010-09-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the amendment has to be
implemented at national level by publication of
(dop) 2011-06-01
an identical national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-09-01
with the amendment have to be withdrawn
__________
Endorsement notice
The text of amendment 1:2010 to the International Standard IEC 61190-1-3:2007 was approved by
CENELEC as an amendment to the European Standard without any modificati
...
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