EN 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP)

Normalisation mécanique des dispositifs à semiconducteurs - Part 6-21: Règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semiconducteurs pour montage en surface - Méthodes de mesure pour les dimensions des boîtiers de faible encombrement (SOP)

La CEI 60191-6-21:2010 spécifie les méthodes destinées à mesurer les dimensions des boîtiers de faible encombrement SOP, l'encombrement des boîtiers de forme E conformément à la CEI 60191-4.

Standardizacija mehanskih lastnosti polprevodniških elementov - 6-21. del: Splošna pravila za izdelavo tehničnih risb površinsko montiranih sklopov polprevodniških elementov - Merilne metode za mere majhnih okrovov (SOP) (IEC 60191-6-21:2010)

Ta del IEC 60191 določa metode za merjenje mer majhnih okrovov (SOP), okrovov v obliki črke E v skladu z IEC 60191-4.

General Information

• Status: Published
• Publication Date: 14-Oct-2010
• Withdrawal Date: 30-Sep-2013
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 15-Oct-2010
• Completion Date: 15-Oct-2010
• Ref Project: SIST EN 60191-6-21:2010 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-21:2010
01-december-2010
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRYGHO
6SORãQDSUDYLOD]DL]GHODYRWHKQLþQLKULVESRYUãLQVNRPRQWLUDQLKVNORSRY
SROSUHYRGQLãNLKHOHPHQWRY0HULOQHPHWRGH]DPHUHPDMKQLKRNURYRY623,(&

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Measuring methods for package dimensions of small outline packages (SOP) (IEC
60191-6-21:2010)
Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren
für Gehäusemaße von kleinen Gehäusen (SOP) (IEC 60191-6-21:2010)
Normalisation mécanique des dispositifs à semiconducteurs - Part 6-21: Règles
générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs
à semiconducteurs pour montage en surface - Méthodes de mesure pour les dimensions
des boîtiers de faible encombrement (SOP) (CEI 60191-6-21:2010)
Ta slovenski standard je istoveten z: EN 60191-6-21:2010
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-21:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-21:2010

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SIST EN 60191-6-21:2010

EUROPEAN STANDARD
EN 60191-6-21

NORME EUROPÉENNE
October 2010
EUROPÄISCHE NORM

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices -
Part 6-21: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages -
Measuring methods for package dimensions of small outline packages
(SOP)
(IEC 60191-6-21:2010)

Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Part 6-21: Règles générales pour la Teil 6-21: Allgemeine Regeln für die
préparation des dessins d'encombrement Erstellung von Gehäusezeichnungen von
des boîtiers pour dispositifs à SMD-Halbleitergehäusen -
semiconducteurs pour montage en Messverfahren für Gehäusemaße von
surface - kleinen Gehäusen (SOP)
Méthodes de mesure pour les dimensions (IEC 60191-6-21:2010)
des boîtiers de faible encombrement
(SOP)
(CEI 60191-6-21:2010)

This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

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the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-21:2010 E

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SIST EN 60191-6-21:2010
EN 60191-6-21:2010 - 2 -
Foreword
The text of document 47D/772/FDIS, future edition 1 of IEC 60191-6-21, prepared by SC 47D,
Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-21 on
2010-10-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
...