EN 60749-37:2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre

La présente partie de la CEI 60749 fournit une méthode d'essai destinée à évaluer et comparer la performance de chute des composants à montage en surface dans des applications de produits électroniques portatifs dans un environnement d'essai accéléré, où une flexion excessive d'une carte de circuit imprimé provoque une défaillance de produit. Le but est de normaliser la carte d'essai et la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des composants à montage en surface, en reproduisant les mêmes modes de défaillances que ceux observés normalement au cours d'un essai au niveau du produit.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2008)

General Information

• Status: Published
• Publication Date: 10-Apr-2008
• Withdrawal Date: 28-Feb-2011
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 11-Apr-2008
• Completion Date: 11-Apr-2008
• Ref Project: SIST EN 60749-37:2008 - Semiconductor devices - Mechanical and climatic test methods -- Part 37: Board level drop test method using an accelerometer

Relations

• Replaced By: EN IEC 60749-37:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
• Effective Date: 22-Nov-2022

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008)Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2008)Dispositifs a semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accélérometre (CEI 60749-37:2008)Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2008)31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:SIST EN 60749-37:2008en,frTa slovenski standard je istoveten z:EN 60749-37:200801-junij-2008SIST EN 60749-37:2008SLOVENSKI
STANDARD







EUROPEAN STANDARD EN 60749-37 NORME EUROPÉENNE
EUROPÄISCHE NORM April 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-37:2008 E
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008)
Dispositifs à semiconducteurs -
Méthodes d'essais mécaniques
et climatiques -
Partie 37: Méthode d'essai
de chute au niveau de la carte
avec utilisation d’un accéléromètre (CEI 60749-37:2008)
Halbleiterbauelemente -
Mechanische und klimatische Prüfverfahren -
Teil 37: Prüfverfahren Fall
der Leiterplatte unter Verwendung
eines Beschleunigungs-Messgerätes (IEC 60749-37:2008)
This European Standard was approved by CENELEC on 2008-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.



EN 60749-37:2008
- 2 -
Foreword The text of document 47/1937/FDIS, future edition 1 of IEC 60749-37, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-37 on 2008-03-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-12-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2011-03-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60749-37:2008 was approved by CENELEC as a European Standard without any modification. __________



- 3 - EN 60749-37:2008 Annex ZA(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60749-10 2002 Semiconductor devices - Mechanical and climatic test methods -
Part 10: Mechanical shock EN 60749-10 2002
IEC 60749-20 -1) Semiconductor devices - Mechanical and climatic test methods -
Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 20032)
IEC 60749-20-1 -3) Semiconductor devices - Mechanical and climatic test methods -
Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat - -
1) Undated reference. 2) Valid edition
...