EN 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Mechanische Normung von Halbleiterbauelementen – Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible

La CEI 60191-6-19:2010 couvre les exigences relatives aux méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible pour les boîtiers BGA, FBGA et FLGA. La présente norme annule et remplace l'IEC/PAS 60191-6-19 publié en 2008. Cette première édition constitue une révision technique.

Mehanska standardizacija polprevodniških elementov - 6-19. del: Merilne metode ukrivljenosti okrovov pri povišanih temperaturah in največje dopustne ukrivljenosti (IEC 60191-6-19:2010)

Ta del IEC 60191 določa merilne metode ukrivljenosti okrovov pri povišanih temperaturah in največje dopustne ukrivljenosti za mrežo krogličnih priključkov (BGA), fini raster mreže krogličnih priključkov (FBGA) in fini raster mreže priključkov v ravnini (FLGA).

General Information

• Status: Published
• Publication Date: 20-May-2010
• Withdrawal Date: 30-Apr-2013
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 21-May-2010
• Completion Date: 21-May-2010
• Ref Project: SIST EN 60191-6-19:2010 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-19:2010
01-september-2010
0HKDQVNDVWDQGDUGL]DFLMDSROSUHYRGQLãNLKHOHPHQWRYGHO0HULOQHPHWRGH
XNULYOMHQRVWLRNURYRYSULSRYLãDQLKWHPSHUDWXUDKLQQDMYHþMHGRSXVWQH
XNULYOMHQRVWL,(&
Mechanical standardization of semiconductor devices - Part 6-19: Measurement
methods of the package warpage at elevated temperature and the maximum permissible
warpage (IEC 60191-6-19:2010)
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die
Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
(IEC 60191-6-19:2010)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de
mesure du gauchissement des boîtiers à température élevée et du gauchissement
maximum admissible (CEI 60191-6-19:2010)
Ta slovenski standard je istoveten z: EN 60191-6-19:2010
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-19:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-19:2010

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SIST EN 60191-6-19:2010

EUROPEAN STANDARD
EN 60191-6-19

NORME EUROPÉENNE
May 2010
EUROPÄISCHE NORM

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices -
Part 6-19: Measurement methods of the package warpage
at elevated temperature and the maximum permissible warpage
(IEC 60191-6-19:2010)


Normalisation mécanique des dispositifs  Mechanische Normung
à semiconducteurs - von Halbleiterbauelementen –
Partie 6-19: Méthodes de mesure Teil 6-19: Messverfahren für die Gehäuse-
du gauchissement des boîtiers Verbiegung bei erhöhter Temperatur
à température élevée und die maximal zulässige Verbiegung
et du gauchissement maximum admissible (IEC 60191-6-19:2010)
(CEI 60191-6-19:2010)




This European Standard was approved by CENELEC on 2010-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

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Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-19:2010 E

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SIST EN 60191-6-19:2010
EN 60191-6-19:2010 - 2 -
Foreword
The text of document 47D/757/FDIS, future edition 1 of IEC 60191-6-19, prepared by SC 47D,
Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-19 on
2010-05-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2013-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-19:2010 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 60191-6-19:2010
- 3 - EN 60191-6-19:2010
Annex ZA
(
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