EN 60749-7:2011

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

IEC 60749-7:2011 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. This second edition has been completely re-written so as to align it with the text of the latest versions of MIL-STD-750, method 1018 and MIL-STD-883, method 1018. The main change is the removal of the two alternative methods formerly designated method 2 and method 3.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung des inneren Feuchtegehaltes und Analyse von anderen Restgasen

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7: Mesure de la teneur en humidité interne et analyse des autres gaz résiduels

La CEI 60749-7:2011 spécifie les essais et les mesures de la teneur en vapeur d'eau et en autres gaz de l'atmosphère à l'intérieur d'un dispositif métallique ou céramique scellé hermétiquement. L'essai est utilisé en tant que mesure de la qualité du procédé de scellement et en vue de fournir des informations sur la stabilité chimique à long terme de l'atmosphère à l'intérieur du boîtier. Il est applicable à tous les dispositifs à semiconducteurs scellés de cette manière mais généralement réservés pour les applications à haute fiabilité comme dans les domaines militaire et spatial. Le présent essai est destructif. Cette deuxième édition annule et remplace la première édition parue en 2002, dont elle constitue une révision technique. Cette seconde édition a été complètement remaniée de manière à l'aligner sur le texte des dernières versions de la MIL-STD-750, méthode 1018 et la MIL-STD-883, méthode 1018. La modification principale est la suppression des deux méthodes alternatives, anciennement désignées méthode 2 et méthode 3.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 7. del: Merjenje količine notranje vlage in analiza drugih preostalih plinov

Ta mednarodni standard določa preskušanje in merjenje količine vodne pare in drugih plinov v atmosferi znotraj kovinskih ali keramičnih hermetično zaprtih elementov. Preskus se uporablja za merjenje kakovosti procesa zatesnitve in za zagotavljanje informacij o dolgoročni kemijski stabilnosti atmosfere v paketu. Velja za tako zatesnjene polprevodniške elemente, vendar se v splošnem uporablja samo za aplikacije, kjer je potrebna velika zanesljivost, na primer v vojski ali aeronavtiki. Ta preskus je porušitven.

General Information

• Status: Published
• Publication Date: 08-Sep-2011
• Withdrawal Date: 21-Jul-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 09-Sep-2011
• Completion Date: 09-Sep-2011
• Ref Project: SIST EN 60749-7:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

Relations

• Replaces: EN 60749-7:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2011
3ROSUHYRGQLãNLHOHPHQWL0HWRGH]DPHKDQVNRLQNOLPDWVNRSUHVNXãDQMHGHO
0HUMHQMHNROLþLQHQRWUDQMHYODJHLQDQDOL]DGUXJLKSUHRVWDOLKSOLQRY
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture
content measurement and the analysis of other residual gases
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung
des inneren Feuchtegehaltes und Analyse von anderen Restgasen
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7:
Mesure de la teneur en humidité interne et analyse des autres gaz résiduels
Ta slovenski standard je istoveten z: EN 60749-7:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60749-7
NORME EUROPÉENNE
September 2011
EUROPÄISCHE NORM
ICS 31.080.01 Supersedes EN 60749-7:2002

English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 7: Internal moisture content measurement and the analysis of other
residual gases
(IEC 60749-7:2011)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 7: Mesure de la teneur en humidité Teil 7: Messung des inneren
interne et analyse des autres gaz Feuchtegehaltes und Analyse von
résiduels anderen Restgasen
(CEI 60749-7:2011) (IEC 60749-7:2011)

This European Standard was approved by CENELEC on 2011-07-22. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-7:2011 E
Foreword
The text of document 47/2087/FDIS, future edition 2 of IEC 60749-7, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-7 on 2011-07-22.
This European Standard supersedes EN 60749-7:2002.
The main change is the removal of the two alternative methods formerly designated method 2 and
method 3.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2012-04-22
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-07-22
__________
Endorsement notice
The text of the International Standard IEC 60749-7:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60749-8 NOTE  Harmonized as EN 60749-8.
__________
IEC 60749-7 ®
Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 7: Internal moisture content measurement and the analysis of other residual
gases
Dispositifs à semiconducteurs – Méthodes essais mécaniques et climatiques –
Partie 7: Mesure de la teneur en humidité interne et analyse des autres gaz
résiduels
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.01 ISBN 978-2-88912-532-6

– 2 – 60749-7  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
4.1 Mass spectrometer method . 5
4.2 Mass spectrometer . 5
4.2.1 Spectra range . 5
4.2.2 Detection limit . 6
4.2.3 System calibration . 6
4.2.4 Calibration for other gases . 6
4.2.5 Daily calibration check . 7
4.2.6 Substitution . 7
4.2.7 Precision tuning . 7
4.2.8 Record keeping . 7
4.3 Vacuum opening chamber . 7
4.4 Piercing arrangement . 7
4.5 Pressure-sensing device . 7
5 Procedure . 8
6 Failure criteria . 9
7 Implementation . 9
8 Summary . 10
Bibliography . 11

60749-7  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 7: Internal moisture content measurement
and the analysis of other residual gases

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-7 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002 and constitutes a
technical revision. This second edition has been completely re-written so as to align it with the
text of the latest versions of MIL-STD-750, method 1018 and MIL-STD-883, method 1018.
The main change is the removal of the two alternative methods formerly designated method 2
and method 3.
– 4 – 60749-7  IEC:2011
The text of this standard is based on the following documents:
FDIS Report on voting
47/2087/FDIS 47/2098/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60749-7  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 7: Internal moisture content measurement
and the analysis of other residual gases

1 Scope
This International Standard specifies the testing and measurement of water vapour and other
gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test
is used as a measure of the quality of the sealing process and to provide information about
the long-term chemical stability of the atmosphere inside the package. It is applicable to
semiconductor devices sealed in such a manner but generally only used for high reliability
applications such as military or aerospace. This test is destructive.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
None
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
parts per million by volume
ppmv
the concentration of one substance in another substance expressed as a ratio of parts of the
one substance in a million parts of the other substance, measured by volume
4 Test apparatus
4.1 Mass spectrometer method
This method measures the water vapour content of the device atmosphere by mass spectro-
metry.
...