FprEN IEC 60749-21:2025
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749‑15 or IEC 60749‑20. NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69. This edition includes the following significant technical changes with respect to the previous edition: - revision to certain operating conditions in line with current working practices.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 21: Brasabilité
L’IEC 60749-21:2025 établit une procédure normalisée pour déterminer la brasabilité des connexions de sortie des boîtiers de dispositifs qui sont destinées à être fixées sur une autre surface en utilisant de la brasure étain-plomb (SnPb) ou sans plomb pour réaliser cette fixation. Cette méthode d’essai décrit une procédure pour les essais de brasabilité par "immersion et examen visuel" des composants pour montage en surface (CMS), par trous traversants et axial, ainsi qu’une procédure facultative d’essai de brasabilité pour des CMS pour montage en surface sur carte, afin de permettre la simulation du processus de brasage devant être utilisé dans l’application du dispositif. La méthode d’essai fournit également des conditions optionnelles pour le vieillissement. Cet essai est considéré comme destructif, sauf indication contraire dans la spécification applicable. NOTE 1 Cette méthode d’essai n'évalue pas l’effet des contraintes thermiques qui peuvent se produire pendant la procédure de brasage. De plus amples détails sont fournis dans l’IEC 60749-15 ou l’IEC 60749-20. NOTE 2 Si la préférence est donnée à une méthode d'essai qualitative, la méthode d'essai de la balance de mouillage peut être consultée dans l'IEC 60068-2-69. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - révision de certaines conditions de fonctionnement en rapport avec les pratiques de travail actuelles.
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 21. del: Spajkljivost
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Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 60749-21:2025
01-januar-2025
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 21. del:
Spajkljivost
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie
21: Brasabilité
Ta slovenski standard je istoveten z: prEN IEC 60749-21:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
oSIST prEN IEC 60749-21:2025 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
oSIST prEN IEC 60749-21:2025
oSIST prEN IEC 60749-21:2025
47/2862/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60749-21 ED3
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-09-06 2024-11-29
SUPERSEDES DOCUMENTS:
47/2857/RR
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
This document is still under study and subject to change. It should not be used for reference purposes.
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Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You
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oSIST prEN IEC 60749-21:2025
47/2862/CDV – 2 – IEC CDV 60749-21 © IEC 2024
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Test apparatus . 6
3.1 Solder bath. 6
3.2 Dipping device. 6
3.3 Optical equipment . 7
3.4 Steam ageing equipment . 7
3.5 Lighting equipment . 7
3.6 Materials . 7
3.6.1 Flux . 7
3.6.2 Solder . 8
3.7 SMD reflow equipment . 8
3.7.1 Stencil or screen . 8
3.7.2 Rubber squeegee or metal spatula . 8
3.7.3 Test substrate . 9
3.7.4 Solder paste . 9
3.7.5 Reflow equipment . 9
3.7.6 Flux removal solvent . 10
4 Procedure . 10
4.1 Lead-free backward compatibility . 10
4.2 Preconditioning . 10
4.2.1 General . 10
4.2.2 Preconditioning by steam ageing . 10
4.2.3 Preconditioning by high temperature storage . 11
4.3 Procedure for dip and look solderability testing . 11
4.3.1 General . 11
4.3.2 Solder dip conditions . 11
4.3.3 Procedure . 12
4.4 Procedure for simulated board mounting reflow solderability testing of SMDs . 19
4.4.1 General . 19
4.4.2 Test equipment set-up . 19
4.4.3 Specimen preparation and surface condition . 20
4.4.4 Visual inspection . 21
5 Summary . 21
Bibliography . 22
Figure 1 – Areas to be inspected for gullwing packages . 15
Figure 2 – Areas to be inspected for J-lead packages . 16
Figure 3 – Areas to be inspected in rectangular components (SMD method) . 17
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) . 18
Figure 5 – Flat peak type reflow profile . 20
Table 1 – Steam ageing conditions . 10
Table 2 – Altitude versus steam temperature . 11
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Table 3 – Solder dip test conditions . 11
Table 4 – Maximum limits of solder bath contaminant . 13
oSIST prEN IEC 60749-21:2025
47/2862/CDV – 4 – IEC CDV 60749-21 © IEC 2024
1 INTERNATIONAL ELECTROTECHNICAL COMMISSION
2 ____________
4 SEMICONDUCTOR DEVICES –
5 MECHANICAL AND CLIMATIC TEST METHODS –
7 Part 21: Solderability
10 FOREWORD
11 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
12 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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40 Publications.
41 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
42 indispensable for the correct application of this publication.
43 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
44 patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
45 International Standard IEC 60749-21 has been prepared by IEC technical committee 47:
46 Semiconductor devices.
47 This standard cancels and replaces the second edition published in 2011 and constitutes a
48 technical revision. The significant change is revision to certain operating conditions in line
49 with current working practices.
50 The text of this standard is based on the following documents:
FDIS Report on voting
47/XXXX/FDIS 47/YYYY/RVD
52 Full information on the voting for the approval of this standard can be found in the report on
53 voting indicated in the above table.
oSIST prEN IEC 60749-21:2025
IEC CDV 60749-21 © IEC 2024 – 5 – 47/2862/CDV
54 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
55 A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
56 Mechanical and climatic test methods can be found on the IEC website.
57 The committee has decided that the contents of this publication will remain unchanged until
58 the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
59 related to the specific publication. At this date, the publication will be
60 • reconfirmed,
61 • withdrawn,
62 • replaced by a revised edition, or
63 • amended.
oSIST prEN IEC 60749-21:2025
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66 SEMICONDUCTOR DEVICES –
67 MECHANICAL AND CLIMATIC TEST METHODS –
69 Part 21: Solderability
73 1 Scope
74 This part of IEC 60749 establishes a standard procedure for determining the solderability of
75 device package terminations that are intended to be joined to another surface using tin -lead
76 (SnPb) or lead-free (Pb-free) solder for the attachment.
77 This test method provides a procedure for ‘dip and look’ solderability testing of through hole,
78 axial and surface mount devices (SMDs) as well as an optional procedure for a board
79 mounting solderability test for SMDs for the purpose of allowing simulation of the soldering
80 process to be used in the device application. The test method also provides optional
81 conditions for ageing.
82 This test is considered destructive unless otherwise detailed in the relevant specification.
83 NOTE 1 This test method does not assess the effect of thermal stresses which may occur during the soldering
84 process. Reference should be made IEC 60749-15 or IEC 60749-20.
85 2 Normative references
86 The following referenced documents are indispensable for the application of this document.
87 For dated references, only the edition cited applies. For undated references, the latest edition
88 of the referenced document (including any amendments) applies.
89 IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements
90 for soldering pastes for high-quality interconnects in electronics assembly
91 IEC 61190-1-3:2018, Attachment materials for electronic assembly – Part 1-3: Requirements
92 for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
93 soldering applications
94 3 Test apparatus and materials
95 3.1 Solder bath
96 The solder bath shall be not less than 40 mm in depth and not less than 300 ml in volume
97 such that it can contain at least 1 kg of solder. The apparatus shall be capable of maintaining
98 the solder at the specified temperature within 5 °C. The solder in solder baths used for
99 solderability testing shall be analysed or replaced to ensure that the composition complies
100 with 3.6.2
102 3.2 Dipping device
103 A mechanical dipping device capable of controlling the rates of immersion and emersion of
104 the terminations and providing a dwell time (time of total immersion to the required depth) in
105 the solder bath as specified shall be used.
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106 3.3 Optical equipment
107 An optical microscope capable of providing magnification inspection from 10 to 20 shall be
108 used.
109 3.4 Steam ageing equipment
110 A non-corrodible container and cover of sufficient size to allow the placement of specimens
111 inside the vessel shall be used. The specimens shall be placed such that the lowest portion of
112 the specimen is a minimum of 40 mm above the surface of the water. A suitable method of
113 supporting the specimens shall be improvised using non-contaminating material.
114 NOTE During steam ageing, the test devices should be located in a manner so as to prevent water (steam
115 condensate) from dripping on them.
116 3.5 Lighting equipment
117 A lighting system shall be used that will provide a uniform, non-glare, non-directional
118 illumination of the specimen.
119 3.6 Materials
120 3.6.1 Flux
121 Unless otherwise detailed in the relevant specification, the flux for SnPb solderability tests shall
122 be a standard activated rosin flux (type ROL1 in accordance with IEC 61190-1-3 (2018), Table
123 2, Flux type and designating symbols) having a composition of 25 % 0,5 % by weight of
124 colophony and 0,15 % 0,01 % by weight diethylammonium hydrochloride, in 74,85 %
125 0,5 % by weight of in 2-propanol (isopropanol). The specific gravity of the standard activated
126 rosin flux shall be 0,843 0,005 at 25 °C 2 °C.
127 The specification shall be as follows:
128 Colophony
129 Colour To WW colour specification or paler
130 Acid value (mg KOH/g colophony) 155 (minimum)
131 Softening point (ball and ring) 70 °C (minimum)
132 Flow point (Ubbelohde) 76 °C (minimum)
133 Ash 0,05 % (maximum)
134 Solubility A solution of the colophony in an equal part by weight
135 of 2-propanol (isopropanol) shall be clear, and after a
136 week at room temperature there shall be no sign of a
137 deposit.
138 2-propanol (isopropanol)
139 Purity Minimum 99,5 % 2-propanol (isopropanol) by weight
140 Acidity as acetic acid Maximum 0,002 % weight (other than carbon dioxide)
141 Non-volatile matter Maximum 2 mg per 100 ml.
142 Unless otherwise detailed in the relevant specification, the flux for Pb-free solderability tests
143 shall be standard activated rosin flux having a composition of 25% ± 0.5% by weight of
144 colophony and 0.39% ± 0.01% by weight diethylammonium hydrochloride, in 74.61% ± 0.5%
145 by weight of isopropyl
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147 3.6.2 Solder
148 3.6.2.1 Tin-lead
149 Unless otherwise detailed in the relevant specification, the solder specification for SnPb shall
150 be as follows:
151 Chemical composition
152 The composition in percentage by weight shall be as follows:
153 Tin 59 % to 61 %
154 Antimony 0,5 % maximum
155 Copper 0,1 % maximum
156 Arsenic 0,05 % maximum
157 Iron 0,02 % maximum
158 Lead the remainder.
159 The solder shall not contain such impurities as aluminium, zinc or cadmium in amounts which
160 will adversely affect the properties of the solder.
161 Melting temperature range
162 The melting temperature range of the 60 % solder is as follows:
163 Completely solid 183 °C
164 Completely liquid 188 °C.
165 3.6.2.2 Lead-free
166 Unless otherwise detailed in the relevant specification, the solder specification for Pb -free
167 shall be as follows:
168 The composition in percentage by weight shall be as follows:
169 Tin 95 % to 96,5 %
170 Silver 3 % to 4 %
171 Copper 0,5 % to 1 %.
172 3.7 SMD reflow equipment
173 3.7.1 Stencil or screen
174 A stencil or screen with pad geometry opening that is appropriate for the terminals being
175 tested. Unless otherwise agreed upon between vendor and user, nominal stencil thickness
176 should be 0,1 mm for terminals with less than 0,5 mm component lead pitch, 0,15 mm for a
177 component with lead pitch of 0,5 mm to 0,65 mm and 0,2 mm for a component with lead pitch
178 greater than 0,65 mm.
179 3.7.2 Rubber squeegee or metal spatula
180 Solder paste shall be applied on to the stencil or screen using a spatula for fine pitch or a
181 squeegee for standard pitch.
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182 3.7.3 Test substrate
183 SMD specimens for simulated board mounting reflow solderability testing shall be evaluated
184 using a substrate.
185 NOTE 1 A ceramic (alumina 90 % - 98 %) may be used for all reflow requirements.
186 NOTE 2 A glass epoxy substrate may be used for all reflow requirements. The glass epoxy substrate should be
187 capable of withstanding the soldering temperature (e.g. it is not suitable for hot plate soldering).
188 NOTE 3 For visual inspection of the tested device terminations, the test substrate should be unmetallized (no
189 lands).
190 3.7.4 Solder paste
191 Unless otherwise specified, the composition of the solder paste shall be as follows.
192 3.7.4.1 Pb-containing paste
193 The solder composition shall be as specified in 3.6.2.
194 Unless otherwise specified in the relevant specification, the particle size of the solder powder
195 shall be 20 µm to 45 µm.
196 The composition of the flux shall be as specified in 3.6.1.
197 The viscosity range of the solder paste and method of measurement shall be detailed in the
198 relevant specification.
199 3.7.4.2 Pb-free paste
200 The solder composition shall be as specified in 3.6.2.
201 The solder powder size shall be 4 as defined in Table 2 of IEC 61190-1-2:2014, viz:
202 – less than 0,5 %, larger than 50 m;
203 – 10 % maximum, between 38 m and 50 m;
204 – 80 % minimum, between 20 m and 40 m;
205 – less than 10 %, smaller than 20 m.
206 The shape of solder powder shall be spherical.
207 The flux to be used shall
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