prEN IEC 60749-21:2024
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 21: Brasabilité
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 21. del: Spajkljivost
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Standards Content (Sample)
SLOVENSKI STANDARD
01-januar-2025
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 21. del:
Spajkljivost
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie
21: Brasabilité
Ta slovenski standard je istoveten z: prEN IEC 60749-21:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
47/2862/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60749-21 ED3
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-09-06 2024-11-29
SUPERSEDES DOCUMENTS:
47/2857/RR
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You
may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without permis sion in
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47/2862/CDV – 2 – IEC CDV 60749-21 © IEC 2024
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Test apparatus . 6
3.1 Solder bath. 6
3.2 Dipping device. 6
3.3 Optical equipment . 7
3.4 Steam ageing equipment . 7
3.5 Lighting equipment . 7
3.6 Materials . 7
3.6.1 Flux . 7
3.6.2 Solder . 8
3.7 SMD reflow equipment . 8
3.7.1 Stencil or screen . 8
3.7.2 Rubber squeegee or metal spatula . 8
3.7.3 Test substrate . 9
3.7.4 Solder paste . 9
3.7.5 Reflow equipment . 9
3.7.6 Flux removal solvent . 10
4 Procedure . 10
4.1 Lead-free backward compatibility . 10
4.2 Preconditioning . 10
4.2.1 General . 10
4.2.2 Preconditioning by steam ageing . 10
4.2.3 Preconditioning by high temperature storage . 11
4.3 Procedure for dip and look solderability testing . 11
4.3.1 General . 11
4.3.2 Solder dip conditions . 11
4.3.3 Procedure . 12
4.4 Procedure for simulated board mounting reflow solderability testing of SMDs . 19
4.4.1 General . 19
4.4.2 Test equipment set-up . 19
4.4.3 Specimen preparation and surface condition . 20
4.4.4 Visual inspection . 21
5 Summary . 21
Bibliography . 22
Figure 1 – Areas to be inspected for gullwing packages . 15
Figure 2 – Areas to be inspected for J-lead packages . 16
Figure 3 – Areas to be inspected in rectangular components (SMD method) . 17
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) . 18
Figure 5 – Flat peak type reflow profile . 20
Table 1 – Steam ageing conditions . 10
Table 2 – Altitude versus steam temperature . 11
IEC CDV 60749-21 © IEC 2024 – 3 – 47/2862/CDV
Table 3 – Solder dip test conditions . 11
Table 4 – Maximum limits of solder bath contaminant . 13
47/2862/CDV – 4 – IEC CDV 60749-21 © IEC 2024
1 INTERNATIONAL ELECTROTECHNICAL COMMISSION
2 ____________
4 SEMICONDUCTOR DEVICES –
5 MECHANICAL AND CLIMATIC TEST METHODS –
7 Part 21: Solderability
10 FOREWORD
11 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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21 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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40 Publications.
41 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
42 indispensable for the correct application of this publication.
43 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
44 patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
45 International Standard IEC 60749-21 has been prepared by IEC technical committee 47:
46 Semiconductor devices.
47 This standard cancels and replaces the second edition published in 2011 and constitutes a
48 technical revision. The significant change is revision to certain operating conditions in line
49 with current working practices.
50 The text of this standard is based on the following documents:
FDIS Report on voting
47/XXXX/FDIS 47/YYYY/RVD
52 Full information on the voting for the approval of this standard can be found in the report on
53 voting indicated in the above table.
IEC CDV 60749-21 © IEC 2024 – 5 – 47/2862/CDV
54 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
55 A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
56 Mechanical and climatic test methods can be found on the IEC website.
57 The committee has decided that the contents of this publication will remain unchanged until
58 the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
59 related to the specific publication. At this date, the publication will be
60 • reconfirmed,
61 • withdrawn,
62 • replaced by a revised edition, or
63 • amended.
47/2862/CDV – 6 – IEC CDV 60749-21 © IEC 2024
66 SEMICONDUCTOR DEVICES –
67 MECHANICAL AND CLIMATIC TEST METHODS –
69 Part 21: Solderability
73 1 Scope
74 This part of IEC 60749 establishes a standard procedure for determining the solderability of
75 device package terminations that are intended to be joined to another surface using tin -lead
76 (SnPb) or lead-free (Pb-free) solder for the attachment.
77 This test method provides a procedure for ‘dip and look’ solderability testing of through hole,
78 axial and surface mount devices (SMDs) as well as an optional procedure for a board
79 mounting solderability test for SMDs for the purpose of allowing simulation of the soldering
80 process to be used in the device application. The test method also provides optional
81 conditions for ageing.
82 This test is considered destructive unless otherwise detailed in the relevant specification.
83 NOTE 1 This test method does not assess the effect of thermal stresses which may occur during the soldering
84 process. Reference should be made IEC 60749-15 or IEC 60749-20.
85 2 Normative references
86 The following referenced documents are indispensable for the application of this document.
87 For dated references, only the edition cited applies. For undated references, the latest edition
88 of the referenced document (including any amendments) applies.
89 IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements
90 for soldering pastes for high-quality interconnects in electronics assembly
91 IEC 61190-1-3:2018, Attachment materials for electronic assembly – Part 1-3: Requirements
92 for electronic grade solder alloys and fluxed a
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