Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. IEC 62047-4:2008 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.

Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 4: Fachgrundspezifikation für Mikrosystemtechnik

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4: Spécification générique pour les MEMS

La CEI 62047-4:2008 décrit des spécifications génériques pour les systèmes électromécaniques microminiaturisés (MEMS, Micro-Electro Mechanical Systems) faits à partir de semi-conducteurs, constituant la base des spécifications présentées dans d'autres parties de cette série pour différents types d'applications basées sur des MEMS, telles que des capteurs et les MEMS-RF, à l'exclusion des MEMS optiques, des bio-MEMS, des micro-TAS et des MEMS de puissance. Cette norme spécifie les procédures générales d'évaluation de la qualité à utiliser dans le système IECQ-CECC et établit les principes généraux nécessaires pour décrire et tester les caractéristiques électriques, optiques, mécaniques et environnementales. La CEI 62047-4:2008 contribue à la préparation de normes servant à définir des dispositifs et des systèmes fabriqués par des techniques de micro-usinage, incluant, mais sans s'y limiter, la caractérisation et la manipulation des matériaux, l'assemblage et les essais, les méthodes de mesure et de commande de processus. Les MEMS décrits dans cette norme sont essentiellement constitués de matériaux semi-conducteurs. Toutefois, les déclarations faites dans cette norme peuvent également être appliquées aux MEMS utilisant des matériaux autres que des semi-conducteurs, par exemple, des polymères, du verre, des métaux et des matériaux en céramiques.

Polprevodniški elementi - Mikroelektromehanski elementi - 4. del: Osnovne specifikacije za MEMS (IEC 62047-4:2008)

Ta del IEC 62047 opisuje osnovne specifikacije za mikroelektromehanske sisteme (MEMS), izdelane iz polprevodnikov, ki so osnova za specifikacije, podane v drugih delih te serije za različne vrste MEMS naprav, kot so senzorji, radiofrekvenčni RF MEMS, z izjemo optičnih MEMS, bio MEMS, mikro TAS, in močnostnih MEMS. Ta standard podaja splošne postopke za ocenjevanje kakovosti, ki se uporabljajo v sistemih IECQ-CECC ter vzpostavlja splošna načela za opisovanje in preskušanje električnih, optičnih, mehanskih in okoljskih značilnosti. Ta del IEC 62047 je v pomoč pri pripravi standardov, ki določajo naprave in sisteme, izdelane s tehnologijo mikroobdelave, vključno z, a ne omejene na lastnosti materialov in rokovanje, sestavljanje in preskušanje, nadzor postopka in metode merjenja. MEMS, opisani v tem standardu, so v osnovi izdelani iz polprevodniškega materiala. Vendar pa navedbe v tem standardu veljajo tudi za MEMS, ki uporabljajo druge materiale razen polprevodniških, na primer polimere, steklo, kovine in keramične materiale.

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Polprevodniški elementi - Mikroelektromehanski elementi - 4. del: Osnovne
specifikacije za MEMS (IEC 62047-4:2008)
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification
for MEMS (IEC 62047-4:2008)
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 4:
Fachgrundspezifikation für Mikrosystemtechnik (IEC 62047-4:2008)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4:
Spécification générique pour les MEMS (CEI 62047-4:2008)
Ta slovenski standard je istoveten z: EN 62047-4:2010
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EN 62047-4
October 2010
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 4: Generic specification for MEMS
(IEC 62047-4:2008)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauteile der Mikrosystemtechnik -
Partie 4: Spécification générique pour les Teil 4: Fachgrundspezifikation für
MEMS Mikrosystemtechnik
(CEI 62047-4:2008) (IEC 62047-4:2008)

This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-4:2010 E
The text of document 47/1975/FDIS, future edition 1 of IEC 62047-4, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-4 on 2010-10-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-07-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-10-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
Endorsement notice
The text of the International Standard IEC 62047-4:2008 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60721-3-0 NOTE  Harmonized as EN 60721-3-0.
IEC 60721-3-1 NOTE  Harmonized as EN 60721-3-1.
- 3 - EN 62047-4:2010
Annex ZA
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
Publication Year Title EN/HD Year

IEC 60027 Series Letter symbols to be used in electrical EN 60027 Series
IEC 60068-2 Series Environmental testing - EN 60068-2 Series
Part 2: Tests
IEC 60617 - Graphical symbols for diagrams - -

IEC 60747-1 2006 Semiconductor devices - - -
Part 1: General
IEC 60749 Series Semiconductor devices - Mechanical and EN 60749 Series
climatic test methods
IEC 61193-2 - Quality assessment systems - EN 61193-2 -
Part 2: Selection and use of sampling plans
for inspection of electronic components and
IEC 62047-1 - Semiconductor devices - EN 62047-1 -
Micro-electromechanical devices -
Part 1: Terms and definitions
IEC QC 001002-3 2005 IEC Quality Assessment System for Electronic - -
Components (IECQ) - Rules of Procedure -
Part 3: Approval procedures
ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units

ISO 2859-1 - Sampling procedures for inspection by - -
attributes -
Part 1: Sampling schemes indexed by
acceptance quality limit (AQL) for lot-by-lot
IEC 62047-4
Edition 1.0 2008-08
Semiconductor devices – Micro-electromechanical devices –
Part 4: Generic specification for MEMS

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 4: Spécification générique pour les MEMS

ICS 31.080.99 ISBN 2-8318-9968-0
– 2 – 62047-4 © IEC:2008
1 Scope.5
2 Normative references .5
3 Terms, definitions, units and symbols .6
4 Standard environmental conditions.7
5 Marking .7
5.1 Device identification .7
5.2 Device traceability.7
5.3 Packing .7
6 Quality assessment procedures.7
6.1 General .7
6.1.1 Eligibility for qualification and/or capability approval .7
6.1.2 Primary stage of manufacture.7
6.1.3 Formation of inspection lots.7
6.1.4 Structurally similar device.7
6.1.5 Subcontracting .8
6.1.6 Incorporated components .8
6.1.7 Validity of release.8
6.2 Qualification approval procedure .8
6.2.1 Qualification approval testing.8
6.2.2 Environmental and climatic tests .8
6.2.3 Granting of qualification approval .8
6.2.4 Statistical sampling procedures .11
6.2.5 Endurance tests .11
6.2.6 Endurance tests where the failure rate is specified .11
6.2.7 Accelerated test procedures .12
7 Test and measurement procedures.12
7.1 Standard conditions and general precautions .12
7.1.1 Standard conditions.12
7.1.2 General precautions .13
7.1.3 Precision of measurements .13
7.2 Physical examination.13
7.2.1 Visual examination .13
7.2.2 Dimensions .13
7.3 Climatic and mechanical tests .13
7.4 Alternative test methods .13
Annex A (normative) Sampling procedures .14
Annex B (informative) Classification for MEMS technologies and devices .15

Table 1 – MEMS categories and terms.6
Table 2 – Subgrouping for Group B and Group C .10

62047-4 © IEC:2008 – 3 –

Part 4: Generic specification for MEMS

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