EN 62258-2:2011

Semiconductor die products - Part 2: Exchange data formats

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate

Produits de puces de semiconducteurs - Partie 2: Formats d'échange de données

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov

Ta del IEC 62258 določa podatkovne formate, ki se lahko uporabljajo pri izmenjavi podatkov, ki jo zajemajo drugi deli serije IEC 62258, in definicije vseh parametrov, ki se uporabljajo v skladu z načeli in metodami IEC 61360. Vpeljuje format izmenjave podatkov med napravami (DDX), katerega glavni namen je olajšati prenos ustreznih geometrijskih podatkov med proizvajalcem polprevodnikov in uporabnikom CAD/CAE, ter modele formalnih informacij, ki omogočajo izmenjavo podatkov v drugih formatih, kot je format fizične datoteke STEP, v skladu z ISO 10303-21, in XML. Podatkovni format je namenoma prožen, da omogoča uporabo zunaj tega začetnega obsega. Razvit je bil zato, da bi se olajšale proizvodnja, dobava in uporaba polprevodniških čipov, ki med drugim vključujejo: - ploščice, - posamične nepokrite čipe, - čipe in ploščice s pritrjenimi povezovalnimi strukturami, - minimalno ali delno inkapsulirane čipe in ploščice. Ta standard odraža podatkovni format DDX v različici 1.3.0.

General Information

• Status: Published
• Publication Date: 07-Jul-2011
• Withdrawal Date: 28-Jun-2014
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 08-Jul-2011
• Completion Date: 08-Jul-2011
• Ref Project: SIST EN 62258-2:2011 - Semiconductor die products - Part 2: Exchange data formats

Relations

• Replaces: EN 62258-2:2005 - Semiconductor die products - Part 2: Exchange data formats
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2011
Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov
Semiconductor die products - Part 2: Exchange data formats
Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate
Produits à puce de semi-conducteur - Partie 2: Formats de données d'échange
Ta slovenski standard je istoveten z: EN 62258-2:2011
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62258-2
NORME EUROPÉENNE
July 2011
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes EN 62258-2:2005

English version
Semiconductor die products -
Part 2: Exchange data formats
(IEC 62258-2:2011)
Produits de puces de semiconducteurs -  Halbleiter-Chip-Erzeugnisse -
Partie 2: Formats d'échange de données Teil 2: Datenaustausch-Formate
(CEI 62258-2:2011) (IEC 62258-2:2011)

This European Standard was approved by CENELEC on 2011-06-29. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-2:2011 E
Foreword
The text of document 47/2085/FDIS, future edition 2 of IEC 62258-2, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-2 on 2011-06-29.
This European Standard supersedes EN 62258-2:2005.
With respect to EN 62258-2:2005, the following parameters have been updated for EN 62258-2:2011:

Subclause Parameter name
DEVICE_PICTURE_FILE
8.2.9
DEVICE_DATA_FILE
8.2.10
TERMINAL_GROUP
8.4.6
PERMUTABLE
8.4.7
TERMINAL_MATERIAL
8.5.1
(was DIE_TERMINAL_MATERIAL)
TERMINAL_MATERIAL_STRUCTURE
8.5.2
MAX_TEMP_TIME
8.6.2
SIMULATOR_simulator_TERM_GROUP
8.7.6
ASSEMBLY
8.8.3
WAFER_THICKNESS
8.9.2
WAFER_THICKNESS_TOLERANCE
8.9.3
WAFER_INK
8.9.9
BUMP_SHAPE
8.10.4
BUMP_SIZE
8.10.5
BUMP_SPECIFICATION_DRAWING
8.10.6
BUMP_ATTACHMENT_METHOD
8.10.7
MPD_MSL_LEVEL
8.11.4
MPD_PACKAGE_DRAWING
8.11.5
QUALITY
8.12.1
TEST
8.12.2
TEXT
8.13.1
PARSE
8.14.1
This standard shall be read in conjunction with EN 62258-1.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2012-03-29
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-06-29
Annex ZA has been added by CENELEC.
__________
- 3 - EN 62258-2:2011
Endorsement notice
The text of the International Standard IEC 62258-2:2011 was approved by CENELEC as a European
Standard without any modification.
__________
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 61360-4 2005 Standard data element types with associated EN 61360-4 2005
classification scheme for electric components - + corr. December 2005
Part 4: IEC reference collection of standard
data element types and component classes

IEC 62258-1 - Semiconductor die products - EN 62258-1 -
Part 1: Procurement and use
ISO 6093 1985 Information processing - Representation of - -
numerical values in character strings for
information interchange
ISO 8601 2004 Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
ISO 10303-21 2002 Industrial automation systems and integration - -
- Product data representation and exchange -
Part 21: Implementation methods: Clear text
encoding of the exchange structure

IPC/JEDEC 2007 Handling, Packing, Shipping and Use of - -
J-STD-033B Moisture/Reflow Sensitive Surface Mount
Devices
IEC 62258-2 ®
Edition 2.0 2011-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor die products –
Part 2: Exchange data formats
Produits de puces de semiconducteurs –
Partie 2: Formats d'échange de données

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XB
ICS 31.080.99 ISBN 978-2-88912-496-1

– 2 – 62258-2 © IEC:2011
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope and object . 8
2 Normative references. 8
3 Terms and definitions . 9
4 Requirements . 9
5 Device Data eXchange format (DDX) file goals and usage. 9
6 DDX file format and file format rules . 9
6.1 Data validity . 10
6.2 Character set . 10
6.3 SYNTAX RULES . 10
7 DDX file content. 11
7.1 DDX file content rules . 11
7.1.1 Block structure . 11
7.1.2 Parameter types . 11
7.1.3 Data types . 11
7.1.4 Forward references . 12
7.1.5 Units . 12
7.1.6 Co-ordinate data . 12
7.1.7 Reserved words . 12
7.2 DDX DEVICE block syntax . 13
7.3 DDX data syntax . 14
8 Definitions of DEVICE block parameters . 14
8.1 BLOCK DATA . 15
8.1.1 DEVICE_NAME Parameter . 15
8.1.2 DEVICE_FORM Parameter . 16
8.1.3 BLOCK_VERSION Parameter . 16
8.1.4 BLOCK_CREATION_DATE Parameter . 16
8.1.5 VERSION Parameter . 16
8.2 DEVICE DATA . 16
8.2.1 DIE_NAME Parameter . 16
8.2.2 DIE_PACKAGED_PART_NAME Parameter . 16
8.2.3 DIE_MASK_REVISION Parameter . 17
8.2.4 MANUFACTURER Parameter . 17
8.2.5 DATA_SOURCE Parameter . 17
8.2.6 DATA_VERSION Parameter . 17
8.2.7 FUNCTION Parameter . 17
8.2.8 IC_TECHNOLOGY Parameter . 18
8.2.9 DEVICE_PICTURE_FILE Parameter . 18
8.2.10 DEVICE_DATA_FILE Parameter . 18
8.3 GEOMETRIC DATA . 19
8.3.1 GEOMETRIC_UNITS Parameter . 19
8.3.2 GEOMETRIC_VIEW Parameter . 19
8.3.3 GEOMETRIC_ORIGIN Parameter . 19
8.3.4 SIZE Parameter . 20
8.3.5 SIZE_TOLERANCE Parameter. 20

62258-2 © IEC:2011 – 3 –
8.3.6 THICKNESS Parameter . 21
8.3.7 THICKNESS_TOLERANCE Parameter . 21
8.3.8 FIDUCIAL_TYPE Parameter . 21
8.3.9 FIDUCIAL Parameter . 23
8.4 TERMINAL DATA . 24
8.4.1 TERMINAL_COUNT Parameter . 24
8.4.2 TERMINAL_TYPE_COUNT Parameter . 24
8.4.3 CONNECTION_COUNT Parameter . 24
8.4.4 TERMINAL_TYPE Parameter . 25
8.4.5 TERMINAL Parameter . 26
8.4.6 TERMINAL_GROUP Parameter . 29
8.4.7 PERMUTABLE Parameter . 31
8.5 MATERIAL DATA . 32
8.5.1 TERMINAL_MATERIAL Parameter . 32
8.5.2 TERMINAL_MATERIAL_STRUCTURE Parameter . 32
8.5.3 DIE_SEMICONDUCTOR_MATERIAL Parameter . 32
8.5.4 DIE_SUBSTRATE_MATERIAL Parameter . 33
8.5.5 DIE_SUBSTRATE_CONNECTION Parameter . 33
8.5.6 DIE_PASSIVATION_MATERIAL Parameter . 33
8.5.7 DIE_BACK_DETAIL Parameter . 34
8.6 ELECTRICAL AND THERMAL RATING DATA. 34
8.6.1 MAX_TEMP Parameter . 34
8.6.2 MAX_TEMP_TIME Parameter . 34
8.6.3 POWER_RANGE Parameter . 34
8.6.4 TEMPERATURE_RANGE Parameter . 34
8.7 SIMULATION
...