EN 62258-6:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Halbleiter-Chip-Erzeugnisse - Teil 6: Anforderungen für Angaben hinsichtlich der thermischen Simulation

Produits à puce de semi-conducteur - Partie 6: Exigences pour l'information concernant la simulation thermique

Izdelki iz polprevodniških čipov - 6. del: Zahteve za informacije v zvezi s termično simulacijo (IEC 622258-6:2006)

General Information

• Status: Published
• Publication Date: 14-Sep-2006
• Withdrawal Date: 31-Aug-2009
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 15-Sep-2006
• Completion Date: 15-Sep-2006
• Ref Project: SIST EN 62258-6:2007 - Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation

Standards Content (Sample)

6/29(16., 6,67(1

67$1'$5'
MDQXDU
,]GHONLL]SROSUHYRGQLãNLKþLSRYGHO=DKWHYH]DLQIRUPDFLMHY]YH]LV
WHUPLþQRVLPXODFLMR,(&
LVWRYHWHQ(1
6HPLFRQGXFWRUGLHSURGXFWV3DUW5HTXLUHPHQWVIRULQIRUPDWLRQFRQFHUQLQJ
WKHUPDOVLPXODWLRQ,(&
,&6 5HIHUHQþQDãWHYLOND

6,67(1HQ
!"#$%&’( )&!*+,%- .
EUROPEAN STANDARD
EN 62258-6
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes ES 59008-4-3:1999

English version
Semiconductor die products
Part 6: Requirements for information
concerning thermal simulation
(IEC 62258-6:2006)
Produits de matrice de semi-conducteur  Halbleiter-Chip-Erzeugnisse
Partie 6: Exigences pour l'information Teil 6: Anforderungen für Angaben
concernant la simulation thermique hinsichtlich der thermischen Simulation
(CEI 62258-6:2006) (IEC 62258-6:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-6:2006 E
Foreword
The text of document 47/1870/FDIS, future edition 1 of IEC 62258-6, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-6 on 2006-09-01.
This standard is to be used in conjunction with EN 62258-1 and EN 62258-2.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
(dow) 2009-09-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-6:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62258-6:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 62258-1 - Semiconductor die products EN 62258-1 2005
Part 1: Requirements for procurement and
use
1) 2)
IEC 62258-2 - Semiconductor die products EN 62258-2 2005
Part 2: Exchange data formats
1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 62258-6
First edition
2006-08
Semiconductor die products –
Part 6:
Requirements for information
concerning thermal simulation
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale J
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 62258-6  IEC:2006(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references .6
3 Terms and definitions.6
4 General .6
5 Requirements for information for thermal simulation .7
5.1 Requirements for bare die with or without added connection structures.7
5.2 Requirements for minimally-packaged die .7
5.3 Information on thermal simulation model .8

Bibliography.9

62258-6  IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 6: Requirements for information
concerning thermal simulation
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cite
...