EN 62047-26:2016
(Main)Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 26: Beschreibung und Messverfahren für Mikro-Rillen und Nadelstrukturen
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 26: Description et méthodes de mesure pour structures de microtranchées et de microaiguille
L'IEC 62047-26:2016 spécifie des descriptions de structures de tranchées et de structures d'aiguille à l'échelle micrométrique. En outre, elle donne des exemples de mesures de la géométrie des deux structures. Pour les structures de tranchées, la présente norme s'applique à des structures de profondeur comprise entre 1 µm et 100 µm, avec des parois et des tranchées de largeur comprise entre 5 µm et 150 µm et avec un rapport hauteur/largeur compris entre 0,006 7 et 20. Pour les structures d'aiguille, la norme s'applique à des structures à trois ou quatre faces dont la hauteur, la largeur horizontale et la largeur verticale sont supérieures ou égales à 2 µm, et dont les dimensions permettent de placer chaque structure dans un cube de 100 µm de côté. La présente norme s'applique à la conception structurelle de procédés MEMS et à leur appréciation géométrique.
Polprevodniški elementi - Mikroelektromehanski elementi - 26. del: Opis in merilne metode za mikrokanalske in iglaste strukture
Ta del standarda IEC 62047 določa opise kanalske in iglaste strukture v velikosti mikrometra. Poleg tega vsebuje primere merjenja za geometrijo obeh struktur. Pri kanalskih strukturah se ta standard uporablja za strukture z globino od 1 μm do 100 μm; zidove in kanale s širino od 5 μm do 150 μm; in razmerje med višino in širino od 0,0067 do 20. Pri iglastih strukturah se ta standard uporablja za strukture s tremi ali štirimi ploskvami z višino, vodoravno širino in navpično širino vsaj 2 μm in z dimenzijami, ki se prilegajo notranjosti kocke s stranicami 100 μm.
Ta standard se uporablja za strukturne zasnove MEMS in geometrično vrednotenje po postopkih MEMS.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-26:2016
01-julij-2016
Polprevodniški elementi - Mikroelektromehanski elementi - 26. del: Opis in merilne
metode za mikrokanalske in iglaste strukture
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and
measurement methods for micro trench and needle structures
Ta slovenski standard je istoveten z: EN 62047-26:2016
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-26:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 62047-26:2016
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SIST EN 62047-26:2016
EUROPEAN STANDARD EN 62047-26
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2016
ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices -
Part 26: Description and measurement methods for micro trench
and needle structures
(IEC 62047-26:2016)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 26: Description et Mikrosystemtechnik - Teil 26: Beschreibung und
méthodes de mesure pour structures de microtranchées et Messverfahren für Mikro-Rillen und Nadelstrukturen
de microaiguille (IEC 62047-26:2016)
(IEC 62047-26:2016)
This European Standard was approved by CENELEC on 2016-02-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-26:2016 E
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SIST EN 62047-26:2016
EN 62047-26:2016
European foreword
The text of document 47F/233/FDIS, future edition 1 of IEC 62047-26, prepared by SC 47F "Micro-
electromechanical systems", of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-
CENELEC parallel vote and approved by CENELEC as EN 62047-26:2016.
The following dates are fixed:
(dop) 2016-11-11
• latest date by which the document has to be implemented at
national level by publication of an identical national
standard or by endorsement
(dow) 2019-02-11
• latest date by which the national standards conflicting with
the document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-26:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
ISO 3274:1996 NOTE Harmonized as EN ISO 3274:1997 (not modified).
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SIST EN 62047-26:2016
IEC 62047-26
®
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
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Semiconductor devices – Micro-electromechanical devices –
Part 26: Description and measurement methods for micro trench and needle
structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 26: Description et méthodes de mesure pour structures de
microtranchées et de microaiguille
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ICS 31.080.99 ISBN 978-2-8322-3122-7
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