EN 62047-18:2013
(Main)Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe
Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18: Méthodes d’essai de flexion des matériaux en couche mince
La CEI 62047-18:2013 spécifie la méthode d'essai de flexion des matériaux en couche mince de longueur et largeur inférieures à 1 mm et d'épaisseur comprise entre 0,1 micrometre et 10 micrometre. La présente Norme Internationale spécifie les essais de flexion et la forme des éprouvettes d'essai pour des éprouvettes d'essai de type en porte-à-faux lisses microminiaturisés, qui garantissent une précision correspondant aux caractéristiques spéciales.
Polprevodniški elementi - Mikroelektromehanski elementi - 18. del: Metode za upogibno preskušanje tankoplastnih materialov (IEC 62047-18:2013)
Ta del standarda IEC 62047 določa upogibno preskušanje tankoplastnih materialov z dolžino in širino, manjšo od 1 mm, ter debelino med 0,1 in 10 μm. Tankoplastni materiali se uporabljajo kot glavni konstrukcijski materiali za mikroelektromehanske sisteme (s skrajšano oznako MEMS v tem dokumentu) in mikrostroje. Glavni konstrukcijski materiali za MEMS, mikrostroje itd. imajo posebne lastnosti, kot so velikost nekaj mikrometrov, izdelava materialov z nalaganjem, s fotolitografijo in/ali z nemehansko obdelanim preskusnim kosom. Ta mednarodni standard določa upogibno preskušanje in obliko gladkih konzolnih preskusnih kosov mikro velikosti, ki zagotavlja natančno skladnost s posebnimi lastnostmi.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-18:2014
01-maj-2014
Polprevodniški elementi - Mikroelektromehanski elementi - 18. del: Metode za
upogibno preskušanje tankoplastnih materialov (IEC 62047-18:2013)
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing
methods of thin film materials
/
Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18: Méthodes
d’essai de flexion des matériaux en couche mince
Ta slovenski standard je istoveten z: EN 62047-18:2013
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-18:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 62047-18:2014
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SIST EN 62047-18:2014
EUROPEAN STANDARD
EN 62047-18
NORME EUROPÉENNE
September 2013
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 18: Bend testing methods of thin film materials
(IEC 62047-18:2013)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Dispositif microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 18: Méthodes d’essai de flexion des Teil 18: Biegeprüfverfahren für
matériaux en couche mince Dünnschichtwerkstoffe
(CEI 62047-18:2013) (IEC 62047-18:2013)
This European Standard was approved by CENELEC on 2013-08-21. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-18:2013 E
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SIST EN 62047-18:2014
EN 62047-18:2013 - 2 -
Foreword
The text of document 47F/155/FDIS, future edition 1 of IEC 62047-18, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-18:2013.
The following dates are fixed:
(dop) 2014-05-21
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-08-21
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-18:2013 was approved by CENELEC as a European
Standard without any modification.
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SIST EN 62047-18:2014
- 3 - EN 62047-18:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 62047-6 2009 Semiconductor devices - Micro- EN 62047-6 2010
electromechanical devices -
Part 6: Axial fatigue testing methods
of thin film materials
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