EN 60191-6-22:2013

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Mechanische Normung von Halbleiterbauelementen - Teil 6-22: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Halbleitergehäuse Si-Feinraster-Ball-Grid-Array und Si-Feinraster-Land-Grid-Array (S-FBGA und S-FLGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-22: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels à billes et à pas fins en silicium et boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FBGA et S-FLGA)

La CEI 60191-6-22:2012 fournit les dessins d'encombrement et les dimensions associées, communs aux structures et matériaux des boîtiers en silicium des boîtiers matriciels à billes (BGA, ball grid array) et des boîtiers matriciels à zone de contact plate (LGA, land grid array).

Standardizacija mehanskih lastnosti polprevodniških elementov - 6-22. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Vodilo za oblikovanje okrovov polprevodnikov s finim rastrom mreže krogličastih priključkov na siliciju (S-FBGA) in finim rastrom mreže priključkov v ravnini na siliciju (S-FLGA)

V tem delu standarda IEC 60191 sotehnične risbe in mere za strukture silikonskih okrovov in materiale okrovov mrež krogličastih priključkov (BGA) in mrež priključkov v ravnini (LGA).

General Information

• Status: Published
• Publication Date: 14-Mar-2013
• Withdrawal Date: 14-Jan-2016
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 15-Mar-2013
• Completion Date: 15-Mar-2013
• Ref Project: SIST EN 60191-6-22:2013 - Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-22:2013
01-junij-2013
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRYGHO
6SORãQDSUDYLOD]DSULSUDYRWHKQLþQLKULVERNURYRYSROSUHYRGQLãNLKHOHPHQWRY]D
SRYUãLQVNRPRQWDåR9RGLOR]DREOLNRYDQMHRNURYRYSROSUHYRGQLNRYVILQLP
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SULNOMXþNRYYUDYQLQLQDVLOLFLMX6)/*$
Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon
Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
/
/
Ta slovenski standard je istoveten z: EN 60191-6-22:2013
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60191-6-22:2013 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-22:2013

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SIST EN 60191-6-22:2013

EUROPEAN STANDARD
EN 60191-6-22

NORME EUROPÉENNE
March 2013
EUROPÄISCHE NORM

ICS 31.080.01


English version

Mechanical standardization of semiconductor devices -
Part 6-22: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages -
Design guide for semiconductor packages Silicon Fine-pitch Ball Grid
Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
(IEC 60191-6-22:2012)

Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 6-22: Règles générales pour la Teil 6-22: Allgemeine Regeln für die
préparation des dessins d'encombrement Erstellung von Gehäusezeichnungen von
des dispositifs à semiconducteurs à SMD-Halbleitergehäusen -
montage en surface - Konstruktionsleitfaden für
Guide de conception pour les boîtiers Halbleitergehäuse Si-Feinraster-Ball-Grid-
matriciels à billes et à pas fins en silicium Array und Si-Feinraster-Land-Grid-Array
et boîtiers matriciels à zone de contact (S-FBGA und S-FLGA)
plate et à pas fins en silicium (IEC 60191-6-22:2012)
(S-FBGA et S-FLGA)
(CEI 60191-6-22:2012)

This European Standard was approved by CENELEC on 2013-01-15. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-22:2013 E

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SIST EN 60191-6-22:2013
EN 60191-6-22:2013 - 2 -

Foreword
The text of document 47D/812/CDV, future edition 1 of IEC 60191-6-22, prepared by SC 47D,
"Semiconductor packaging", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 60191-6-22:2013.
The following dates are fixed:
(dop) 2013-10-15
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2016-01-15
• latest date by which the national
standards conflicting with the

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 60191-6-22:2012 was approved by CENELEC as a European
Standard without any modification.
In the official
...