EN 61760-4:2015

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation, Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile

Technique du montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité

L'IEC 61760-4:2015 spécifie la classification des dispositifs sensibles à l'humidité en niveaux de sensibilité liés à la chaleur de brasage, ainsi que les dispositions relatives à l'emballage, l'étiquetage et la manipulation. La présente partie de l'IEC 61760 étend les méthodes de classification et d'emballage à ces composants lorsque les normes existantes ne sont pas exigées ou sont inappropriées. Dans ce cas, la présente norme introduit des niveaux de sensibilité à l'humidité supplémentaires ainsi qu'une méthode d'emballage alternative. La présente norme s'applique aux appareils destinés au brasage par refusion, tels que les composants pour montage en surface, y compris les appareils à insertion spécifiques (dont les fournisseurs ont spécifiquement documenté le support pour le brasage par refusion), mais ne s'applique pas aux appareils à semi-conducteurs et aux appareils destinés au brasage à la vague.

Tehnologija površinske montaže - 4. del: Standardizirana metoda razvrščanja, pakiranja, etiketiranja in ravnanja z napravami, občutljivimi na vlago

Ta del standarda IEC 61760 določa metodo razvrščanja naprav, občutljivih na vlago, v ravni občutljivosti na vlago, povezane z vročino pri spajkanju, in določbe za pakiranje, etiketiranje in ravnanje z napravami. Ta del standarda IEC 61760 razširja metode razvrščanja in pakiranja na take komponente, kjer trenutno obstoječi standardi niso zahtevani ali ustrezni. Za take primere ta standard uvaja dodatne ravni občutljivosti na vlago in alternativno metodo za pakiranje. Ta standard velja za naprave, ki so namenjene za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, kot je večina površinsko montiranih elementov, vključno z elementi z luknjami (kjer je proizvajalec elementa posebej zabeležil podporo za pretaljevanje z vročim zrakom ali v dušikovi atmosferi), vendar ne za:
– polprevodniške elemente,
– elemente za valovno spajkanje.
OPOMBA Ozadje tega standarda in njegova povezava s trenutnimi standardi, npr. IEC 60749-20 ali J-STD-020 in J-STD-033, sta opisana v UVODU.

General Information

• Status: Published
• Publication Date: 02-Jul-2015
• Withdrawal Date: 22-Jun-2018
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 03-Jul-2015
• Completion Date: 03-Jul-2015
• Ref Project: SIST EN 61760-4:2015 - Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices

Relations

• Amended By: EN 61760-4:2015/A1:2018 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2015
7HKQRORJLMDSRYUãLQVNHPRQWDåHGHO6WDQGDUGL]LUDQDPHWRGDUD]YUãþDQMD
SDNLUDQMDHWLNHWLUDQMDLQUDYQDQMD]QDSUDYDPLREþXWOMLYLPLQDYODJR
Surface mounting technology - Part 4: Standard method for classification, packaging,
labelling and handling of moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation,
Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface -- Partie 4: Méthode normalisée de classification,
d'emballage, d'étiquetage et de manipulation des appareils sensibles à l'humidité
Ta slovenski standard je istoveten z: EN 61760-4:2015
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61760-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2015
ICS 31.190
English Version
Surface mounting technology - Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices
(IEC 61760-4:2015)
Technique du montage en surface (SMT) -  Oberflächenmontagetechnik -
Partie 4: Classification, emballage, étiquetage et Teil 4: Klassifikation, Verpackung, Kennzeichnung und
manipulation des dispositifs sensibles à l'humidité Handhabung feuchteempfindlicher Bauteile
(IEC 61760-4:2015) (IEC 61760-4:2015)
This European Standard was approved by CENELEC on 2015-06-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61760-4:2015 E
Foreword
The text of document 91/1244/FDIS, future edition 1 of IEC 61760-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61760-4:2015.

The following dates are fixed:
(dop) 2016-03-23
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-06-23
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61760-4:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

1)
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1.
ISO 62 NOTE Harmonized as EN ISO 62.

1)
Superseded by EN 60068-2-58:2015 (IEC 60068-2-58:2015): DOW = 2018-05-01.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60068-1 -  Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60749-20 -  Semiconductor devices - Mechanical EN 60749-20 -
and climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture
and soldering heat
IEC 61340-5-1 -  Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements
IEC 61760-2 -  Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage
conditions of surface mounting devices
(SMD) - Application guide
IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-hermetic
Solid State Surface Mount Devices

IEC 61760-4 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 4: Classification, packaging, labelling and handling of moisture sensitive

devices
Technique du montage en surface (SMT) –

Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs

sensibles à l'humidité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-2666-7

– 2 – IEC 61760-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General information . 9
4.1 Moisture sensitive devices . 9
4.2 Moisture sensitivity level (MSL) . 10
4.3 Relation to other environmental test methods (humidity tests) . 10
5 Assessment of moisture sensitivity . 10
5.1 Identification of non moisture sensitive devices . 10
5.2 Classification . 10
6 Test procedure . 11
6.1 General . 11
6.1.1 Structurally similar components . 11
6.1.2 Verification and validation tests . 11
6.1.3 Selection of applicable soak conditions and temperature profile . 12
6.2 Drying . 12
6.3 Moisture soak . 12
6.4 Temperature load . 13
6.4.1 Classification temperature profile . 13
6.4.2 Classification temperature profile for special devices . 14
6.5 Recovery . 14
6.6 Final measurements . 14
6.6.1 Requirements . 14
6.6.2 Visual inspection . 15
6.6.3 Electrical measurements . 15
6.6.4 Non-destructive inspection (if required) . 15
6.7 Classification . 15
6.8 Information to be given in the relevant specification . 15
7 Requirements to packaging and labelling . 16
7.1 Packaging process . 16
7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs . 16
7.1.2 Evacuation and sealing . 17
7.2 Packaging material for dry pack . 17
7.2.1 Moisture barrier bag (MBB) . 17
7.2.2 Desiccant . 17
7.2.3 Humidity indicator . 19
7.3 Information to be given on labels . 20
8 Handling of moisture sensitive devices . 21
8.1 Storage . 21
8.1.1 Recommended storage conditions . 21
8.1.2 Shelf life . 21
8.1.3 Floor life . 21
8.2 ESD . 22

IEC 61760-4:2015 © IEC 2015 – 3 –
8.3 Humidity indication . 22
8.3.1 Humidity indicator card (HIC) . 22
8.3.2 Moisture indicating desiccant . 22
8.4 Unpacking and re-packing . 22
9 Drying. 23
9.1 Drying options . 23
9.2 Methods . 24
9.2.1 General considerations for baking . 24
9.2.2 Bakeout times . 24
9.2.3 ESD protection . 25
9.2.4 Reuse of carriers . 25
9.2.5 Solderability limitations . 25
Annex A (informative) Moisture sensitivity of assemblies . 26
Annex B (informative) Mass/gain loss analysis . 27
Annex C (informative) Baking of devices . 28
C.1 Baking time and conditions . 28
C.2 Example of a baking process .
...