EN 60749-31:2003

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 31: Entflammbarkeit von Bauelementen in Kunststoffgehäusen (Selbstentzündung)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 31 : inflammabilité des dispositifs à encapsulation plastique (cas d'une cause interne d'inflammation)

Applicable aux dispositifs à semiconducteurs (dispositifs discrets et circuits intégrés), cet essai détermine si le dispositif prend feu par suite d'un échauffement interne dû à des surcharges excessives.

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) (IEC 60749-31:2002)

General Information

• Status: Published
• Publication Date: 19-Jun-2003
• Withdrawal Date: 30-Sep-2005
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 20-Jun-2003
• Completion Date: 20-Jun-2003
• Ref Project: SIST EN 60749-31:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)

Relations

• Replaces: EN 60749:1999/A1:2000 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-31:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 31:
Flammability of plastic-encapsulated devices (internally induced) (IEC 60749-
31:2002)
ICS 31.080.01 Referenčna številka
SIST EN 60749-31:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-31
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2003

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 31: Flammability of plastic-encapsulated devices
(internally induced)
(IEC 60749-31:2002)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische Prüfverfahren
et climatiques Teil 31: Entflammbarkeit von Bauelementen
Partie 31: Inflammabilité des dispositifs in Kunststoffgehäusen
à encapsulation plastique (Selbstentzündung)
(cas d'une cause interne d'inflammation) (IEC 60749-31:2002)
(CEI 60749-31:2002)





This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-31:2003 E

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EN 60749-31:2003 - 2 -
Foreword
The text of the International Standard IEC 60749-31:2002 was approved by CENELEC as
EN 60749-31 on 2002-09-24.
The text of this International Standard was reproduced from IEC 60749:1996, chapter 4, subclause 1.1
without change. Therefore, it has not been submitted to vote a second time and is still based on
document 47/1394/FDIS.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Each test method governed by this standard and which is part of the series is a stand-alone
document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no grouping of
test methods). The list of these tests will be available in the CENELEC internet site and in the
catalogue.
Updating of any of the individual test methods is independent of any other part.
__________
Endorsement notice
The text of the International Standard IEC 60749-31:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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NORME CEI
INTERNATIONALE IEC
60749-31
INTERNATIONAL
Première édition
STANDARD
First edition
2002-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 31:
Inflammabilité des dispositifs à encapsulation
plastique (cas d'une cause interne d'inflammation)
Semiconductor devices –
Mechanical and climatic test methods –
Part 31:
Flammability of plastic-encapsulated devices
(internally induced)
 IEC 2002 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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