Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). This edition includes the following significant technical changes with respect to the previous edition: The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Elektronikaufbauten auf Leiterplatten - Teil 4: Rahmenspezifikation - Anforderungen an gelötete Baugruppen mit Lötstützpunkten

Ensembles de cartes imprimées - Partie 4: Spécification intermédiaire - Exigences pour les assemblages soudés des terminaux

L’IEC 61191-4:2017 donne des exigences relatives à l'assemblage de bornes par brasage. Les exigences de la présente spécification s'appliquent aux ensembles entièrement constitués d'après des structures d'interconnexion borne/fil et aux portions borne/fil de ces ensembles incluant d'autres techniques associées (par exemple montage en surface, montage par trous traversants, montage à puce). Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: Mise à jour des exigences pour satisfaire aux critères d’acceptation décrits dans l’IPC‑A‑610F.

Sestavi plošč tiskanih vezij - 4. del: Področna specifikacija - Zahteve za sestave s spajkalnimi priključki

Ta del standarda IEC 61191 določa zahteve za sestave s spajkalnimi priključki. Zahteve se nanašajo na sestave, ki v celoti uporabljajo strukture za medsebojno povezovanje priključkov/žic, ali dele priključkov/žic teh sestavov, ki uporabljajo druge sorodne tehnologije (npr. nameščanje na površino, nameščanje skozi odprtine, nameščanje čipov).

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Standards Content (Sample)

SIST EN 61191-4:2001
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal
soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 4: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen mit Lötstützpunkten
Ensembles de cartes imprimées - Partie 4: Spécification intermédiaire - Exigences
relatives à l'assemblage de bornes par brasage
Ta slovenski standard je istoveten z: EN 61191-4:2017
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

October 2017
ICS 31.240 Supersedes EN 61191-4:1998
English Version
Printed board assemblies - Part 4: Sectional specification -
Requirements for terminal soldered assemblies
(IEC 61191-4:2017)
Ensembles de cartes imprimées - Partie 4: Spécification Elektronikaufbauten auf Leiterplatten - Teil 4:
intermédiaire - Exigences pour les assemblages soudés Rahmenspezifikation - Anforderungen an gelötete
des terminaux Baugruppen mit Lötstützpunkten
(IEC 61191-4:2017) (IEC 61191-4:2017)
This European Standard was approved by CENELEC on 2017-08-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61191-4:2017 E
European foreword
The text of document 91/1399/CDV, future edition 2 of IEC 61191-4, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61191-4:2017.
The following dates are fixed:
• latest date by which the document has to be (dop) 2018-05-30
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2020-08-30
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61191-4:1998.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-4:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-20:2008 NOTE Harmonized as EN 60068-20:2008 (not modified).
IEC 60068-2-58:2015 NOTE Harmonized as EN 60068-2-58:2015 (not modified).
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified).
IEC 61188-5-2:2003 NOTE Harmonized as EN 61188-5-2:2003 (not modified).
IEC 61188-5-3:2007 NOTE Harmonized as EN 61188-5-3:2007 (not modified).
IEC 61188-5-4:2007 NOTE Harmonized as EN 61188-5-4:2007 (not modified).
IEC 61188-5-5:2007 NOTE Harmonized as EN 61188-5-5:2007 (not modified).
IEC 61188-5-6:2003 NOTE Harmonized as EN 61188-5-6:2003 (not modified).
IEC 61188-7:2017 NOTE Harmonized as EN 61188-7:2017 (not modified).
IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified).
IEC 61190-1-2:2014 NOTE Harmonized as EN 61190-1-2:2014 (not modified).
IEC 61193-1:2001 NOTE Harmonized as EN 61193-1:2002 (not modified).
IEC 61193-3 NOTE Harmonized as EN 61193-3.
IEC 62326-1:2002 NOTE Harmonized as EN 62326-1:2002 (not modified).
IEC 62326-4:1996 NOTE Harmonized as EN 62326-4:1997 (not modified).
IEC 62326-4-1:1996 NOTE Harmonized as EN 62326-4-1:1997 (not modified).
ISO 9001:2015 NOTE Harmonized as EN ISO 9001:2015 (not modified).
Annex ZA
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
Publication Year Title EN/HD Year

IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 2013 Printed board assemblies - Part 1: Generic EN 61191-1 2013
specification - Requirements for soldered
electrical and electronic assemblies using
surface mount and related assembly
IEC 61191-4 ®
Edition 2.0 2017-07
Printed board assemblies –
Part 4: Sectional specification – Requirements for terminal soldered assemblies

ICS 31.240 ISBN 978-2-8322-4657-3

– 2 – IEC 61191-4:2017 © IEC 2017

1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 General terminal and part mounting requirements. 6
5.1 General . 6
5.2 Wire and cable preparation . 7
5.2.1 General . 7
5.2.2 Tinning of stranded wire . 7
5.3 Terminal installation . 7
5.3.1 General . 7
5.3.2 Terminal mounting (mechanical) . 7
5.3.3 Terminal shank discontinuities . 8
5.3.4 Flange discontinuities . 8
5.3.5 Terminal mounting (electrical) . 8
5.3.6 Flange angles . 9
5.3.7 Shank discontinuities . 9
5.3.8 Flared flange discontinuities . 9
5.4 Mounting to terminals . 10
5.4.1 General . 10
5.4.2 Wire and lead wrap-around . 10
5.4.3 Side route connection . 10
5.4.4 Top and bottom route connection . 11
5.4.5 Continuous runs . 12
5.4.6 Service loops . 13
5.4.7 Insulation clearance . 13
5.4.8 Orientation of wire wrap . 14
5.4.9 Stress relief . 14
5.4.10 Pierced or perforated terminals . 14
5.4.11 Cup and hollow cylindrical terminal soldering . 15
6 Acceptance requirements . 16
6.1 General . 16
6.2 Control and corrective actions . 16
6.3 Terminal soldering . 16
6.3.1 General . 16
6.3.2 Wire-terminal attachment . 16
6.4 Part marking and reference designations . 16
7 Rework of unsatisfactory soldered connections. 16
Bibliography . 18

Figure 1 – Rolled flange terminal . 8
Figure 2 – Rolled flange discontinuities . 8
Figure 3 – Flared flange terminals. 9
Figure 4 – Flared angles . 9

IEC 61191-4:2017 © IEC 2017 – 3 –
Figure 5 – Wire and lead wrap around . 10
Figure 6 – Side route connections and wrap on bifurcated terminal . 11
Figure 7 – Top and bottom route terminal connection . 12
Figure 8 – Continuous run wire wraps . 13
Figure 9 – Service loop for lead wiring . 13
Figure 10 – Insulation clearance measurement (c) . 14
Figure 11 – Stress relief examples . 14
Figure 12 – Pierced or perforated terminal wire wrap . 15

Table 1 – Nicked or broken strand limits . 7
Table 2 – Plated through-holes with terminals, minimum acceptance conditions . 16
Table 3 – Defects for terminal attachment and soldering defects . 17

– 4 – IEC 61191-4:2017 © IEC 2017
Part 4: Sectional specification –
Requirements for terminal soldered assemblies

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities,

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