Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

Sestavi plošč tiskanih vezij - 2. del: Področna specifikacija - Zahteve za površinsko nameščene spajkane sestave - Popravek AC

General Information

Status
Published
Publication Date
24-Oct-2019
Current Stage
6060 - Document made available - Publishing
Start Date
25-Oct-2019
Completion Date
25-Oct-2019

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Corrigendum
EN 61191-2:2018/AC:2020
English language
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Standards Content (Sample)


SLOVENSKI STANDARD
01-julij-2020
Sestavi plošč tiskanih vezij - 2. del: Področna specifikacija - Zahteve za
površinsko nameščene spajkane sestave - Popravek AC
Printed board assemblies - Part 2: Sectional specification - Requirements for surface
mount soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Oberflächenmontage
Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage pour montage en surface
Ta slovenski standard je istoveten z: EN 61191-2:2017/AC:2019-10
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61191-2:2017/AC:2019-10

NORME EUROPÉENNE
October 2019
EUROPÄISCHE NORM
ICS 31.190; 31.240
English Version
Printed board assemblies - Part 2: Sectional specification -
Requirements for surface mount soldered assemblies
(IEC 61191-2:2017/COR1:2019)
Ensembles de cartes imprimées - Partie 2: Spécification Elektronikaufbauten auf Leiterplatten - Teil 2:
intermédiaire - Exigences relatives à l'assem
...

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