Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage

Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants

L’IEC 61191-3:2017 décrit les exigences relatives aux ensembles de composants à trous traversants (broches et trous) montés par brasage. Les exigences s’appliquent aux ensembles utilisant totalement une technique de montage par trous traversants (THT) ou aux portions THT d’ensembles incluant d’autres techniques associées (par exemple montage en surface, montage à puce, montage à borne). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) mise à jour des exigences pour qu’elles soient conformes aux critères d’acceptation de l’IPC‑A-610F.

Sestavi plošč tiskanih vezij - 3. del: Področna specifikacija - Zahteve za spajkane sestave, nameščene v skoznjih luknjah

Ta del standarda IEC 61191 določa zahteve za sestave za spajkanje s svincem in spajkanje skozi luknje. Zahteve se nanašajo na sestave, ki v celoti uporabljajo tehnologijo za nameščanje elementov skozi luknje (THT), ali dele sestavov, ki poleg tehnologije nameščanja elementov skozi luknje uporabljajo tudi sorodne tehnologije (npr. nameščanje na površino, nameščanje čipov, nameščanje priključkov).

General Information

Publication Date
Withdrawal Date
Current Stage
6060 - Document made available - Publishing
Start Date
Completion Date


Buy Standard

EN 61191-3:2018
English language
24 pages
sale 10% off
sale 10% off
e-Library read for
1 day

Standards Content (Sample)

SIST EN 61191-3:2001
Printed board assemblies - Part 3: Sectional specification - Requirements for through-
hole mount soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage de trous traversants
Ta slovenski standard je istoveten z: EN 61191-3:2017
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

September 2017
ICS 31.240 Supersedes EN 61191-3:1998
English Version
Printed board assemblies - Part 3: Sectional specification -
Requirements for through-hole mount soldered assemblies
(IEC 61191-3:2017)
Ensembles de cartes imprimées - Partie 3: Spécification Elektronikaufbauten auf Leiterplatten - Teil 3:
intermédiaire - Exigences relatives à l'assemblage par Rahmenspezifikation - Anforderungen an gelötete
brasage de trous traversants Baugruppen in Durchsteckmontage
(IEC 61191-3:2017) (IEC 61191-3:2017)
This European Standard was approved by CENELEC on 2017-07-04. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61191-3:2017 E
European foreword
The text of document 91/1375/CDV, future edition 2 of IEC 61191-3, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61191-3:2017.

The following dates are fixed:
(dop) 2018-04-04
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-07-04
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61191-3:1998.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58.
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1.
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2.
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3.
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4.
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-5.
IEC 61188-7 NOTE Harmonized as EN 61188-7.
IEC 61189-2 NOTE Harmonized as EN 61189-2.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61193-1 NOTE Harmonized as EN 61193-1.
IEC 61193-3 NOTE Harmonized as EN 61193-3.
IEC 62326-1 NOTE Harmonized as EN 62326-1.
IEC 62326-4 NOTE Harmonized as EN 62326-4.

IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1.
ISO 9001 NOTE Harmonized as EN ISO 9001.

Annex ZA
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
Publication Year Title EN/HD Year
IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 2013 Printed board assemblies -- Part 1: EN 61191-1 2013
Generic specification - Requirements for
soldered electrical and electronic
assemblies using surface mount and
related assembly technologies
IPC-A-610 -  Acceptability of Electronics Assemblies - -

IEC 61191-3 ®
Edition 2.0 2017-05
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered

ICS 31.240 ISBN 978-2-8322-4397-8

– 2 – IEC 61191-3:2017 © IEC 2017

1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 Through-hole mounting of components . 7
5.1 General . 7
5.2 Placement accuracy . 7
5.3 Through-hole component requirements . 7
5.3.1 Lead preforming . 7
5.3.2 Tempered leads . 7
5.3.3 Lead forming requirements . 7
5.3.4 Stress relief requirements . 8
5.3.5 Lead termination requirements . 8
6 Acceptance requirements . 10
6.1 General . 10
6.2 Control and corrective actions . 10
6.2.1 General . 10
6.2.2 Interfacial connections (vias) . 10
6.3 Through-hole component lead soldering . 11
6.3.1 General . 11
6.3.2 Clinched leads . 12
6.3.3 Exposed basis metal . 13
7 Rework of unsatisfactory solder connections . 13
Annex A (normative) Placement requirements for through-hole mount devices . 14
A.1 General . 14
A.2 Horizontal mounting, free-standing . 14
A.3 Axial lead components . 14
A.4 Radial lead components . 14
A.5 Perpendicular mounting, free-standing . 14
A.5.1 General . 14
A.5.2 Mounting of components . 14
A.5.3 Radial lead components . 15
A.6 Side- and end-mounting . 15
A.7 Supported component mounting . 16
A.7.1 General . 16
A.7.2 Stand-off positioning . 16
A.7.3 Non-resilient footed stand-offs . 17
A.8 Stress relief lead configuration . 17
A.9 Flat pack lead configuration . 17
Bibliography . 19

Figure 1 – Lead bends . 8
Figure 2 – Hole obstruction . 10
Figure 3 – Through-hole component lead soldering . 11

IEC 61191-3:2017 © IEC 2017 – 3 –
Figure 4 – Lead-to-land fillet requirements for clinched leads and wires in non-plated
through-holes . 11
Figure 5 – Lead-to-land fillet requirements for clinched leads and wires in plated
through-holes . 12
Figure A.1 – Mounting of free-standing components . 14
Figure A.2 – Typical configuration of components with dual non-axial leads . 15
Figure A.3 – Mounting of components with dual non-axial leads . 15
Figure A.4 – Side mounting . 15
Figure A.5 – End mounting. 16
Figure A.6 – Mounting with footed stand-offs . 16
Figure A.7 – Non-resilient footed stand-offs . 17
Figure A.8 – Acceptable lead configurations . 17
Figure A.9 – Configuration of ribbon leads for through-hole mounting . 18

Table 1 – Plated through-holes with component leads, minimum acceptable
conditions . 12
Table 2 – Through-hole solder joint defects . 13

– 4 – IEC 61191-3:2017 © IEC 2017
Part 3: Sectional specification – Requirements
for through-hole mount soldered assemblies

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees).

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.