prEN IEC 60749-24:2024
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased hast
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased hast
Halbleiterbauelemente – Mechanische und klimatische Prüfverfahren – Teil 24: Beschleunigte Feuchtigkeitsbeständigkeit – Unvoreingenommene Hast
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 24: Résistance à l'humidité accélérée - Hast sans polarisation
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 24. del: Povečana odpornost na vlago
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Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2025
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 24. del:
Povečana odpornost na vlago
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated
moisture resistance - Unbiased hast
Halbleiterbauelemente – Mechanische und klimatische Prüfverfahren - Teil 24:
Beschleunigte Feuchtigkeitsbeständigkeit – Unvoreingenommene Hast
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
24: Résistance à l'humidité accélérée - Hast sans polarisation
Ta slovenski standard je istoveten z: prEN IEC 60749-24:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
47/2863/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60749-24 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-09-06 2024-11-29
SUPERSEDES DOCUMENTS:
47/2858/RR
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
TC 91,TC 104
ASPECTS CONCERNED:
Environment,Safety
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which t hey are
aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance -
Unbiased HAST
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You
may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without permis sion in
writing from IEC.
47/2863/CDV – 2 – IEC CDV 60749-24 © IEC 2004
CONTENTS
1 Scope . 5
2 Normative references . 5
3 Test requirements . 5
4 Test apparatus . 6
4.1 Test chamber . 6
4.2 Records . 6
4.3 Devices under stress . 6
4.4 Ionic contamination . 6
4.5 Distilled or deionized water . 6
5 Test conditions . 6
6 Procedure. 7
6.1 Mounting . 7
6.2 Ramp-up . 7
6.3 Ramp-down . 8
6.4 Test clock . 8
6.5 Electrical tests . 8
6.6 Handling . 8
7 Failure criteria . 8
8 Safety . 8
9 Summary . 9
Table 1 – Temperature, relative humidity, and pressure . 7
IEC CDV 60749-24 © IEC 2004 – 3 – 47/2863/CDV
1 INTERNATIONAL ELECTROTECHNICAL COMMISSION
2 ____________
4 SEMICONDUCTOR DEVICES –
5 MECHANICAL AND CLIMATIC TEST METHODS –
7 Part 24: Accelerated moisture resistance – Unbiased HAST
10 FOREWORD
11 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
12 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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21 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
22 consensus of opinion on the relevant subjects since each technical committee has representation from all
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24 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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28 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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32 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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34 services carried out by independent certification bodies.
35 6) All users should ensure that they have the latest edition of this publication.
36 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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39 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
40 Publications.
41 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
42 indispensable for the correct application of this publication.
43 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
44 patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
45 IEC 60749-5 has been prepared by IEC technical committee 47: Semiconductor devices. It is
46 an International Standard.
47 This second edition, based on JEDEC document JESD22-A118B.01, cancels and replaces the
48 first edition published in 2004. lt is used with permission of the copyright holder, JEDEC Solid
49 State Technology Association. This edition constitutes a technical revision.
50 This edition includes the following significant technical changes with respect to the previous
51 edition:
52 a) rearrangement of clauses to reposition requirements;
53 b) addition of 2 notes to the post-test electrical procedures.
47/2863/CDV – 4 – IEC CDV 60749-24 © IEC 2004
54 The text of this International Standard is based on the following documents:
Draft Report on voting
47/XX/FDIS 47/XX/RVD
56 Full information on the voting for its approval can be found in the report on voting indicated in
57 the above table.
58 The language used for the development of this International Standard is English.
59 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
60 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
61 available at www.iec.ch/members_experts/refdocs. The main document types developed by
62 IEC are described in greater detail at www.iec.ch/publications.
63 A list of all parts of the IEC 60749 series, under the general title Semiconductor devices –
64 Mechanical and climatic test methods, can be found in the IEC website.
65 The committee has decided that the contents of this document will remain unchanged until the
66 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
67 specific document. At this date, the document will be
68 • reconfirmed,
69 • withdrawn,
70 • replaced by a revised edition, or
71 • amended.
IEC CDV 60749-24 © IEC 2004 – 5 – 47/2863/CDV
74 SEMICONDUCTOR DEVICES –
75 MECHANICAL AND CLIMATIC TEST METHODS –
77 Part 24: Accelerated moisture resistance – Unbiased HAST
81 1 Scope
82 The unbiased highly accelerated stress testing (HAST) is performed for the purpose of
83 evaluating the reliability of non-hermetically packaged solid-state devices in humid
84 environments.
85 It is a highly accelerated test which employs temperature and humidity under non -condensing
86 conditions to accelerate the penetration of moisture through the external protective material
87 (encapsulant or seal) or along the interface between the external protective material and the
88 metallic conductors which pass through it. Bias is not applied in this test to ensure that the
89 failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic
90 corrosion).
91 This test is used to identify failure mechanisms internal to the package and is destructive.
92 2 Normative references
93 The following documents are referred to in the text in such a way that some or all of their
94 content constitutes requirements of this document. For dated references, only the edition
95 cited applies. For undated references, the latest edition of the referenced document (including
96 any amendments) applies.
97 IEC 60749-33, Semiconductor devices – Mechanical and climatic test methods – Part 33:
98 Accelerated moisture resistance – unbiased autoclave
99 IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5:
100 Steady-state temperature humidity bias life test
101 3 Test requirements
102 This test method applies primarily to moisture resistance evaluations and robustness testing,
103 and may be used as an alternative to unbiased autoclave.
104 Samples are subjected to a non-condensing, humid atmosphere, similar to IEC 60749-33, but
105 with a higher temperature and without bias. For the temperature limits defined by this
106 procedure, the test will typically generate the same failure mechanisms as those in an
107 unbiased ‘85 °C/85 % RH’ steady-state humidity life test, but caution should be exercised if
108 higher temperatures are considered, since non-realistic failure modes can be generated. In
109 the case where both this test and that of IEC 60749-33 are performed, the results of this
110 unbiased HAST test takes precedence over the results of the unbiased autoclave test.
111 The use of a non-condensing environment avoids many irrelevant external failures, e.g. pin-
112 to-pin leakage or lead corrosion. However, because absorbed moisture typically decreases
113 glass transition temperature for most polymeric materials, the combination of high humidity
114 and high temperature (>T ) may produce unrealistic material failures. Thus, caution is needed
g
115 if unbiased HAST is required for reliability or qualification purposes. The condition of
47/2863/CDV – 6 – IEC CDV 60749-24 © IEC 2004
116 85 °C/85 % RH is considered equivalent but with less of an acceleration factor. Unbiased
117 HAST may show failures that are due to the HAST accelerated conditions. In this case,
118 unbiased 85 °C/85 % RH is considered the reference condition as it correlates better with use
119 conditions. Test method IEC 60749-5, used without bias, is the reference test method.
121 4 Test apparatus
122 4.1 Test chamber
123 The test requires a chamber capable of maintaining a specified temperature and relative
124 humidity under pre
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