EN 61760-2:2007
(Main)Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and 'popcorning'. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden
Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application
La CEI 61760-2:2007 décrit les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en uvre sans problème des composants pour montage en surface (CMS), tant actifs que passifs (Les conditions pour les cartes à circuits imprimés ne sont pas prises en compte). L'objet de la présente norme est de s'assurer que l'utilisateur de composants pour montage en surface reçoit et emmagasine des produits qui pourront être utilisés (par exemple placés, brasés) sans problème de qualité et de fiabilité. Des conditions de transport et de stockage impropres peuvent provoquer une détérioration des CMS et il en résulte des problèmes d'assemblage tels qu'une mauvaise brasabilité, la séparation des couches métallisées des terminaisons et l'effet 'pop-corn'. Cette deuxième édition annule et remplace la première édition, parue en 1998, et constitue une révision technique. La mise à jour et la révision rédactionnelle de la norme.
Tehnologija površinske montaže – 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) – Vodilo za uporabo (IEC 61760-2:2007)
General Information
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guideTehnologija površinske montaže – 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) – Vodilo za uporaboTechnique du montage en surface -- Partie 2: Transport et stockage des composants pour montage en surface (CSM) - Guide d'applicationOberflächenmontagetechnik -- Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - AnwendungsleitfadenTa slovenski standard je istoveten z:EN 61760-2:2007SIST EN 61760-2:2007en,de31.020Elektronske komponente na splošnoElectronic components in generalICS:SIST EN 61760-2:20011DGRPHãþDSLOVENSKI
STANDARDSIST EN 61760-2:200701-oktober-2007
EUROPEAN STANDARD EN 61760-2 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2007
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-2:2007 E
ICS 31.020 Supersedes EN 61760-2:1998
English version
Surface mounting technology -
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide (IEC 61760-2:2007)
Technique du montage en surface -
Partie 2: Transport et stockage
des composants pour montage
en surface (CSM) -
Guide d'application (CEI 61760-2:2007)
Oberflächenmontagetechnik -
Teil 2: Transport- und Lagerungsbedingungen
von oberflächenmontierbaren Bauelementen (SMD) -
Anwendungsleitfaden (IEC 61760-2:2007)
This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
- 2 -
Foreword The text of document 91/569/CDV, future edition 2 of IEC 61760-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel Unique Acceptance Procedure and was approved by CENELEC as EN 61760-2 on 2007-05-01. This European Standard supersedes EN 61760-2:1998. The main changes with regard to EN 61760-2:1998 concern: EN 61760-2:2007 was updated and editorially revised. Specific reference is made to: – EN 61340-5-1: Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements – EN 61340-5-2: Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from EN 60721-3-1 and EN 60721-3-2). The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-02-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2010-05-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 61760-2:2007 was approved by CENELEC as a European Standard without any modification. __________
- 3 - EN 61760-2:2007 Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60286-3 -1) Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes EN 60286-3 200X2)
IEC 60286-4 -1) Packaging of components for automatic handling -
Part 4: Stick magazines for electronic components encapsulated in packages of form E and G EN 60286-4 19983)
IEC 60286-5 -1) Packaging of components for automatic handling -
Part 5: Matrix trays EN 60286-5 20043)
IEC 60286-6 -1) Packaging of components for automatic handling -
Part 6: Bulk case packaging for surface mounting components EN 60286-6 20043)
IEC 60721-3-1 -1) Classification of environmental conditions -
Part 3: Classification of groups of environmental parameters and
their severities - Section 1: Storage EN 60721-3-1 19973)
IEC 60721-3-2 -1) Classification of environmental conditions -
Part 3: Classification of groups of environmental parameters and
their severities - Section 2: Transportation EN 60721-3-2 19973)
IEC 60749
Series Semiconductor devices - Mechanical and climatic test methods EN 60749 Series
IEC/TS 61340-5-1
-1) Electrostatics -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General requirements EN 61340-5-1 + corr. April
20013) 2001
IEC/TS 61340-5-2 -1) Electrostatics -
Part 5-2: Protection of electronic devices
from electrostatic phenomena - User guide EN 61340-5-2 + corr. August
20013) 2001
1) Undated reference. 2) To be ratified. 3) Valid edition at date of issue.
INTERNATIONAL STANDARD IEC61760-2 Second edition2007-04 Surface mounting technology – Part 2:
Transportation and storage conditions of surface mounting devices (SMD) – Application guide
J For price, see current cataloguePRICE CODE
Commission Electrotechnique InternationaleInternational Electrotechnical Commission
– 2 – 61760-2 © IEC:2007(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION ___________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The main changes with regard to the previous edition concern: The standard was updated and editorially revised. Specific reference is made to:
IEC/TS 61340-5-1: Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements IEC/TS 61340-5-2: Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide
61760-2 © IEC:2007(E) – 3 – For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from IEC 60721-3-1 and IEC 60721-3-2). The text of this standard is based on the following documents: CDV Report on voting 91/569/CDV 91/634/RVC
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 61760 series, under the general title Surface mounting technology, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this publication may be issued at a later date.
– 4 – 61760-2 © IEC:2007(E) SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
1 Scope and object This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and ”popcorning”. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60286-3: Packaging of components for automatic handling – Part 3: Packaging of leadless components on continuous tapes IEC 60286-4: Packaging of components for automatic handling – Part 4: Stick magazines for electronic components encapsulated in packages of form E and G IEC 60286-5: Packaging of components for automatic handling – Part 5: Matrix trays IEC 60286-6: Packaging of components for automatic handling – Part 6: Bulk case packaging for surface mounting components IEC 60721-3-1: Classification of environmental conditions – Part 3: Classification of groups of environmental parameters and their severities – Section 1: Storage IEC 60721-3-2: Classification of environmental conditions – Part 3: Classification of groups of environmental parameters and their severities – Section 2: Transportation IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC/TS 61340-5-1: Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements IEC/TS 61340-5-2: Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide
61760-2 © IEC:2007(E) – 5 – 3 General conditions Surface mounting devices shall be packed in such a way that products are protected during transportation and storage without loss of their properties arising from mechanical, environmental and electrical influences. Packing requirements as defined in various IEC publications, such as IEC 60286-3, IEC 60286-4, IEC 60286-5, IEC 60286-6, may contribute to the protection of components during transportation and storage. Usually, transportation conditions are less controlled than storage conditions. Nevertheless, conditions shall be controlled and deviations from the advised conditions in this standard should be reduced to as little time as possible. 4 Transportation conditions 4.1 General transportation conditions During transportation, the SMDs, including their chosen style of tapes or stick magazines, etc., shall be protected against extreme temperature, humidity and mechanical forces. Unless otherwise specified by the component supplier, the following envi
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