EN 60749-39:2006

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 39: Messung des Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in organischen Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs

Détaille les procédures pour la mesure des propriétés caractéristiques de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans l'encapsulation des composants à semiconducteurs. Ces deux propriétés des matériaux sont des paramètres importants pour la performance de fiabilité des semiconducteurs sous boîtier en plastique après exposition à l'humidité et étant soumis à une refusion à température élevée au moment du brasage.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 39. del: Meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za polprevodniške komponente (IEC 60749-39:2006)

General Information

• Status: Published
• Publication Date: 24-Aug-2006
• Withdrawal Date: 31-Jul-2009
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 25-Aug-2006
• Completion Date: 25-Aug-2006
• Ref Project: SIST EN 60749-39:2007 - Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Relations

• Replaced By: EN IEC 60749-39:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• Effective Date: 23-Jan-2023

Standards Content (Sample)

6/29(16., 6,67(1

67$1'$5'
MDQXDU
3ROSUHYRGQLãNLHOHPHQWL0HKDQVNHLQNOLPDWVNHSUHVNXVQHPHWRGHGHO
0HULWYHSUHSXãþDQMDYODJHRUJDQVNLKPDWHULDORYLQQMLKRYHYRGRWRSQRVWL]D
SROSUHYRGQLãNHNRPSRQHQWH,(&
LVWRYHWHQ(1
6HPLFRQGXFWRUGHYLFHV0HFKDQLFDODQGFOLPDWLFWHVWPHWKRGV3DUW
0HDVXUHPHQWRIPRLVWXUHGLIIXVLYLW\DQGZDWHUVROXELOLW\LQRUJDQLFPDWHULDOVXVHG
IRUVHPLFRQGXFWRUFRPSRQHQWV,(&
,&6 5HIHUHQþQDãWHYLOND

6,67(1HQ
!"#$%&’( )&!*+,%- .
EUROPEAN STANDARD
EN 60749-39
NORME EUROPÉENNE
August 2006
EUROPÄISCHE NORM
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 39: Measurement of moisture diffusivity and water solubility
in organic materials used for semiconductor components
(IEC 60749-39:2006)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 39: Mesure de la diffusion Teil 39: Messung des
d'humidité et de l'hydrosolubilité Feuchtediffusionskoeffizienten
dans les matériaux organiques utilisés und der Wasserlöslichkeit
dans les composants à semiconducteurs in organischen Werkstoffen,
(CEI 60749-39:2006) welche bei Halbleiter-Komponenten
verwendet werden
(IEC 60749-39:2006)
This European Standard was approved by CENELEC on 2006-08-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-39:2006 E
Foreword
The text of document 47/1860/FDIS, future edition 1 of IEC 60749-39, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-39 on 2006-08-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-05-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-08-01
__________
Endorsement notice
The text of the International Standard IEC 60749-39:2006 was approved by CENELEC as a European
Standard without any modification.
__________
NORME CEI
INTERNATIONALE
IEC
60749-39
INTERNATIONAL
Première édition
STANDARD
First edition
2006-07
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 39:
Mesure de la diffusion d'humidité et de
l'hydrosolubilité dans les matériaux organiques
utilisés dans les composants à semiconducteurs

Semiconductor devices –
Mechanical and climatic test methods –
Part 39:
Measurement of moisture diffusivity and
water solubility in organic materials used
for semiconductor components
 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
CODE PRIX
K
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

60749-39  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.9
2 Apparatus.9
3 Samples .9
4 Procedure .11
4.1 Sample preparation .11
4.2 Absorption measurements below 100 °C .11
4.3 Solubility and diffusivity calculation .15
4.4 Desorption measurements above 100 °C.15
5 Calculation of activation energy for moisture diffusion .17
6 Summary.18

Figure 1 – Example of linearly increasing mass gain.13

60749-39  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-39 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces IEC/PAS 62307 published in 2002. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1860/FDIS 47/1872/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

60749-39  IEC:2006 – 7 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publicat
...