EN 62047-9:2011
(Main)Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters. The contents of the corrigendum of March 2012 have been included in this copy.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 9: Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 9: Mesure de la résistance de collage de deux plaquettes pour les MEMS
La CEI 62047-9:2011 décrit une méthode de mesure de la résistance de collage de deux plaquettes, le type de processus de liaison, par exemple le collage par fusion de deux plaquettes de silicium, le collage anodique d'une plaquette de silicium et d'une plaquette de verre, etc., et la taille de la structure applicable pendant le traitement ou l'assemblage de systèmes microélectromécaniques (MEMS). L'épaisseur de plaquette applicable est dans la gamme comprise entre 10 ohmm et plusieurs millimètres. Le contenu du corrigendum de mars 2012 a été pris en considération dans cet exemplaire.
Polprevodniški elementi - Mikroelektromehanski elementi - 9. del: Merjenje (mehanske) spojne trdnosti med rezinami pri mikroelektromehanskih sistemih (MEMS)
Ta standard opisuje metodo merjenja (mehanske) spojne trdnosti med rezinami, vrsto spojnega postopka, na primer spajanje s fuzijo med silikonom in silikonom, anodno spajanje med silikonom in steklom itd., in ustrezno velikost strukture med obdelavo/sestavljanjem MEMS. Ustrezna debelina rezin je v razponu med 10 μm in nekaj milimetri.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-9:2011
01-oktober-2011
Polprevodniški elementi - Mikroelektromehanski elementi - 9. del: Merjenje
(mehanske) spojne trdnosti med rezinami pri mikroelektromehanskih sistemih
(MEMS)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer
bonding strength measurement for MEMS
Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 9: Mesure de
la résistance de collage de deux plaquettes pour les MEMS
Ta slovenski standard je istoveten z: EN 62047-9:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-9:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN 62047-9:2011
---------------------- Page: 2 ----------------------
SIST EN 62047-9:2011
EUROPEAN STANDARD
EN 62047-9
NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 9: Wafer to wafer bonding strength measurement for MEMS
(IEC 62047-9:2011)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 9: Mesure de la résistance de Teil 9: Prüfverfahren zur Festigkeit von
collage de deux plaquettes pour les Full-Wafer-Bondverbindungen in der
MEMS Mikrosystemtechnik (MEMS)
(CEI 62047-9:2011) (IEC 62047-9:2011)
This European Standard was approved by CENELEC on 2011-08-17. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-9:2011 E
---------------------- Page: 3 ----------------------
SIST EN 62047-9:2011
EN 62047-9:2011 - 2 -
Foreword
The text of document 47F/82/FDIS, future edition 1 of IEC 62047-9, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 62047-9 on 2011-08-17.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-05-17
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-08-17
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-9:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 62047-2 NOTE Harmonized as EN 62047-2.
IEC 62047-4 NOTE Harmonized as EN 62047-4.
__________
---------------------- Page: 4 ----------------------
SIST EN 62047-9:2011
- 3 - EN 62047-9:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.