IEC 60749-28:2022

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition:
- a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages;
- changes to clarify cleaning of devices and testers.

Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 28: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle de dispositif chargé (CDM) - niveau du dispositif

L’IEC 60749-28:2022 établit la procédure d’essai, d’évaluation et de classification des dispositifs et des microcircuits selon leur susceptibilité (sensibilité) au dommage ou leur dégradation par suite de leur exposition à une décharge électrostatique (DES) sur un modèle défini de dispositif chargé (CDM) induit par champ. Tous les dispositifs à semiconducteurs, circuits à couches minces, dispositifs à ondes acoustiques de surface (OAS), dispositifs optoélectroniques, circuits intégrés hybrides (HIC - hybrid integrated circuits) et modules multipuces (MCM - multi-chip modules) en boîtiers qui contiennent l’un de ces dispositifs doivent être évalués selon le présent document. Pour effectuer les essais, les dispositifs sont assemblés dans un boîtier similaire à celui prévu dans l’application finale. Le présent document CDM ne s’applique pas aux appareils d’essai de modèles de décharge avec support. Il décrit en revanche la méthode induite par champ (FI - field-induced). Une méthode alternative, la méthode par contact direct (DC - direct contact), est décrite à l’Annexe J. L’objet du présent document est d’établir une méthode d'essai qui reproduit les défaillances du CDM et de fournir des résultats d'essais de DES de CDM fiables et reproductibles d'un appareil d'essai à un autre, indépendamment du type de dispositif. Des données reproductibles permettent des classifications et des comparaisons exactes des niveaux de sensibilité de DES de CDM. Cette édition contient les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout d’un nouveau paragraphe et d'une nouvelle annexe relatifs aux problèmes associés à l’essai de CDM des circuits intégrés et des semiconducteurs discrets dans de très petits boîtiers;
- introduction de modifications afin de clarifier le nettoyage des dispositifs et des appareils d’essai.

General Information

• Status: Published
• Publication Date: 28-Feb-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 25-Mar-2022
• Completion Date: 01-Mar-2022

Relations

• Revises: IEC 60749-28:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-28 ®
Edition 2.0 2022-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model
(CDM) – device level
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
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International Standards for all electrical, electronic and related technologies.

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IEC 60749-28 ®
Edition 2.0 2022-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device
model (CDM) – device level
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4495-1

– 2 – IEC 60749-28:2022 RLV © IEC 2022
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 9
4 Required equipment . 10
4.1 CDM ESD tester . 10
4.1.1 General . 10
4.1.2 Current-sensing element . 11
4.1.3 Ground plane . 12
4.1.4 Field plate/field plate dielectric layer . 12
4.1.5 Charging resistor . 12
4.2 Waveform measurement equipment . 12
4.2.1 General . 12
4.2.2 Cable assemblies . 12
4.2.3 Equipment for high-bandwidth waveform measurement . 12
4.2.4 Equipment for 1,0 GHz waveform measurement . 12
4.3 Verification modules (metal discs) . 13
4.4 Capacitance meter . 13
4.5 Ohmmeter . 13
5 Periodic tester qualification, waveform records, and waveform verification
requirements . 13
5.1 Overview of required CDM tester evaluations . 13
5.2 Waveform capture hardware . 13
5.3 Waveform capture setup . 13
5.4 Waveform capture procedure . 14
5.5 CDM tester qualification/requalification procedure . 14
5.5.1 CDM tester qualification/requalification procedure . 14
5.5.2 Conditions requiring CDM tester qualification/requalification . 15
5.5.3 1 GHz oscilloscope correlation with high bandwidth oscilloscope . 15
5.6 CDM tester quarterly and routine waveform verification procedure . 15
5.6.1 Quarterly waveform verification procedure . 15
5.6.2 Routine waveform verification procedure . 15
5.7 Waveform characteristics . 16
5.8 Documentation . 17
5.9 Procedure for evaluating full CDM tester charging of a device . 17
6 CDM ESD testing requirements and procedures . 18
6.1 Device handling Tester and device preparation . 18
6.2 Test requirements . 18
6.2.1 Test temperature and humidity . 18
6.2.2 Device test . 18
6.3 Test procedures . 19
6.4 CDM test recording / reporting guidelines . 19
6.4.1 CDM test recording . 19
6.4.2 CDM Reporting Guidelines . 19
6.5 Testing of Devices in Small Packages . 19

7 CDM classification criteria . 20
Annex A (normative) Verification module (metal disc) specifications and cleaning
guidelines for verification modules and testers . 21
A.1 Tester verification modules and field plate dielectric . 21
A.2 Care of verification modules . 21
Annex B (normative) Capacitance measurement of verification modules (metal discs)
sitting on a tester field plate dielectric . 22
Annex C (normative) Testing of small package integrated circuits and discrete
semiconductors (ICDS) . 23
C.1 Testing rationale . 23
C.2 Procedure for Determining C . 23
small
C.3 ICDS Technology requirements . 24
Annex D (informative) CDM test hardware and metrology improvements . 25
Annex E (informative) CDM tester electrical schematic . 27
Annex F (informative) Sample oscilloscope setup and waveform . 28
F.1 General . 28
F.2 Settings for the 1 GHz bandwidth oscilloscope . 28
F.3 Settings for the high-bandwidth oscilloscope . 28
F.4 Setup . 28
F.5 Sample waveforms from a 1 GHz oscilloscope . 28
F.6 Sample waveforms from an 8 GHz oscilloscope . 29
Annex G (informative) Field-induced CDM tester discharge procedures . 31
G.1 General . 31
G.2 Single discharge procedure . 31
G.3 Dual discharge procedure . 31
Annex H (informative) Waveform verification procedures . 33
H.1 Factor/offset adjustment method . 33
H.2 Software voltage adjustment method. 36
H.3 Example parameter recording tables . 38
Annex I (informative) Determining the appropriate charge delay for full charging of a
large module or device . 40
I.1 General . 40
I.2 Procedure for charge delay determination . 40
Annex J (informative) Electrostatic discharge (ESD) sensitivity testing direct contact
charged device model (DC-CDM) . 42
J.1 General . 42
J.2 Standard test module . 42
J.3 Test equipment (CDM simulator) . 42
J.3.1 Test equipment design. 42
J.3.2 DUT (device under test) support . 43
J.3.3 Metal bar/board . 43
J.3.4 Equipment setup . 43
J.4 Verification of test equipment . 44
J.4.1 General description of verification test equipment . 44
J.4.2 Instruments for measurement . 45
J.4.3 Verification of test equipment, using a current probe . 46
J.5 Test procedure . 47
J.5.1 Initial measurement . 47

– 4 – IEC 60749-28:2022 RLV © IEC 2022
J.5.2 Tests . 47
J.5.3 Intermediate and final measurement . 48
J.6 Failure criteria . 48
J.7 Classification criteria . 48
J.8 Summary .
...

IEC 60749-28 ®
Edition 2.0 2022-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model
(CDM) – device level
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et
climatiques –
Partie 28: Essai de sensibilité aux décharges électrostatiques (DES) – Modèle de
dispositif chargé (CDM) – niveau du dispositif

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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containing more than 22 300 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 19 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: [e-mail].
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IEC 60749-28 ®
Edition 2.0 2022-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device

model (CDM) – device level
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et

climatiques –
Partie 28: Essai de sensibilité aux décharges électrostatiques (DES) – Modèle de

dispositif chargé (CDM) – niveau du dispositif

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1082-9

– 2 – IEC 60749-28:2022 © IEC 2022
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 9
4 Required equipment . 10
4.1 CDM ESD tester . 10
4.1.1 General . 10
4.1.2 Current-sensing element . 11
4.1.3 Ground plane . 11
4.1.4 Field plate/field plate dielectric layer . 11
4.1.5 Charging resistor . 11
4.2 Waveform measurement equipment . 12
4.2.1 General . 12
4.2.2 Cable assemblies . 12
4.2.3 Equipment for high-bandwidth waveform measurement . 12
4.2.4 Equipment for 1,0 GHz waveform measurement . 12
4.3 Verification modules (metal discs) . 12
4.4 Capacitance meter . 12
4.5 Ohmmeter . 12
5 Periodic tester qualification, waveform records, and waveform verification
requirements . 13
5.1 Overview of required CDM tester evaluations . 13
5.2 Waveform capture hardware . 13
5.3 Waveform capture setup . 13
5.4 Waveform capture procedure . 13
5.5 CDM tester qualification/requalification procedure . 14
5.5.1 CDM tester qualification/requalification procedure . 14
5.5.2 Conditions requiring CDM tester qualification/requalification . 14
5.5.3 1 GHz oscilloscope correlation with high bandwidth oscilloscope . 14
5.6 CDM tester quarterly and routine waveform verification procedure . 15
5.6.1 Quarterly waveform verification procedure . 15
5.6.2 Routine waveform verification procedure . 15
5.7 Waveform characteristics . 15
5.8 Documentation . 17
5.9 Procedure for evaluating full CDM tester charging of a device . 17
6 CDM ESD testing requirements and procedures . 18
6.1 Tester and device preparation . 18
6.2 Test requirements . 18
6.2.1 Test temperature and humidity . 18
6.2.2 Device test . 18
6.3 Test procedures . 19
6.4 CDM test recording / reporting guidelines . 19
6.4.1 CDM test recording . 19
6.4.2 CDM Reporting Guidelines . 19
6.5 Testing of Devices in Small Packages . 19

7 CDM classification criteria . 20
Annex A (normative) Verification module (metal disc) specifications and cleaning
guidelines for verification modules and testers . 21
A.1 Tester verification modules and field plate dielectric . 21
A.2 Care of verification modules . 21
Annex B (normative) Capacitance measurement of verification modules (metal discs)
sitting on a tester field plate dielectric . 22
Annex C (normative) Testing of small package integrated circuits and discrete
semiconductors (ICDS) . 23
C.1 Testing rationale . 23
C.2 Procedure for Determining C . 23
small
C.3 ICDS Technology requirements . 24
Annex D (informative) CDM test hardware and metrology improvements . 25
Annex E (informative) CDM tester electrical schematic . 27
Annex F (informative) Sample oscilloscope setup and waveform . 28
F.1 General . 28
F.2 Settings for the 1 GHz bandwidth oscilloscope . 28
F.3 Settings for the high-bandwidth oscilloscope . 28
F.4 Setup . 28
F.5 Sample waveforms from a 1 GHz oscilloscope . 28
F.6 Sample waveforms from an 8 GHz oscilloscope . 29
Annex G (informative) Field-induced CDM tester discharge procedures . 31
G.1 General . 31
G.2 Single discharge procedure . 31
G.3 Dual discharge procedure . 31
Annex H (informative) Waveform verification procedures . 33
H.1 Factor/offset adjustment method . 33
H.2 S
...