IEC 60749-10:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Modification of the validity date: now put at 2007.

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10: Chocs mécaniques

Modification de la date de validité : fixée maintenant à 2007.

General Information

• Status: Published
• Publication Date: 12-Aug-2003
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 27-Apr-2022

Relations

• Corrects: IEC 60749-10:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
• Effective Date: 05-Sep-2023
• Revised: IEC 60749-10:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
• Effective Date: 05-Sep-2023

Standards Content (Sample)

CEI 60749-10 IEC 60749-10
(Première édition – 2002) (First edition – 2002)

DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –

ET CLIMATIQUES –
Part 10: Mechanical shock
Partie 10: Chocs mécaniques
CORRIGENDUM 1
Page 2 Page 3
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has dec
...