IEC 62899-202-6:2020
(Main)Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
IEC 62899-202-6:2020(E) provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.
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IEC 62899-202-6 ®
Edition 1.0 2020-12
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-6: Materials – Conductive ink – Measurement method for resistance
changes under high temperature and humidity – Printed conductive layer on a
flexible substrate
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IEC 62899-202-6 ®
Edition 1.0 2020-12
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-6: Materials – Conductive ink – Measurement method for resistance
changes under high temperature and humidity – Printed conductive layer on a
flexible substrate
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 87.080 ISBN 978-2-8322-9092-7
– 2 – IEC 62899-202-6:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test sample and measurement equipment . 7
4.1 General . 7
4.2 Sample shape and size for measuring resistance change . 7
5 Test conditions . 7
5.1 General . 7
5.2 Test conditions under temperature and humidity . 7
5.3 Test conditions at high temperature . 7
5.4 Test conditions for thermal cycling . 7
6 Test method and test apparatus . 8
6.1 General . 8
6.2 Test apparatus . 9
6.3 Test procedure . 9
6.4 Measurement . 10
7 Data analysis . 10
7.1 Reporting the electrical property . 10
7.2 Reporting of results . 11
Annex A (informative) An example of environmental test . 12
Bibliography . 15
Figure 1 – Schematic diagram of environmental test jig of printed conductive film for
two-wire measurement . 8
Figure 2 – Schematic diagram of environmental test jig of printed conductive film for
four-wire measurement . 8
Figure 3 – Schematic diagram of environmental test jig of printed conductive film with
screws for a four-wire measurement . 9
Figure 4 – Image of metal grip for connection . 9
Figure A.1 – Image of environment reliability test sample. 12
Figure A.2 – Resistance change at a temperature of 85 °C and a humidity of 85 % . 14
Table 1 – Options for duration time and interval of collecting data . 10
Table 2 – Resistance range of the test piece and applied current (see IEC 62899-202) . 10
Table A.1 – Test result . 13
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-6: Materials – Conductive ink –
Measurement method for resistance changes under high temperature
and humidity – Printed conductive layer on a flexible substrate
FOREWORD
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International Standard IEC 62899-202-6 has been prepared by IEC technical committee 119:
Printed Electronics.
The text of this International Standard is based on the following documents:
FDIS Report on voting
119/323/FDIS 119/331/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – IEC 62899-202-6:2020 © IEC 2020
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
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INTRODUCTION
The printing process is a highly promising technology for fabricating flexible devices due to its
high conductivity and productivity. In particular, a printed conductive layer on a flexible
substrate will be widely employed as an electrode or an interconnect for flexible devices. It
will be dealt with and commercialized as a sort of composite material in which the conductive
layer is formed on the substrate as a conductor.
For conductive films, silver/copper nanowires or metal mesh on flexible substrate are a key
component for many recently developed electronic products, from smart phones to the
keypads of appliances such as refrigerators and washing machines. Although the
conventional material for transparent conductive films is indium tin oxide (ITO), transparent
conductive films, enabled by printed electronics technologies, have arisen as a replacement.
For application of conductive films, the electrical property under environmental conditions
such as temperature, humidity, light, etc., is very important because it is highly sensitive to
the environment because of oxidation, dissolution, melting, etc [1] . The conductive films
should be stored on a shelf and should be environmentally stable during their operation in
electronic devices. Therefore, a method and environment for transferring, storing, and
processing the conductivity film are sometimes provided by the supplier and include
environmental measurements for printed devices. Although some environmental conditions for
testing already exist, the unique characteristics of the printed conductive films should be
considered, because they are fabricated on a polymer substrate which is susceptible to
temperature, humidity, light, etc., unlike the conventional ITO transparent conductive films.
In this document, an environment reliability test is proposed to evaluate the electrical property
and resistance change of a printed conductive film on a flexible substrate.
____________
Numbers in square brackets refer to the Bibliography.
– 6 – IEC 62899-202-6:2020 © IEC 2020
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