IEC 62899-202-9:2023
(Main)Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
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Standards Content (Sample)
IEC 62899-202-9 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-9: Materials – Conductive ink – Printed patterns for mechanical test
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IEC 62899-202-9 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-9: Materials – Conductive ink – Printed patterns for mechanical test
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 87.080 ISBN 978-2-8322-7328-9
– 2 – IEC 62899-202-9:2023 © IEC 2023
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Standard environmental conditions . 7
5 Mechanical test methods . 7
6 Printed patterns for mechanical test. 7
6.1 General . 7
6.2 Patterns for bending test . 8
6.2.1 General . 8
6.2.2 Printed patterns for bending test . 8
6.2.3 Directional patterns for bending test . 8
6.3 Patterns for torsion test . 9
6.4 Patterns for rolling test . 10
6.5 Electrical measurement of printed pattern . 12
6.6 Reporting of the results . 12
6.6.1 Reporting of the results of the bending test . 12
6.6.2 Reporting of the results of the torsion test . 12
6.6.3 Reporting of the results of the rolling test . 13
Bibliography . 14
Figure 1 – Printed patterns for bending test . 8
Figure 2 – Directional patterns for bending test . 9
Figure 3 – Printed patterns for torsion test . 10
Figure 4 – Printed patterns for rolling test for (a) simple straight pattern and (b)
returning pattern . 11
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-9: Materials – Conductive ink –
Printed patterns for mechanical test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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may participate in this preparatory work. International, governmental and non-governmental organizations liaising
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62899-202-9 has been prepared by IEC technical committee 119: Printed Electronics. It is
an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
119/435/FDIS 119/449/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 62899-202-9:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.
INTRODUCTION
Printing processes are highly promising technologies for the fabrication of flexible electronics
such as flexible displays, sensors, batteries, printed circuit boards, etc. During their lifetime,
flexible printed electronics can experience various mechanical deformations in random
directions such as bending, torsion, creasing, and rolling. Repeated mechanical deformations
lead to significant stress and can cause the failure of flexible electronics products. Therefore,
a standard test method to evaluate the mechanical reliability of flexible printed electronics is
recommended. Mechanical test methods for final products such as flexible displays, sensors,
and batteries are recommended in the industry. Moreover, a mechanical test for printed circuits
and printed devices is recommended because the printing materials will be used and
commercialized as basic components to develop the final printed electronics.
To test the mechanical reliability of printed circuits and printed devices, a proper mechanical
test method and a standard pattern are recommended. Several mechanical test methods for
flexible printed electronics such as the bending test, rolling test, and torsion test are already
proposed in IEC. These previous methods suggested mechanical test methods but they focused
on measuring the device reliability of the final product such as the flexible display, sensor, and
battery rather than the reliability of each component. Therefore, to test the mechanical reliability
of printed circuits and printed devices, standard printed patterns are required to perform
mechanical tests.
In this document, basic conductive traces and features of printed patterns are proposed for
mechanical tests. The standard pattern in this document can be a useful guideline to test the
mechanical reliability of new materials for flexible printed electronics. The information obtained
by using the standard patterns in this document will be beneficial to the ink suppliers to figure
out the best use of their ink and to the users to improve the reliability of their products.
– 6 – IEC 62899-202-9:2023 © IEC 2023
PRINTED ELECTRONICS –
Part 202-9: Materials – Conductive ink –
Printed patterns for mechanical test
1 Scope
This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a
conductive layer under mechanical deformation. Using the standard pattern described in this
document, the comparison of the electrical reliability of a conductive layer under mechanical
deformation is possible when the sample dimension is identical.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62899-202, Printed electronics – Part 202: Materials – Conductive ink
IEC 62899-201, Printed electronics – Part 201: Materials - Substrate
IEC 62899-202-5, Printed electronics – Part 202-5: Materials - Conductive ink – Mechan
...
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