IEC 61188-6-2:2021
(Main)Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
L’IEC 61188-6-2:2021 décrit les exigences de conception et d’utilisation relatives aux surfaces de brasage de la zone de report sur les cartes imprimées. Le présent document porte notamment sur la zone de report des composants montés en surface. Ces exigences se fondent sur les exigences relatives aux joints de brasure de l’IEC 61191-2:2017.
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IEC 61188-6-2 ®
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
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IEC 61188-6-2 ®
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9354-6
– 2 – IEC 61188-6-2:2021 IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Kinds of target solder process . 6
5 Land pattern determination . 6
6 Requirements . 7
6.1 General requirements . 7
6.2 The proposed land pattern dimension system . 7
6.2.1 Land pattern design . 7
6.2.2 Solder joint fillet design . 8
6.2.3 Courtyard excess . 10
6.2.4 Rounding factor . 10
6.2.5 Relationship between terminal classifications and class of land pattern . 10
6.2.6 Terminal types . 10
6.3 Land pattern for wave soldering . 14
6.3.1 General . 14
6.3.2 Flat bottom terminals . 14
6.3.3 Flat bottom and vertical side terminals . 14
6.4 Land pattern for reflow soldering . 15
6.4.1 General . 15
6.4.2 Flat bottom terminals . 15
6.4.3 Flat bottom and vertical side terminals . 15
6.4.4 Remarks . 16
Annex A (informative) The relation between terminal type and component packages . 19
A.1 Flat bottom terminals . 19
A.2 Flat bottom and vertical side terminals . 19
Annex B (informative) Solder joint fillet designs for wave soldering . 22
Annex C (informative) Courtyard excess for reflow soldering . 23
C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow
soldering . 23
C.2 Courtyard excess for flat bottom and vertical side terminals to use the land
pattern for reflow soldering . 23
Bibliography . 25
Figure 1 – Example of the dimensional relationship between the drawings of
components with rectangular terminals and the land pattern design . 9
Figure 2 – Definitions of dimensions of the flat bottom terminal types . 11
Figure 3 – Definitions of dimensions of the flat bottom and vertical side terminal types . 14
Figure 4 – Solder touches image. 17
Figure 5 – Unacceptable conditions for overhangs . 18
Table 1 – Relationship between terminal classifications and class of land pattern . 10
Table 2 – Conformity to the wave soldering of the terminal types . 14
Table 3 – Land pattern dimensions for Flat bottom terminals soldered by reflow
soldering . 15
Table 4 – Land pattern dimensions for flat bottom and vertical side terminals soldered
by reflow soldering . 16
Table A.1 – Terminal type classifications 1 – Flat bottom terminals . 19
Table A.2 – Terminal type classifications 2 – Flat bottom and vertical side terminals . 20
Table B.1 – Solder joint fillet design for wave soldering . 22
Table C.1 – Courtyard excess for flat bottom terminals to use the land pattern for
reflow soldering . 23
Table C.2 – Courtyard excess for flat bottom and vertical side terminals to use the
land pattern for reflow soldering . 24
– 4 – IEC 61188-6-2:2021 IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-2: Land pattern design – Description of land pattern
for the most common surface mounted components (SMD)
FOREWORD
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