Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept of Jisso” as well as the “Jisso product level” for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on “Jisso Product Level” could be needed among the current JIC members to finalize it in the near future based on this technical report.

General Information

Status
Published
Publication Date
26-Apr-2022
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
26-May-2022
Completion Date
27-Apr-2022
Ref Project

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IEC TR 62878-2-9:2022 - Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
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IEC TR 62878-2-9
®

Edition 1.0 2022-04
TECHNICAL
REPORT

colour
inside


Device embedding assembly technology –
Part 2-9: Guidelines – Concept of JISSO Level in the electronic assembly
technology industries
IEC TR 62878-2-9:2022-04(en)

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IEC TR 62878-2-9

®


Edition 1.0 2022-04




TECHNICAL



REPORT








colour

inside










Device embedding assembly technology –

Part 2-9: Guidelines – Concept of JISSO Level in the electronic assembly

technology industries

























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ELECTROTECHNICAL


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ICS 31.180; 31.190 ISBN 978-2-8322-1104-2




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– 2 – IEC TR 62878-2-9:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms . 6
4 Historical Concept of Jisso (JISSO) . 6
4.1 Some examples of terms on Jisso/JISSO used in the past . 6
4.2 JISSO level versus Packaging Level (Interconnecting Level) . 8
4.2.1 JISSO Level (typical) . 8
4.2.2 Packaging Level . 8
5 Concept of typical terms and description on JISSO Level . 9
5.1 JISSO/Jisso . 9
5.2 JISSO Level 0 – Intellectual information .
...

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