IEC TS 62878-2-10:2024
(Main)Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
IEC TS 62878-2-10:2024 provides a general specification for the design of cavity substrates.
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Standards Content (Sample)
IEC TS 62878-2-10 ®
Edition 1.0 2024-01
TECHNICAL
SPECIFICATION
colour
inside
Device embedding assembly technology –
Part 2-10: Design specification for cavity substrate
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IEC TS 62878-2-10 ®
Edition 1.0 2024-01
TECHNICAL
SPECIFICATION
colour
inside
Device embedding assembly technology –
Part 2-10: Design specification for cavity substrate
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-8165-9
– 2 – IEC TS 62878-2-10:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Cavity formation . 5
6 Design guideline . 6
Annex A (informative) Cavity formation examples . 8
A.1 General . 8
A.2 Etching type example . 8
A.3 Laser type example . 9
Figure 1 – Schematic of cavity substate . 6
Figure A.1 – Etching type . 8
Figure A.2 – Laser type . 9
Table 1 – Cavity formation types . 6
Table 2 – Cavity substrate drawing designators . 7
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 2-10: Design specification for cavity substrate
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