IEC PAS 62336:2002

Accelerated Moisture Resistance - Unbiased HAST

Used to identify failure mechanisms internal to packages, the unbiased HAST aims at evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

General Information

• Status: Replaced
• Publication Date: 14-Aug-2002
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 09-Mar-2004

Relations

• Replaced By: IEC 60749-24:2004 - Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/PAS 62336
Edition 1.0
2002-08
Accelerated moisture resistance –
Unbiased HAST
PUBLICLY AVAILABLE SPECIFICATION

INTERNATIONAL
ELECTROTECHNICAL
Reference number
COMMISSION
IEC/PAS 62336
JEDEC
STANDARD
Accelerated Moisture Resistance -
Unbiased HAST
JESD22-A118
DECEMBER 2000
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
ACCELERATED MOISTURE RESISTANCE –

UNBIASED HAST
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62336 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1635/PAS 47/1645RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
This PAS shall remain valid for no longer than 3 years starting from 2002-08. The validity may be extended
for a single 3-year period, following which it shall be revised to become another type of normative document,
or shall be withdrawn.
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national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
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IEC shall not be held responsible for identifying any or all such patent rights.

NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and

approved through the JEDEC Board of Directors level and subsequently reviewed and approved

by the EIA General Counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby an JEDEC standard or
publication may be further processed and ultimately become an ANSI/EIA standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC Solid State Technology Association, 2500 Wilson
Boulevard, Arlington, VA 22201-3834, [phone]/7559 or www.jedec.org
Published by
JEDEC Solid State Technology Association 2000
2500 Wilson Boulevard
Arlington, VA 22201-3834
JEDEC Standand No. 22-A118
Page 1
ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST

(From JEDEC Board Ballot JCB-00-56, formulated under the cognizance of the JC-14.1

Subcommittee on Reliability Test Methods for Packaged Devices.)

1 Purpose
The Unbiased HAST is performed for the purpose of evaluating the reliability of non-hermetic
packaged solid-state devices in humid environments. It is a highly accelerated test which
employs temperature and humidity under non-condensing conditions to accelerate the penetration
of moisture through the external protective material (encapsulant or seal) or along the interface
between the external protective material and the metallic conductors which pass through it. Bias
is not applied in this test to ensure the failure mechanisms potentially overshadowed by bias can
be uncovered (e.g. galvanic corrosion). This test is is used to identify failure mechanisms internal
to the package and is destructive.
2Scope
This test method applies primarily to moisture resistance evaluations and robustness testing, and
may be used as an alternative to unbiased autoclave. Samples are subjected to a non-condensing,
humid atmosphere, similar to the JESD-22-A101, "Steady State Temperature, Humidity and Bias
Life Test", but with a higher temperature. For the temperature limits defined by this procedure,
the test will typically generate the same failure mechanisms as those in an unbiased
"85 °C/85%RH" Steady State Humidity Life Test, but caution must be used if higher
temperatures are considered since non-realistic failure modes can be generated. The use of a
non-condensing environment avoids many irrelevant external failures, e.g., pin-to-pin leakage
...