IEC 60749-24:2004

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

The unbiased highly accelerated stress test is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 24: Résistance à l'humidité accélérée - HAST sans polarisation

L' essai de résistance à l'humidité accélérée sans polarisation est réalisé dans le but d'évaluer la fiabilité des dispositifs à l'état solide sous boîtiers non hermétiques dans des environnements humides. Utilise une température et une humidité dans des conditions sans condensation, pour accélérer la pénétration d'humidité à travers le matériau de protection extérieur (agent d'enrobage ou de scellement) ou par l'interface entre le matériau de protection extérieur et les conducteurs métalliques qui le traversent.

General Information

• Status: Published
• Publication Date: 08-Mar-2004
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jul-2004
• Completion Date: 09-Mar-2004

Relations

• Replaces: IEC PAS 62336:2002 - Accelerated Moisture Resistance - Unbiased HAST
• Effective Date: 05-Sep-2023
• Replaces: IEC 60749:1996/AMD2:2001 - Amendment 2 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 05-Sep-2023
• Replaces: IEC 60749:1996 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 05-Sep-2023
• Replaces: IEC 60749:1996/AMD1:2000 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 60749-24
First edition
2004-03
Semiconductor devices –
Mechanical and climatic test methods –
Part 24:
Accelerated moisture resistance –
Unbiased HAST
Reference number
Publication numbering
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INTERNATIONAL IEC
STANDARD 60749-24
First edition
2004-03
Semiconductor devices –
Mechanical and climatic test methods –
Part 24:
Accelerated moisture resistance –
Unbiased HAST
 IEC 2004  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
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PRICE CODE
Commission Electrotechnique Internationale G
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60749-24  IEC:2004(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 24: Accelerated moisture resistance – Unbiased HAST

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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International Standard IEC 60749-24 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces IEC/PAS 62336 published in 2002. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1736/FDIS 47/1746/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

60749-24  IEC:2004(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60749-24  IEC:2004(E)
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 24: Accelerated moisture resistance – Unbiased HAST

1 Scope and object
The unbiased highly accelerated stress testing (HAST) is performed for the purpose of
evaluating the reliability of non-hermetically packaged solid-state devices in humid
environments.
It is a highly accelerated test which employs temperature and humidity under non-condensing
conditions to accelerate the penetration of moisture through the external protective material
(encapsulant or seal) or along the interface between the external protective material and the
metallic conductors which pass through it. Bias is not applied in this test to ensure that the
failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic
corrosion).
This test is used to identify failure mechanisms internal to the package and is destructive.
NOTE This test is a complete rewrite of the test contained in Clause 4C of Chapter 3 of IEC 60749 (1996)
(without bias voltage).
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60749-33, Semiconductor devices – Mechanical and climatic test methods – Part 33:
Accelerated moisture resistance – unbiased autoclave
IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5:
Steady-state temperature humidity bias life test
3 Test apparatus
The test requires a chamber capable of maintaining a specified temperature and relative
humidity under pressure during ramp-up to, and ramp-down from, the specified test
conditions.
3.1 Records
A permanent record of the temperature profile for each test cycle is recommended.
Calibration records shall verify that the equipment avoids condensation on devices under test
(DUTs) hotter than 50 °C during ramp-up and ramp-down for conditions of maximum thermal
mass loading. Calibration records shall verify that, for steady-state conditions and maximum
thermal mass loading, test conditions are maintained within the tolerances specified in
Clause 5.
60749-24  IEC:2004(E) – 5 –
3.2 Devices under stress
Devices under stress shall be placed in the chamber to minimize temperature gradients.
Devices under stress shall be no closer than 30 mm from internal chamber surfaces and shall
not be subjected to direct radiant heat from heaters. If devices are mounted on boards, the
boards should be oriented to minimize interference with vapor circulation.
3.3 Ionic contamination
Care shall be exercised in the choice of any materials introduced into the chamber in order to
minimize release of contamination, and minimize degradation due to corrosion and other
mechanisms. Ionic contamination of the test apparatus shall be controlled to avoid inducing
erroneous failure mechanisms.
3.4 Distilled or deionized water
The supply water shall be distilled or deionized water with a minimum resistivity of 1 × 10 Ωm
(1 megohm-cm) at room temperature shall be used.
4 General requirements
This test method applies primarily to moisture resistance evaluations and robustness testing,
and may be used as an alternative to unbiased autoclave.
...

IEC 60749-24
Edition 1.0 2004-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 24: Accelerated moisture resistance – Unbiased HAST

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 24: Résistance à l’humidité accélérée – HAST sans polarisation

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IEC 60749-24
Edition 1.0 2004-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 24: Accelerated moisture resistance – Unbiased HAST

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 24: Résistance à l’humidité accélérée – HAST sans polarisation

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
K
CODE PRIX
ICS 31.080 ISBN 2-8318-8314-8
– 2 – 60749-24 © CEI:2004
SOMMAIRE
AVANT-PROPOS.4

1 Domaine d'application et objet.10
2 Références normatives.10
3 Appareillage .10
4 Exigences générales .12
5 Conditions d'essai .12
6 Procédure .14
7 Critères de défaillance.16
8 Sécurité.16
9 Résumé.17

Tableau 1 – Température, humidité relative et pression .14

60749-24 © IEC:2004 – 3 –
CONTENTS
FOREWORD.5

1 Scope and object.11
2 Normative references .11
3 Test apparatus .11
4 General requirements .13
5 Test conditions .13
6 Procedure .15
7 Failure criteria .17
8 Safety.17
9 Summary.19

Table 1 – Temperature, relative humidity, and pressure.15

– 4 – 60749-24 © CEI:2004
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
MÉTHODES D'ESSAIS MÉCANIQUES ET CLIMATIQUES –

Partie 24: Résistance à l’humidité accélérée –
HAST sans polarisation
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La Norme internationale CEI 60749-24 a été établie par le comité d'études 47 de la CEI:
Dispositifs à semiconducteurs.
Cette norme annule et remplace la CEI/PAS 62336 publiée en 2002. Cette première édition
constitue une révision technique.
Cette version bilingue, publiée en 2005-11, correspond à la version anglaise.
Le texte anglais de cette norme est issu des documents 47/1736/FDIS et 47/1746/RVD.
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60749-24 © IEC:2004 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 24: Accelerated moisture resistance – Unbiased HAST

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way
...