IEC 60749-21:2004
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21: Brasabilité
L'objet de cette méthode d'essai est de fournir un moyen pour déterminer la brasabilité des sorties des boîtiers de dispositifs qui sont destinées à être fixées sur une autre surface en utilisant de la brasure étain-plomb ou sans-plomb pour réaliser cette fixation. Cette méthode d'essai décrit une procédure pour les essais de brasabilité par "immersion puis examen visuel" des dispositifs à montage en surface (CMS) par trous traversants, axial et en surface, ainsi qu'une procédure optionnelle d'essai de brasabilité pour des CMS pour montage en surface sur carte afin de permettre la simulation du processus de brasage devant être utilisé dans l'application du dispositif. La méthode d'essai fournit également des conditions optionnelles pour le vieillissement. Cet essai est considéré comme destructif sauf indication contraire dans la spécification applicable.
General Information
Relations
Buy Standard
Standards Content (Sample)
INTERNATIONAL IEC
STANDARD 60749-21
First edition
2004-03
Semiconductor devices –
Mechanical and climatic test methods –
Part 21:
Solderability
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
• IEC Web Site (www.iec.ch)
• Catalogue of IEC publications
The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to
search by a variety of criteria including text searches, technical committees
and date of publication. On-line information is also available on recently issued
publications, withdrawn and replaced publications, as well as corrigenda.
• IEC Just Published
This summary of recently issued publications (www.iec.ch/online_news/ justpub)
is also available by email. Please contact the Customer Service Centre (see
below) for further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:
Email: custserv@iec.ch
Tel: +41 22 919 02 11
Fax: +41 22 919 03 00
INTERNATIONAL IEC
STANDARD 60749-21
First edition
2004-03
Semiconductor devices –
Mechanical and climatic test methods –
Part 21:
Solderability
IEC 2004 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 60749-21 IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope.5
2 Test apparatus.5
2.1 Solder bath.5
2.2 Dipping device.5
2.3 Optical equipment.5
2.4 Steam ageing equipment .5
2.5 Lighting equipment.6
2.6 Materials.6
2.6.1 Flux.6
2.6.2 Solder.6
2.7 SMD reflow equipment.7
2.7.1 Stencil or screen.7
2.7.2 Rubber squeegee or metal spatula .7
2.7.3 Test substrate.7
2.7.4 Solder paste.7
2.7.5 Reflow equipment.8
2.7.6 Flux removal solvent.8
3 Procedure.8
3.1 Preconditioning .8
3.1.1 Preconditioning by steam ageing .8
3.1.2 Preconditioning by high temperature storage .9
3.2 Procedure for dip and look solderability testing .9
3.2.1 Solder dip conditions.10
3.2.2 Procedure.10
3.3 Procedure for simulated board mounting reflow solderability testing of SMDs.16
3.3.1 Test equipment set-up.17
3.3.2 Specimen preparation and surface condition .18
3.3.3 Visual inspection.19
4 Summary.19
Bibliography.20
Figure 1 – Areas to be inspected for gullwing packages.13
Figure 2 – Areas to be inspected for J-lead packages .14
Figure 3 – Areas to be inspected in rectangular components (SMD method) .15
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) .16
Figure 5 – Flat peak type reflow profile .18
Table 1 – Steam ageing conditions .8
Table 2 – Altitude versus steam temperature .9
Table 3 – Solder dip test conditions .10
Table 4 – Maximum limits of solder bath contaminant .12
60749-21 IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 21: Solderability
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-21 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces IEC/PAS 62173 published in 2000. This first edition
constitutes a technical revision.
This part of IEC 60749 series completes the full revision of IEC 60749 (1996).
The text of this standard is based on the following documents:
FDIS Report on voting
47/1741/FDIS 47/1749/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
– 4 – 60749-21 IEC:2004(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
2006. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60749-21 IEC:2004(E) – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 21: Solderability
1 Scope
This part of IEC 60749 establishes a standard procedure for determining the solderability of
device package terminations that are intended to be joined to another surface using tin-lead
(SnPb) or lead-free (Pb-free) solder for the attachment.
This test method provides a procedure for ‘dip and look’ solderability testing of through hole,
axial and surface mount devices (SMDs) as well as an optional procedure for a board
mounting solderability test for SMDs for the purpose of allowing simulation of the soldering
process to be used in the device application. The test method also provides optional
conditions for ageing.
This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semi-
conductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering
process. Reference should be made IEC 60749-15 or IEC 60749-20.
NOTE 3 This mechanical and climatic test method as it relates to solderability, is a complete rewrite of the test
contained in Subclause 2.1 of Chapter 2 of IEC 60749 (1996).
2 Test apparatus
This test method requires the following equipment.
2.1 Solder bath
The solder bath shall be not less than 40 mm in depth and not less than 300 ml in volume
such that it can contain at least 1 kg of solder. The apparatus shall be capable of maintaining
the solder at the specified temperature within ±5 °C.
2.2 Dipping device
A mechanical dipping device capable of controlling the rates of immersion and emersion of
the terminations and providing a dwell time (time of total immersion to the required depth) in
the solder bath as specified shall be used.
2.3 Optical equipment
An optical microscope capable of providing magnification inspection from 10× to 20× shall be
used.
2.4 Steam ageing equipment
A non-corrodible container and cover of sufficient size to allow the placement of specimens
inside the vessel shall be used. The specimens shall be placed such that the lowest portion of
the specimen is a minimum of 40 mm above the surface of the water. A suitable method of
supporting the specimens shall be improvised using non-contaminating material.
NOTE During steam ageing, the test devices should be located in a manner so as to prevent water (steam
condensate) from dripping on them.
– 6 – 60749-21 IEC:2004(E)
2.5 Lighting equipment
A lighting system shall be used that will provide a uniform, non-glare, non-directional
illumination of the spe
...
IEC 60749-21
Edition 1.0 2004-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 21: Solderability
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 21: Brasabilité
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: csc@iec.ch
Tel.: +41 22 919 02 11
Fax: +41 22 919 03 00
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
ƒ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
ƒ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
ƒ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
ƒ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: csc@iec.ch
Tél.: +41 22 919 02 11
Fax: +41 22 919 03 00
IEC 60749-21
Edition 1.0 2004-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 21: Solderability
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 21: Brasabilité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.080 ISBN 2-8318-8238-9
– 2 – 60749-21 © CEI:2004
SOMMAIRE
AVANT-PROPOS.6
1 Domaine d’application .12
2 Appareillage d’essai .12
2.1 Bain de brasage .12
2.2 Dispositif d'immersion .12
2.3 Equipement optique.12
2.4 Equipement de vieillissement à la vapeur .14
2.5 Equipement d’éclairage .14
2.6 Matières .14
2.6.1 Flux .14
2.6.2 Brasure .14
2.7 Equipement de fusion pour CMS .16
2.7.1 Stencil ou écran .16
2.7.2 Raclette en caoutchouc ou spatule métallique .16
2.7.3 Substrat en céramique.16
2.7.4 Pâte de brasage .18
2.7.5 Equipement de fusion .18
2.7.6 Solvant pour le nettoyage du flux.18
3 Procédure .20
3.1 Préconditionnement.20
3.1.1 Procédure de vieillissement à la vapeur.20
3.1.2 Préconditionnement par stockage à haute température .22
3.2 Procédure pour les essais de brasabilité par immersion et examen visuel .22
3.2.1 Conditions d’immersion dans la brasure .22
3.2.2 Procédure.22
3.3 Procédure pour les essais simulés de brasabilité avec fusion pour le
montage sur carte à CMS.38
3.3.1 Montage de l’équipement d’essai.38
3.3.2 Préparation de l'éprouvette et condition de surface .40
3.3.3 Examen visuel .42
4 Résumé.42
Bibliographie.44
Figure 1 – Zones à contrôler pour les boîtiers en aile de mouette .30
Figure 2 – Zones à contrôler pour les boîtiers à sortie en J.32
Figure 3 – Zones à contrôler pour les composants rectangulaires (Méthode CMS).34
Figure 4 – Zones à contrôler pour les boîtiers SOEIC et QFP (Méthode CMS) .36
Figure 5 – Courbe de fusion pour les types à valeur maximale de température plate .40
60749-21 © IEC:2004 – 3 –
CONTENTS
FOREWORD.7
1 Scope.13
2 Test apparatus .13
2.1 Solder bath.13
2.2 Dipping device.13
2.3 Optical equipment .13
2.4 Steam ageing equipment .15
2.5 Lighting equipment .15
2.6 Materials .15
2.6.1 Flux .15
2.6.2 Solder .15
2.7 SMD reflow equipment .17
2.7.1 Stencil or screen .17
2.7.2 Rubber squeegee or metal spatula .17
2.7.3 Test substrate .17
2.7.4 Solder paste .19
2.7.5 Reflow equipment.19
2.7.6 Flux removal solvent.19
3 Procedure .21
3.1 Preconditioning .21
3.1.1 Preconditioning by steam ageing .21
3.1.2 Preconditioning by high temperature storage .23
3.2 Procedure for dip and look solderability testing .23
3.2.1 Solder dip conditions .23
3.2.2 Procedure.23
3.3 Procedure for simulated board mounting reflow solderability testing of SMDs.39
3.3.1 Test equipment set-up .39
3.3.2 Specimen preparation and surface condition .41
3.3.3 Visual inspection .43
4 Summary.43
Bibliography.45
Figure 1 – Areas to be inspected for gullwing packages.31
Figure 2 – Areas to be inspected for J-lead packages .33
Figure 3 – Areas to be inspected in rectangular components (SMD method) .35
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) .37
Figure 5 – Flat peak type reflow profile .41
– 4 – 60749-21 © CEI:2004
Tableau 1 – Conditions de vieillissement à la vapeur .20
Tableau 2 – Altitude en fonction de la température de vapeur.20
Tableau 3 – Conditions d’essai d’immersion dans la brasure .22
Tableau 4 – Limites maximales de contaminant de bain de brasage .28
60749-21 © IEC:2004 – 5 –
Table 1 – Steam ageing conditions .21
Table 2 – Altitude versus steam temperature .21
Table 3 – Solder dip test conditions .
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.