IEC PAS 62214:2001

Generic performance specification for printed boards

Establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. Aims at allowing the printed board user and supplier flexibility to develop optimum procedures for the manufacture and procurement of printed boards.

General Information

• Status: Withdrawn
• Publication Date: 12-Feb-2001
• Withdrawal Date: 28-Oct-2004
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: WPUB - Publication withdrawn
• Start Date: 31-Oct-2004
• Completion Date: 29-Oct-2004

Standards Content (Sample)

IEC/PAS 62214
Edition 1.0
2001-02
Generic performance specification
for printed boards
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62214
C O MMI S S I O N
The Institute for
Interconnecting
IPC-6011
and Packaging
Electronic Circuits
Generic Performance
Specification for
Printed Boards
IPC-6011
July 1996
A standard developed by the Institute for Interconnecting
Supersedes IPC-RB-276 and Packaging Electronic Circuits
2215 Sanders Road Tel [phone]
Northbrook, Illinois Fax [phone]
60062-6135 URL: http://www.ipc.org

Copyright © 1996, IPC; 2001, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
GENERIC PERFORMANCE SPECIFICATION

FOR PRINTED BOARDS
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the

public and established in an organization operating under given procedures.
IEC-PAS 62214 was submitted by the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) and
has been processed by IEC technical committee 52: Printed circuits. It will be further processed by IEC TC 91:
Electronics assembly technology.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
52/872/PAS 52/882/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and IPC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1996, IPC; 2001, IEC

HIERARCHY OF IPC QUALIFICATION AND

PERFORMANCE SPECIFICATIONS
(6010 SERIES)
IPC-6010
IPC-6011
GENERIC
IPC-6012
IPC-6013
IPC-6014
IPC-6015
IPC-HF-318
RIGID FLEX PCMCIA MCM-L HIGH FREQUENCY
Foreword
IPC’s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging
issues. In this regard document sets are used to provide the total information related to a particular electronic packaging
topic. A document set is identified by a four digit number that ends in zero (0) (i.e., IPC-6010).
This standard is intended to provide information on the generic specifications for printed boards. This information must
also be supplemented by a performance specification that contains the requirements for the chosen technology. When used
together, these documents should lead both manufacturer and customer to consistent terms of acceptability.
This document, combined with one of the performance specifications, form the documentation package which supersedes

the following:
IPC-6012 supersedes IPC-RB-276
IPC-6013 supersedes IPC-RF-245 and IPC-FC-250
As technology changes, a performance specification will be updated, or new focus specifications will be added to the
document set. The IPC invites input on the effectiveness of the documentation and encourages user response through
completion of ‘‘Suggestions for Improvement’’ forms at the end of each document.
ii
July 1996 Copyright © 1996, IPC; 2001, IEC IPC-6011

Acknowledgment
Any Standard involving a complex Performance Specifications Task who assisted in the evolution of this

technology draws material from a Group of the IPC Rigid Printed standard. To each of them, the

vast number of sources. While the Board Committee are shown below, it members of the IPC extend their

principal members of the is not possible to include all of those gratitude.

Rigid Printed Board Performance Specifications Technical Liaison of the

Task Group IPC Board of Directors
Committee
Chairman Chairman
Bob Neves Phil Hinton Ron Underwood

Microtek Lab. Hinton & Associates Circuit Center
Performance Specifications Task Group
Aagesen, Robyn, Zycon Corporation Fawcett, Donna, Zycon Corporation Landolt, Roger, Enthone-OMI Inc.
Anderson, William, Electronic Fielder, Peter, BFGoodrich Specialty Laws, Douglas, Lucent Technologies
Industries Holding Chemicals Inc.
Lung, Billy, AT&T Network Systems
Andrade, Arnold, Sandia Laboratories Freed, Donald, Amp+Akzo Company
Livermore
Maguire, James, Boeing Defense &
Gandhi, Mahendra, Hughes Aircraft
Space Group
Araktingi, Ivan, AlliedSignal Co.
Laminate Systems
Malewicz, Wesley, Siemens Medical
Greenleaf, Lisa, Teradyne Circuits
Electronics
Baggett, Nanci, Texas Instruments Operations
Inc.
Mansilla, Susan, Robisan Laboratory
Harford, Lyle, Texas Instruments Inc.
Inc.
Bainbridge, Leslie, Automata Inc.
Hawken, David, IBM Corp./Endicott
Memis, Irving, IBM Corp./Endicott
Bayes, Martin, Shipley Co. Electronic Packaging
Electronic Packaging
Bergum, Erik, Polyclad Laminates Heidelberg, Andrew, Micron Custom
Menuez, Peter, Proto Circuit Inc.
Inc. Mfg. Services Inc.
Mielczarek, Lester, CAE Electronics
Birch, Bill, Digital Equipment of Herrberg, Steven, Magnavox
Ltd.
Canada Ltd. Electronic Systems Co.
Miller, Kelly, CAE Electronics Ltd.
Bowles, Scott, Sovereign Circuits Hinton, Phillip, Hinton ‘‘PWB’’
Inc. Engineering
Mulcahy, Joseph, Methode
Electronics Inc. East
Canarr, Leslie, Rockwell International Hirasaka, Kazuo, Eastern Company
Nakada, Davy, Nissei Sangyo
Cantwell, Dennis, Printed Circuits Ho, Ivan, Ciba-Geigy Corp.
America Ltd.
Inc.
Holmes, Robert, Lucent Technologies
Nayler, Rob, Bath Scientific Limited
Chen, Pei-Liang, Shanghai Inc.
Printronics Circuit
Neves, Robert, Microtek Laboratories
Hook, Lorraine, Dynamic Circuits
Currier, Dal, Ambitech Inc. Inc.
Olsen, Richard, Continental Circuits
Corp.
Czochanski, Jack, Lucent Jones, Ted, U.S. Navy
Technologies Inc.
Piotrowski, Elizabeth, MacDermid
Kelly, John, Motorola Inc.
Inc.
Deng, Yong, Owens-Corning
Kemp, Cindy, Lockheed Martin
Fiberglass Corp.
Provancher, Ron, Kaiser Electronics
Corporation
Douglas, Richard, Douglas &
Reardon, Edward, Morton Electronic
Knapp, Clarence, Litton Guidance &
Associates
Materials
Control Systems
Dupriest, C. Don, Loral Vought
Reed Randy, Merix Corporation
Kolonchuk, Raymond, Defense
Systems
Electronic Supply Center Rudolph, Mona, Dynamic Circuits
Dzigan, Hillel, Eltek Ltd. Inc.
Korchynsky, Stephen, Lockheed
Edwards, Theodore, Honeywell Inc. Martin Federal Systems
Salerno, David, Advanced
Interconnection Technology
Edwards, Will, Lucent Technologies Kotecki, George, Northrop Grumman
Inc. Corporation Sauer, Earl, Lucent Technologies Inc.
iii
Copyright © 1996, IPC; 2001, IEC
IPC-6011 July 1996
Scherff, Roddy, Texas Instruments Stephens, John, Test Technology Turner, James (Tom), isola USA

Inc. International
Vandenhogen, Jim, Plexus Corp.

Schneider, Darrell, Allen-Bradley Swartzell, James, Atotech USA Inc.

Virmani, Nick, NASA/Goddard
Company Inc.
Tetter, Daniel, Hughes Network Space Flight Center
Selk, Kenneth, TRW Systems
Vosburg, Vivian, IPC
Slanina, Joseph, AlliedSignal Thompson, Ronald, U.S. Navy
Watts, Nicholas, Merix Corporation

Aerospace
Toman, George, Circuit Center Inc.
White, David, Input/Output Inc.

Smedley, Grant (Rick), Texas
Tucker, Dwayne, McDonnell Douglas

Wright, Chester, Teledyne Electronic
Instruments Inc.
Aerospace
Technologies
iv
Copyright © 1996, IPC; 2001, IEC
July 1996 IPC-6011
Table of Contents
1.0 SCOPE. 1 4.0 QUALITY ASSURANCE PROVISIONS. 4

1.1 Statement of Scope. 1 4.1 Responsibility for Inspection. 4

1.2 Performance Classes . 1 4.1.1 Test Equipment and Inspection Facilities . 4

1.3 Dimensions and Tolerances . 1 4.1.2 Contract Services . 4

1.3.1 Acceptability When Limiting Values Are 4.2 Materials Inspection. 4

Specified. 1
4.3 Quality Conformance Inspection. 4

1.3.2 Rounding Convention. 1
4.3.1 Inspection of Product for Delivery . 4

1.4 Interpretation. 1
4.3.2 Quality Conformance. 4
1.5 Contractual Agreements. 1
4.4 Reliability Test and Evaluation . 4
4.4.1 Noncompliance . 4
2.0 APPLICABLE DOCUMENTS. 1
2.1 IPC . 2
5.0 PREPARATION FOR DELIVERY. 4
2.2 International Standards Organization . 2 5.1 Packaging . 4
3.0 REQUIREMENTS . 2 6.0 NOTES . 5
3.1 General . 2 6.1 Statistical Process Control (SPC). 5
3.2 Terms and Definitions. 2 6.1.1 Reduction of Quality Conformance Testing . 5
3.2.1 Printed Board Procurement Documentation . 2 6.1.2 Audit Plan . 5
3.3 Printed Board Detail Requirements . 2
APPENDIX A . 6
3.3.1 Production Master. 2
3.4 Deviations and Waivers . 2
Tables
3.5 Order of Precedence . 2
Table A−1 Printed Circuit Fabrication—Potential Cause
3.6 Qualification Assessment. 3
and Effect Matrix . 8
3.6.1 Self Declaration . 3
3.6.2 Verification of Product Characteristics in the
Self Declaration . 3
3.6.3 Verification of Quality Profile in
Self Declaration . 3
3.6.4 Verification of Product Performance
Characteristics in Self Declaration. 3
3.7 Quality Assurance Program. 3
3.7.1 Process Control. 4
3.8 Material . 4

v
Copyright © 1996, IPC; 2001, IEC
July 1996 IPC-6011
Generic Performance Specification

for Printed Boards
1.0 SCOPE
to this specification, an observed value shall be rounded off

to the nearest 0.1 mm, 0.01 mm, 0.001 mm if metric units
1.1 Statement of Scope This specification establishes

are used [to the nearest 0.1 inch, 0.01 inch, 0.001 inch if
the general requirements for printed boards and the quality

English units are used], and compared to the specified lim-
and reliability assurance requirements that must be met for

iting value. Rounding applies to both maximum and mini-
their acquisition. The intent of this specification is to allow

mum values.
the Printed Board user and supplier flexibility to develop
1.3.2 Rounding Convention When a figure is to be
optimum procedures for the Manufacture and Procurement
rounded to fewer digits than the total number available, the
of Printed Boards.
procedure shall be as follows:
1.2 Performance Classes Three general classes have
a) When the first digit discarded is less than 5, the last
been established to reflect progressive increases in sophis-
digit retained should not be changed. For example,
tication, functional performance requirements and testing/
3.4634, if rounded to 4 digits would be 3.463; if
inspection frequency. It should be recognized that there
rounded to three digits, 3.46.
may be an overlap of equipment categories in different
b) When the first digit discarded is greater than 5, or if
classes. The user has the responsibility to specify in the
it is a 5 followed by at least one digit other than 0,
contract or purchase order the performance class required
the last digit retained should be increased by one
for
...