IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique pour matériaux de base

L’IEC 61189-2-801:2023 spécifie une méthode d’essai à suivre pour évaluer la performance thermique par chauffage d’encre à base de carbone. La méthode utilise un motif sérigraphié d’encre à base de carbone pour déterminer la performance thermique d’une couche diélectrique sur une plaque de base métallique.

General Information

• Status: Published
• Publication Date: 25-Jul-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 24-Aug-2023
• Completion Date: 26-Jul-2023

Standards Content (Sample)

IEC 61189-2-801 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-801: Thermal conductivity test for base materials

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 2-801: Essai de conductivité thermique pour matériaux de base
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IEC 61189-2-801 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-801: Thermal conductivity test for base materials

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 2-801: Essai de conductivité thermique pour matériaux de base

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-7258-9

– 2 – IEC 61189-2-801:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Applicability and use of data . 5
5 Test specimens . 5
5.1 Number . 5
5.2 Form . 5
5.3 Preparation of the test specimen . 6
6 Materials and equipment. 8
7 Procedure . 9
7.1 Pre-conditioning . 9
7.2 Test conditions . 9
7.3 Equipment set-up . 9
7.4 Equipment calibration . 9
7.5 Test method . 10
8 Calculations . 10
9 Report . 10
Bibliography . 11

Figure 1 – Specimen dimensions . 6
Figure 2 – Location of 0,55 mm hole . 6
Figure 3 – Example of carbon ink deposited on a screen prior to printing . 7
Figure 4 – Specimen after first screen printing . 7
Figure 5 – Finished specimen . 8
Figure 6 – Set-up of the sensor calibration . 10

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-801: Thermal conductivity test for base materials

FOREWORD
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IEC 61189-2-801 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1757/CDV 91/1862/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-801:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
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A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
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