IEC 60748-23-4:2002

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

Serves as a Blank Detail Specification for a high quality approval system and contains requirements for style and layout and minimum content of detail specifications. These requirements are applicable when the detail specification is published.

General Information

• Status: Published
• Publication Date: 16-May-2002
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 7 - TC 47/SC 47A/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jun-2002
• Completion Date: 17-May-2002

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60748-23-4
QC 165000-4
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-4:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Blank detail specification
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-4:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Spécification particulière cadre
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
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INTERNATIONAL IEC
STANDARD
60748-23-4
QC 165000-4
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-4:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Blank detail specification
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-4:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Spécification particulière cadre
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
R
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60748-23-4  IEC:2002(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-4: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Blank detail specification
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60748-23-4 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the European standard EN 165000-4 and the following
documents:
FDIS Report on voting
47A/641/FDIS 47A/652/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
IEC 60748-23-4 should be read in conjunction with Parts 23-1, 23-2 and 23-3.
The QC number that appears on the front cover of this publication is the specification number
in the IEC Quality Assessment System for Electronic Components (IECQ).

60748-23-4  IEC:2002(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until
2006. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60748-23-4  IEC:2002(E)
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-4: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Blank detail specification
1 General
1.1 Scope
This part of IEC 60748 serves as a Blank Detail Specification (BDS) for a high quality
approval system and contains requirements for style and layout and minimum content of detail
specifications. These requirements are applicable when the detail specification is published
(e.g. for standard product).
1.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60748-23-1:2002, Semiconductor devices – Integrated circuits – Part 23-1: Hybrid
integrated circuits and film structures – Manufacturing line certification – Generic specification
IEC 60748-23-2:2002, Semiconductor devices – Integrated circuits – Part 23-2: Hybrid
integrated circuits and film structures – Manufacturing line certification – Internal visual
inspection and special tests
IEC 60748-23-3:2002, Semiconductor devices – Integrated circuits – Part 23-3: Hybrid
integrated circuits and film structures – Manufacturing line certification – Manufacturers' self
audit check list and report
2 Guidance for preparation of a detail specification
The front page layout is illustrated. When the detail specifications for customer circuits are not
published, the layout requirements of the blank detail specification are optional. A suggested
front page layout is also illustrated. An example of a Customer Detail Specification (CDS) is
also given.
The numbers between square brackets on the front page of the blank detail specification
illustrated correspond to the following indications which should be given:
[1] The name of the National Standards Organization under whose authority the detail
specification is published and, if applicable, the organization from whom the detail
specification is available.
[2] The IECQ number of the detail specification.
[3] The number and issue number of the IEC generic or sectional specification as relevant;
also national reference if different.
[4] If different from the IEC number, the national number of the detail specification, date of
issue and any further information required by the national system, together with any
amendment numbers.
60748-23-4  IEC:2002(E) – 5 –
[5] A brief description of the technology and the type or function of the hybrid circuit.
[6] Information on typical construction (where applicable).
[7] An outline drawing with main dimensions which are of importance for interchangeability
and/or reference to the appropriate national or international document for outlines.
Alternatively, this drawing may be given in an annex to the detail specification.
[8] The product assessment level schedule number covered by the detail specification.
[9] Reference data giving information on the most important properties of the circuit which
allow comparison between the various circuit types intended for the same, or for similar
applications.
– 6 – 60748-23-4  IEC:2002(E)
Layout of Blank Detail Specification (BDS)
FRONT PAGE FOR STANDARD CATALOGUE CIRCUITS
Specification available from:                [1] IEC 60748-23 [2]
Page 1 of
Electronic components of assessed [2] [4]
quality by Manufacturing Line Certification
Approval in accordance with
Outline and dimensions – (see table 1) [7]
(first angle projection): Thick/thin film          [5]
hybrid integrated
circuit
Encapsulation       [6]
(see note 2)
Product assessment    [8]
level No.
Dimensions in millimetres (see note 1)
NOTE 1 The non-dimensioned details do not affect the performance of the devices.
NOTE 2 State whether the terminations are (not) suitable for soldering.
State whether the terminations are (not) suitable for printed wiring applications.
Information about manufacturers who have components qualified to this detail specification
is available in the current Certified Manufacturing Line Listing.

60748-23-4  IEC:2002(E) – 7 –
FRONT PAGE FOR CUSTOMER CIRCUITS
Customer CDS No.
Issue
Date
Page 1 of
Manufacturer
Electronic components of assessed [3]
quality by Manufacturing Line Certification Type No.
Approval in accordance with:
Outline and dimensions – (see table 1) [7]
(first angle projection): Thick/thin film     [5]
hybrid integrated
circuit
Encapsulation         [6]
(see note 2)
Product assessment     [8]
Dimensions in millimetres (see note 1)
level No.
NOTE 1 The non-dimensioned details do not affect the performance of the devices.
NOTE 2 State whether the terminations are (not) suitable for soldering.
State whether the terminations are (not) suitable for printed wiring applications.

– 8 – 60748-23-4  IEC:2002(E)
3 General data (BDS)
3.1 Recommended methods of mounting
The detail specification shall prescribe the method of mounting to be applied for normal use
and for the application of the vibration and the bump or shock tests. The design of the circuit
may be such that special mounting fixtures are required in its use. In this case the detail
specification shall describe the mounting fixtures and they shall be used in the application of
the vibration and bump or shock tests.
3.2 Dimensions, characteristics and conditions of use
Table 1 – Reference data [9]
Where a range of products has the same basic function and is made in the same tech-
nology and envelope, this table will be used to detail the differences in characteristics.
The detail specification shall contain all information needed to describe adequately:
3.2.1 Performance and design of the circuit
(1) schematic circuit diagram;
(2) resistance and capacitance values, tolerances, matching, tracking, power dissipation, tem-
perature coefficients of resistors/temperature coefficients of capacitors where applicable;
(3) limitations on resistance of conductors where applicable;
(4) test circuit or method and performance limits;
(5) added components (see 6.1.3 of IEC 60748-23-1).
3.2.2 Limiting conditions of use
Examples:
operating temperature range;
storage temperature range;
vibration, shock, bump severities;
climatic category;
maximum voltage.
NOTE Any interrelationship between the details specified in 1.2.1 and 1.2.2 should be stated.
3.2.3 Derating
Where applicable, a derating curve is to be included in this clause.
3.3 Related documents
A list of related documents and issue/date status should be given in this clause.
3.4 Marking
The marking of the circuit and primary package shall be in accordance with the requirements
of clause 5 of IEC 60748-23-1.
The details of the marking of the circuit and primary package shall be given in full.

60748-23-4  IEC:2002(E) – 9 –
3.5 Ordering information
Orders for circuits covered by this specification shall contain the following information:
1) quantity;
2) number of the detail specification with style reference and product assessment level number;
3) function of the circuit, if appropriate;
4) basic functional characteristics with tolerance, if appropriate.
3.6 Additional information (not for inspection purposes)
The detail specification may include information (which is not normally required to be verified
by the inspection procedure) such as circuit diagrams, curves, drawings and notes for the
clarification of the detail specification.
3.7 Additional or increased severities or requirements to those specified in the
product assessment level schedule
These requirements may be specified in section two of the de
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