IEC 62435-5:2017

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5: Dispositifs de puces et plaquettes

L’IEC 62435-5:2017 est applicable au stockage de longue durée des dispositifs de puces et plaquettes et établit le régime et les conditions de stockage pour les puces nues singularisées et les plaquettes partielles ou complètes de puces incluant les puces avec ajout de structures telles que des couches de redistribution et des billes ou des perles de soudure ou d’autres métallisations. La présente partie donne également des lignes directrices pour les exigences spéciales et l’encapsulation primaire destinée à contenir la puce ou les plaquettes à des fins de manipulation. Elle s’utilise habituellement conjointement avec l'IEC 62435-1:2017 pour tout stockage de longue durée de dispositifs dont la durée peut être supérieure à 12 mois, pour un produit destiné à être stocké pendant une durée prolongée.

General Information

• Status: Published
• Publication Date: 19-Jan-2017
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.020 - Electronic components in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 3 - TC 47/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 04-Feb-2017
• Completion Date: 20-Jan-2017

Standards Content (Sample)

IEC 62435-5 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 5: Die and wafer devices
Composants électroniques – Stockage de longue durée des dispositifs
électroniques à semiconducteurs –
Partie 5: Dispositifs de puces et plaquettes

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IEC 62435-5 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor

devices –
Part 5: Die and wafer devices
Composants électroniques – Stockage de longue durée des dispositifs

électroniques à semiconducteurs –

Partie 5: Dispositifs de puces et plaquettes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-3837-0

– 2 – IEC 62435-5:2017 © IEC 2017
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 9
4 Storage requirements . 9
4.1 General . 9
4.2 Assembly data . 9
4.3 Prerequisite for storage. 9
4.4 Damage to die products during long-term storage . 9
4.5 Mechanical storage conditions . 10
4.6 Long-term storage environment . 10
4.7 Recommended inert atmosphere purity . 11
4.8 Chemical contamination . 11
4.9 Vacuum packing . 11
4.9.1 General . 11
4.9.2 Vacuum dry pack . 11
4.10 Positive pressure systems for packing . 11
4.11 Use of packing material having sacrificial properties . 11
4.12 Use of bio-degradable material . 12
4.13 Plasma cleaning . 12
4.14 Electrical effects . 12
4.15 Protection from radiation . 12
4.16 Periodic qualification of stored die products . 12
5 Long-term storage failure mechanisms . 13
6 LTS concerns, method, verification and limitations . 13
6.1 General . 13
6.2 Wafers . 13
6.3 Bare dice . 14
7 Deterioration mechanisms specific to bare die and wafers . 15
7.1 Wire bondability . 15
7.2 Staining . 15
7.3 Topside delamination . 16
8 Specific handling concerns . 16
8.1 Die on wafer film frames . 16
8.2 Devices and dice embossed or punched tape storage . 16
8.3 Handling damage . 16
Annex A (informative) Audit checklist . 17
Bibliography . 20

Table 1 – LTS exposure concerns for wafers . 14
Table 2 – LTS exposure concerns for bare dice . 15
Table A.1 – Planning checklist . 17

– 4 – IEC 62435-5:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 5: Die and wafer devices
FOREWORD
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