IEC 60747-14-1:2000
(Main)Semiconductor devices - Part 14-1: Semiconductor sensors - General and classification
Semiconductor devices - Part 14-1: Semiconductor sensors - General and classification
Describes general items concerning the specifications for sensors which are basically made of semiconductor materials, but also applicable to sensors using dielectric or ferroelectric materials.
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INTERNATIONAL IEC
STANDARD
60747-14-1
First edition
2000-10
Semiconductor devices –
Part 14-1:
Semiconductor sensors –
General and classification
Dispositifs à semiconducteurs –
Partie 14-1:
Capteurs à semiconducteurs –
Généralités et classification
Reference number
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INTERNATIONAL IEC
STANDARD
60747-14-1
First edition
2000-10
Semiconductor devices –
Part 14-1:
Semiconductor sensors –
General and classification
Dispositifs à semiconducteurs –
Partie 14-1:
Capteurs à semiconducteurs –
Généralités et classification
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– 2 – 60747-14-1 © IEC:2000(E)
CONTENTS
Page
FOREWORD . 3
INTRODUCTION .4
Clause
1 Scope . 5
2 Normative references. 5
3 Definitions. 5
4 Semiconductor sensors. 8
5 Classification scheme for semiconductor sensors . 9
60747-14-1 © IEC:2000(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
–––––––––––––
SEMICONDUCTOR DEVICES –
Part 14-1: Semiconductor sensors – General and classification
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-14-1 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/157/FDIS 47E/170/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication remain unchanged until 2005.
At this date, the publication will be
reconfirmed;
withdrawn;
replaced by a revised edition, or
amended.
A bilingual version of this standard may be issued at a later date.
– 4 – 60747-14-1 © IEC:2000(E)
INTRODUCTION
This part of IEC 60747 should be read in conjunction with IEC 60747-1. It provides basic
information on semiconductor
– terminology;
– letter symbols;
– essential ratings and characteristics;
– measuring methods;
– acceptance and reliability.
60747-14-1 © IEC:2000(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 14-1: Semiconductor sensors – General and classification
1 Scope
This part of IEC 60747-14 describes general items concerning the specifications for sensors,
which are the basis for specfications given in other parts of this series for various types of
sensors. Sensors described in this standard are basically made of semiconductor materials;
however, the statements made in this standard are also applicable to sensors using materials
other than semiconductor, for example dielectric and ferroelectric materials.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 60747. For dated references, subsequent
amendments to, or revisions of, any of these publictions do not apply. However, parties to
agreements based on this part of IEC 60747 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of ISO
and IEC maintain registers of currently valid International Standards.
IEC 60721-2-1:1982, Classification of environmental conditions – Part 2: Environmental
conditions appearing in nature – Temperature and humidity
IEC 60721-3-0:1984, Classification of environmental conditions – Part 3: Classification of
groups of environmental parameters and their severities – Introduction
Amendment 1 (1987)
IEC 60747-1:1983, Semiconductor devices – Discrete devices – Part 1: General
3 Definitions
For the purpose of this International Standard, the following definitions apply. This clause
states terms and definitions with letter symbols used for sensors.
3.1
ambient conditions allowed
ambient conditions that may have serious effects on sensor operation such as temperature,
acceleration, vibration, shock, ambient pressure (e.g. high altitudes), moisture, corrosive
mat
...
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