IEC 60749-10:2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:  
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 10: Chocs mécaniques - Dispositif et sous-ensemble

L’IEC 60749-10:2022 est destinée à évaluer les dispositifs à l’état libre et ceux qui sont assemblés à des cartes à câblage imprimé pour être utilisés dans des matériels électriques. Cette méthode est destinée à déterminer la capacité des dispositifs et des sous‑ensembles à résister à des chocs d’une sévérité modérée. L’utilisation de sous‑ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques à celles des dispositifs montés sur des cartes à câblage imprimé. Les chocs mécaniques dus à l’application soudaine de forces ou à de brusques modifications de déplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caractéristiques de fonctionnement, en particulier si les impulsions de choc sont répétitives. Il s’agit ici d’un essai destructif destiné à la qualification des dispositifs.
Cette édition annule et remplace la première édition parue en 2002. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Elle couvre à la fois les composants qui sont fixés sur des cartes à câblage imprimé et ceux qui ne le sont pas;
b) les limites des tolérances ont été modifiées pour l'accélération de crête et la durée d’impulsion;
c) des formules mathématiques ont été ajoutées concernant la variation de vitesse et la hauteur de chute équivalente.

General Information

• Status: Published
• Publication Date: 26-Apr-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 13-May-2022
• Completion Date: 27-Apr-2022

Relations

• Revises: IEC 60749-10:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-10
®

Edition 2.0 2022-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Semiconductor devices – Mechanical and climatic test methods –
Part 10: Mechanical shock – Device and subassembly

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 10: Chocs mécaniques – Dispositif et sous-ensemble

IEC 60749-10:2022-04(en-fr)

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IEC 60749-10

®


Edition 2.0 2022-04




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Semiconductor devices – Mechanical and climatic test methods –

Part 10: Mechanical shock – Device and subassembly



Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 10: Chocs mécaniques – Dispositif et sous-ensemble
















INTERNATIONAL

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COMMISSION


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ICS 31.080.01 ISBN 978-2-8322-1100-4




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– 2 – IEC 60749-10:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 7
5 Procedure . 7
5.1 Apparatus set-up . 7
5.2 Device or subassembly in free-state . 9
5.3 Subassembly in mounted state . 9
5.4 Measurements . 10
6 Failure criteria . 10
7 Summary . 11
Bibliography . 12

Figure 1 – Live-bug orientation with solder spheres of device facing downward in either
free or mounted state . 8
Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either
free or mounted state . 8

Table 1 – Device or subassembly free state test levels . 9
Table 2 – Subassembly mounted state test levels . 10

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IEC 60749-10:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-10 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This standard is based upon JEDEC document JESD22-B110. It is used with permission of the
copyright holder, JEDEC Solid State Technology Association.
This edition cancels and replaces the first edition published in 2002. This edition includes the
following significant technical changes with respect to the previous edition:
a) covers both unattached components and components attached to printed wiring boards;
b) tolerance limits modified for peak acceleration and pulse duration;
c) mathematical formulae added for velocity change and equivalent drop height.

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– 4 – IEC 60749-10:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2752/FDIS 47/2760/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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IEC 60749-10:2022 © IEC 2022 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly



1 Scope
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed
wiring boards for use in electrical equipment. The method is intended to determine the
compatibility of devices and subassemblies to withstand moderately severe shocks. The use of
subassemblies is a means to test devices in usage conditions as assembled to printed wiring
boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced
by handling, transportation or field operation can disturb operating characteristics, particularly
if the shock pulses are repetitive. This is a destructive test intended for device qualification.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
component
constituent part of device or subassembly
Note 1 to entry: Examples include source and drain regions as components of transistors, lead frames and dice as
components of packaged integrated circuits, resistors and integrated circuits as components of printed circuit boards,
motherboards as components of computers, LCD screens as components of monitors, ac and dc components of
complex waveforms, and loops and algorithms as components of software programs.
Note 2 to entry: The classification of an item as a device or a component depends upon the intention of the owner
at the time of classification.
3.2
dead-bug orientation
orientation of a package with the terminals facing upwards
3.3
device
piece of equipment, mechanism, or other entity designed to serve a special purpose or perform
a special function
Note 1 to entry: The term device is often used as an abbreviated reference to the type or types of solid-state devices
that are within the scope of those documents. Context could indicate otherwise; e.g., in the phrase ’the device used
to hold the device under test‘, the first usage of the word ’device‘ refers to a mechanism; the second to a solid-state
device.
Note 2 to entry: The classification of an item as a device or as a component depends upon the intention of the
owner at the time of classification.

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– 6 – IEC 60749-10:2022 © IEC 2022
3.4
equivalent drop height
free-fall drop height from which an object at rest must fall, in vacuum, under standard gravity,
to attain a velocity equal to the velocity change stated in the test specification
Note 1 to entry: This is the theoretical height that will impart the specified velocity change if impact with zero
rebound occurs. This height is provided for reference only in the various service conditions.
3.5
free state
state in which a device or subassembly is rigidly attached to the test apparatus so that the full
specified shock level is transmitted to the device or subassembly body
3.6
live-bug orientation
orientation of a package when resting on its terminals
3.7
mounted state
state in which a subassembly is supported by a test fixture that allows flexure to simulate usage
conditions and in a manner such that the full specified shock level is transmitted to the
subassembly body
3.8
peak acceleration
maximum acceleration during the dynamic motion of the sample under test
3.9
pulse duration
t
d
time interval between the instant when the acceleration first reaches 10 % of its specified peak
level and the instant when the acceleration first returns to 10 % of the specified peak level after
having reached that peak level
Note 1 to entry: The basic frequency of the pulse is 1/2 × t .
d
3.10
service condition
designation for the severity of stress
3.11
subassembly
printed circuit board and the devices assembled thereon that form a unit or segment of electrical
equipment
Note 1 to entry: Devices are preferably located near the centre of the printed circuit board.
3.12
velocity change
integral of the acceleration interval over the duration of the entire shock event including at least
the pulse duration interval
3.13
vertical direction
direction that is parallel with gravity, i.e., normal to the normalized surface of the earth

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IEC 60749-10:2022 © IEC 2022 – 7 –
4 Apparatus
The shock-testing apparatus shall be capable of providing shock pulses with a peak
2
acceleration of up to 29 000 m/s , a velocity change of 1,00 m/s to 5,44 m/s and a pulse
duration between 0,3 ms and 8,0 ms to the body of the device. For free-state testing, a velocity
change of 1,25 m/s to 5,44 m/s and a pulse duration between 0,3 ms and 2,0 ms is sufficient.
Conversely, for mounted-state testing, apparatus capable of a velocity change of 1,00 m/s to
5,44 m/s and a pulse duration between 5,0 ms and 8,0 ms to the body of the device is sufficient.
The acceleration pulse shall be a half-sine waveform with an allowable deviation from specified
peak acceleration not greater than ± 10 %. The test velocity change shall be ± 10 % of the
specified level. The pulse duration shall be measured between the points at 10 % of the peak
acceleration during rise time and 10 % of the peak acceleration during decay time. Absolute
tolerances of the pulse duration shall be ± 15 % of the specified duration. The test equipment
transducer shall have a natural frequency greater than 5 times the frequency of the shock pulse
being established, and measured through a low-pass filter having a bandwidth greater than
5 times the frequency of the shock pulse being established. Filtering shall not be used in lieu
of good measurement setup and procedure practices.
Appropriate equipment calibration shall be considered prior to any testing to ensure
conformance to the specified targets and acceptable tolerances. Reserving a set of known good
units is recommended for pre-test calibration exercise whenever new samples are to be tested.
If calibration tests are conducted regularly, then following periodical preventive maintenance
should suffice for the equipment to meet the target and tolerance limits.
5 Procedure
5.1 Apparatus set-up
The shock-testing apparatus shall be attached to a sturdy laboratory table or equivalent base
and levelled before use. Means shall be provided to prevent the shock from being repeated due
to “bounce” in the apparatus. In the free state unless otherwise specified, the device or
subassembly shall be subjected to a total of 30 shocks, which are five shock pulses of the peak
acceleration, velocity change and pulse duration specified in the selected service condition (see
Table 1) in each of the positive and negative directions of three orthogonal axes (X, Y and Z).
If shock testing is required in the mounted state, the subassembly shall be subjected to a total
of 12 shocks, which are two shock pulses of the peak acceleration, velocity change and pulse
duration specified in the selected service condition (see Table 2) in each of the positive and
negative directions of three orthogonal axes (X, Y and Z). Figure 1 and Figure 2 define the
device orientation, positive and negative directions for the three orthogonal axes.
The values associated with the service conditions of Table 1 and Table 2 are related by the
following formulae:
2At
p
(1)
Δv=
π

2
0,5 ∆v
( )
(2)
H=
9,81

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– 8 – IEC 60749-10:2022 © IEC 2022
where
Δv is the velocity change,
A is the acceleration level (peak),
t is the duration of pulse,
p
H is the equivalent drop height.

Figure 1 – Live-bug orientation with solder spheres of device facing
downward in either free or mounted state

Figure 2 – Dead-bug orientation with solder spheres of device
facing upward in either free or mounted state
There are two types of tests that can be performed, based on the test information needed. One
is testing of a device or subassembly in the free-state, and another is testing of a subassembly
in a mounted-state.
Devices or subassemblies subjected to the test shall be randomly selected and typical of
production. In the free-state, the device or subassembly shall be rigidly attached to the test
apparatus, so that the full specified shock level is transmitted to the device or subassembly
body. If the mounted state test is performed, the method of mounting to the test apparatus shall
be typical of the usage condition. If device or subassembly rework, reuse, remounting, burn in,
or other stressful process is possible, such a process or processes shall be applied to the
device or subassembly prior to the shock test. Use of such processes in the test hardware
preparation shall be documented.

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IEC 60749-10:2022 © IEC 2022 – 9 –
5.2 Device or subassembly in free-state
Devices or subassemblies to be tested in the free state shall be subjected to at least one of the
service conditions (A to H) shown in Table 1, which shall be documented. The designated shock
shall be applied to the device or subassembly body in a manner to simulate expected impacts
during processing, packaging, and shipment. The device or subassembly shall be rigidly
attached to the test apparatus in such a manner that it experiences the full-specified shock level
at the device or subassembly body. At least five shocks in each of two directions of three
orthogonal axes shall be applied (minimum total of 30 shocks) at the severity of the designated
service condition.
Table 1 – Device or subassembly free state test levels
Acceleration level Equivalent drop
Duration of pulse Velocity change
a
height
(peak)
Test condition
2
(g) ms m/s m
m/s
H 28 450 (2 900) 0,3 5,43 1,50
G 19 620 (2 000) 0,4 4,99 1,27
B 14 720 (1 500) 0,5 4,68 1,12
F 8 830 (900) 0,7 3,93 0,79
A 4 910 (500) 1,0 3,12 0,50
E 3 340 (340) 1,2 2,55 0,33
D 1 960 (200) 1,5 1,87 0,18
C 980 (100) 2,0 1,25 0,08
a 2
 g, standard gravity has a value of 9,81 m/s and multiples of g are used as an alternative unit of acceleration
level

5.3 Subassembly in mounted state
If required, subassemblies shall also be tested in a mounted state, subject to at least one of
the service conditions (1 to 14) shown in Table 2, which shall be documented. The designated
shock shall be applied to the subassembly mounted to the test apparatus with fixtures that allow
flexure to simulate the usage conditions, and in a manner such that the full specified shock
level is transmitted to the subassembly body. Preferred methods to support the subassembly
are a slotted/clamping 'picture frame', or a raised-boss bolted fixture with contact points in four
regions not closer than one inch from any device. The subassembly, supporting method, test
fixture mounting dimensions, and one or more of the lowest resonant frequencies of the
subassembly shall be documented. At least two shocks in each of two directions of three
orthogonal axes shall be applied (minimum total of 12 shocks) at the severity of the designated
service condition.
The optimum test is performed when the subassembly is mounted in a manner that simulates
the application configuration. If that information is unknown or unavailable, a recommended
printed wiring board for testing the device(s) of the subassembly is the JEDEC standard thermal
card (as described in JEDEC Standards JESD51-9, JESD51-10, and JESD51-11), which shall
be modified to include device and connection functionality circuitry.
Alternately, if the size or construction of the JEDEC thermal card is not suitable for the given
device(s), a printed wiring board shall be used with the dimensions, materials, and construction
typical for the device subassembly usage, and shall include electrical circuitry to test for
functionality, continuity, and damage of the device on the subassembly. The dimensions and
construction of the printed wiring board shall be documented. Test results using subassembly
application hardware are most relevant and should take precedence over results obtained using
test vehicles.

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– 10 – IEC 60749-10:2022 © IEC 2022
Table 2 – Subassembly mounted state test levels
Acceleration level
Equivalent drop
Duration of pulse Velocity change
a
(peak) height
Test condition
2 a

m/s (g) ms m/s m
1 1 070 (109) 8.0 5,44 1,51
2 1 060 (108) 7.5 5,06 1,30
3 1 050 (107) 7.0 4,68 1,11
4 1 030 (105) 6.5 4,26 0,93
5 1 010 (103) 6.0 3,86 0,76
6 932 (95) 5.8 3,44 0,60
7 844 (86) 5.6 3,01 0,46
8 706 (72) 5.4 2,43 0,30
9 657 (67) 5.3 2,22 0,25
10 598 (61) 5.2 1,98 0,20
11 530 (54) 5.1 1,72 0,15
12 441 (45) 5.0 1,40 0,10
13 383 (39) 5.0 1,22 0,08
14 314 (32) 5.0 1,00 0,05
a 2
 g, standard gravity has a value of 9,81 m/s and multiples of g are used as an alternative unit of acceleration
level

5.4 Measurements
Hermeticity tests, if required, visual examination and electrical measurements (consisting of
parametric and functional tests) shall be performed.
6 Failure criteria
A device or subassembly shall be considered as a failure if hermeticity requirements, where
applicable, cannot be demonstrated, if parametric limits are exceeded or if functionality cannot
be demonstrated under the conditions specified in the applicable procurement document.
Mechanical damage, such as cracking, chipping or breaking of portions of the device shall also
be considered a failure provided such damage was not caused by fixturing or handling and the
damage is critical to performance in the specific application. Subassembly failure criteria may
include, but are not limited to, solder connections to the printed wiring board, compliant pin
leads, adhesive, encapsulation, or underfill that materially affect device or subassembly
reliability.

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IEC 60749-10:2022 © IEC 2022 – 11 –
7 Summary
The following details shall be specified in the applicable procurement document:
a) test service condition, for each test performed;
b) electrical measurements;
c) sample size and accept number;
d) disposition of failures;
e) hermetic leak rate (if applicable);
f) description of mounted state test vehicle and fixture (if applicable);
g) description of device pre-test stress history (if applicable).

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– 12 – IEC 60749-10:2022 © IEC 2022
Bibliography
JESD22-B110, JEDEC Standard, Mechanical shock – device and subassembly
JESD51-9, JEDEC Standard, Test boards for area array surface mount package thermal
measurements
JESD51-10, JEDEC Standard, Test boards for through-hole perimeter leaded package thermal
measurements
JESD51-11, JEDEC Standard, Test boards for through-hole are array leaded package thermal
measurement

___________

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– 14 – IEC 60749-10:2022 © IEC 2022
SOMMAIRE
AVANT-PROPOS . 15
1 Domaine d’application .
...