IEC 60749-10:2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 10: Chocs mécaniques - Dispositif et sous-ensemble

L’IEC 60749-10:2022 est destinée à évaluer les dispositifs à l’état libre et ceux qui sont assemblés à des cartes à câblage imprimé pour être utilisés dans des matériels électriques. Cette méthode est destinée à déterminer la capacité des dispositifs et des sous‑ensembles à résister à des chocs d’une sévérité modérée. L’utilisation de sous‑ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques à celles des dispositifs montés sur des cartes à câblage imprimé. Les chocs mécaniques dus à l’application soudaine de forces ou à de brusques modifications de déplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caractéristiques de fonctionnement, en particulier si les impulsions de choc sont répétitives. Il s’agit ici d’un essai destructif destiné à la qualification des dispositifs.
Cette édition annule et remplace la première édition parue en 2002. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Elle couvre à la fois les composants qui sont fixés sur des cartes à câblage imprimé et ceux qui ne le sont pas;
b) les limites des tolérances ont été modifiées pour l'accélération de crête et la durée d’impulsion;
c) des formules mathématiques ont été ajoutées concernant la variation de vitesse et la hauteur de chute équivalente.

General Information

• Status: Published
• Publication Date: 26-Apr-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 13-May-2022
• Due Date: 27-Apr-2022
• Completion Date: 27-Apr-2022

Relations

• Revises: IEC 60749-10:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
• Effective Date: 05-Sep-2023
• Revises: IEC 60749-10:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-10 ®
Edition 2.0 2022-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 10: Mechanical shock – Device and subassembly

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 10: Chocs mécaniques – Dispositif et sous-ensemble

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IEC 60749-10 ®
Edition 2.0 2022-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 10: Mechanical shock – Device and subassembly

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 10: Chocs mécaniques – Dispositif et sous-ensemble

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1100-4

– 2 – IEC 60749-10:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 7
5 Procedure . 7
5.1 Apparatus set-up . 7
5.2 Device or subassembly in free-state . 9
5.3 Subassembly in mounted state . 9
5.4 Measurements . 10
6 Failure criteria . 10
7 Summary . 11
Bibliography . 12

Figure 1 – Live-bug orientation with solder spheres of device facing downward in either
free or mounted state . 8
Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either
free or mounted state . 8

Table 1 – Device or subassembly free state test levels . 9
Table 2 – Subassembly mounted state test levels . 10

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly

FOREWORD
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IEC 60749-10 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This standard is based upon JEDEC document JESD22-B110. It is used with permission of the
copyright holder, JEDEC Solid State Technology Association.
This edition cancels and replaces the first edition published in 2002. This edition includes the
following significant technical changes with respect to the previous edition:
a) covers both unattached components and components attached to printed wiring boards;
b) tolerance limits modified for peak acceleration and pulse duration;
c) mathematical formulae added for velocity change and equivalent drop height.

– 4 – IEC 60749-10:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2752/FDIS 47/2760/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly

1 Scope
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed
wiring boards for use in electrical equipment. The method is intended to determine the
compatibility of devices and subassemblies to withstand moderately severe shocks. The use of
subassemblies is a means to test devices in usage conditions as assembled to printed wiring
boards. Mechanical shock due to suddenly applied forces, or
...