Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:  
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 10: Chocs mécaniques - Dispositif et sous-ensemble

L’IEC 60749-10:2022 est destinée à évaluer les dispositifs à l’état libre et ceux qui sont assemblés à des cartes à câblage imprimé pour être utilisés dans des matériels électriques. Cette méthode est destinée à déterminer la capacité des dispositifs et des sous‑ensembles à résister à des chocs d’une sévérité modérée. L’utilisation de sous‑ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques à celles des dispositifs montés sur des cartes à câblage imprimé. Les chocs mécaniques dus à l’application soudaine de forces ou à de brusques modifications de déplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caractéristiques de fonctionnement, en particulier si les impulsions de choc sont répétitives. Il s’agit ici d’un essai destructif destiné à la qualification des dispositifs.
Cette édition annule et remplace la première édition parue en 2002. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Elle couvre à la fois les composants qui sont fixés sur des cartes à câblage imprimé et ceux qui ne le sont pas;
b) les limites des tolérances ont été modifiées pour l'accélération de crête et la durée d’impulsion;
c) des formules mathématiques ont été ajoutées concernant la variation de vitesse et la hauteur de chute équivalente.

General Information

Status
Published
Publication Date
26-Apr-2022
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
27-Apr-2022
Ref Project

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IEC 60749-10
Edition 2.0 2022-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 10: Mechanical shock – Device and subassembly
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 10: Chocs mécaniques – Dispositif et sous-ensemble
IEC 60749-10:2022-04(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60749-10
Edition 2.0 2022-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 10: Mechanical shock – Device and subassembly
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 10: Chocs mécaniques – Dispositif et sous-ensemble
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1100-4

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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60749-10:2022 © IEC 2022
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Apparatus ........................................................................................................................ 7

5 Procedure ........................................................................................................................ 7

5.1 Apparatus set-up .................................................................................................... 7

5.2 Device or subassembly in free-state ....................................................................... 9

5.3 Subassembly in mounted state ............................................................................... 9

5.4 Measurements ...................................................................................................... 10

6 Failure criteria ............................................................................................................... 10

7 Summary ....................................................................................................................... 11

Bibliography .......................................................................................................................... 12

Figure 1 – Live-bug orientation with solder spheres of device facing downward in either

free or mounted state .............................................................................................................. 8

Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either

free or mounted state .............................................................................................................. 8

Table 1 – Device or subassembly free state test levels ........................................................... 9

Table 2 – Subassembly mounted state test levels ................................................................. 10

---------------------- Page: 4 ----------------------
IEC 60749-10:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 10: Mechanical shock – Device and subassembly
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 60749-10 has been prepared by IEC technical committee 47: Semiconductor devices. It is

an International Standard.

This standard is based upon JEDEC document JESD22-B110. It is used with permission of the

copyright holder, JEDEC Solid State Technology Association.

This edition cancels and replaces the first edition published in 2002. This edition includes the

following significant technical changes with respect to the previous edition:

a) covers both unattached components and components attached to printed wiring boards;

b) tolerance limits modified for peak acceleration and pulse duration;
c) mathematical formulae added for velocity change and equivalent drop height.
---------------------- Page: 5 ----------------------
– 4 – IEC 60749-10:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2752/FDIS 47/2760/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –

Mechanical and climatic test methods, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 6 ----------------------
IEC 60749-10:2022 © IEC 2022 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 10: Mechanical shock – Device and subassembly
1 Scope

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed

wiring boards for use in electrical equipment. The method is intended to determine the

compatibility of devices and subassemblies to withstand moderately severe shocks. The use of

subassemblies is a means to test devices in usage conditions as assembled to printed wiring

boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced

by handling, transportation or field operation can disturb operating characteristics, particularly

if the shock pulses are repetitive. This is a destructive test intended for device qualification.

2 Normative references
There are no normative references in this document.
3 Terms and definitions

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
component
constituent part of device or subassembly

Note 1 to entry: Examples include source and drain regions as components of transistors, lead frames and dice as

components of packaged integrated circuits, resistors and integrated circuits as components of printed circuit boards,

motherboards as components of computers, LCD screens as components of monitors, ac and dc components of

complex waveforms, and loops and algorithms as components of software programs.

Note 2 to entry: The classification of an item as a device or a component depends upon the intention of the owner

at the time of classification.
3.2
dead-bug orientation
orientation of a package with the terminals facing upwards
3.3
device

piece of equipment, mechanism, or other entity designed to serve a special purpose or perform

a special function

Note 1 to entry: The term device is often used as an abbreviated reference to the type or types of solid-state devices

that are within the scope of those documents. Context could indicate otherwise; e.g., in the phrase ’the device used

to hold the device under test‘, the first usage of the word ’device‘ refers to a mechanism; the second to a solid-state

device.

Note 2 to entry: The classification of an item as a device or as a component depends upon the intention of the

owner at the time of classification.
---------------------- Page: 7 ----------------------
– 6 – IEC 60749-10:2022 © IEC 2022
3.4
equivalent drop height

free-fall drop height from which an object at rest must fall, in vacuum, under standard gravity,

to attain a velocity equal to the velocity change stated in the test specification

Note 1 to entry: This is the theoretical height that will impart the specified velocity change if impact with zero

rebound occurs. This height is provided for reference only in the various service conditions.

3.5
free state

state in which a device or subassembly is rigidly attached to the test apparatus so that the full

specified shock level is transmitted to the device or subassembly body
3.6
live-bug orientation
orientation of a package when resting on its terminals
3.7
mounted state

state in which a subassembly is supported by a test fixture that allows flexure to simulate usage

conditions and in a manner such that the full specified shock level is transmitted to the

subassembly body
3.8
peak acceleration
maximum acceleration during the dynamic motion of the sample under test
3.9
pulse duration

time interval between the instant when the acceleration first reaches 10 % of its specified peak

level and the instant when the acceleration first returns to 10 % of the specified peak level after

having reached that peak level
Note 1 to entry: The basic frequency of the pulse is 1/2 × t .
3.10
service condition
designation for the severity of stress
3.11
subassembly

printed circuit board and the devices assembled thereon that form a unit or segment of electrical

equipment

Note 1 to entry: Devices are preferably located near the centre of the printed circuit board.

3.12
velocity change

integral of the acceleration interval over the duration of the entire shock event including at least

the pulse duration interval
3.13
vertical direction

direction that is parallel with gravity, i.e., normal to the normalized surface of the earth

---------------------- Page: 8 ----------------------
IEC 60749-10:2022 © IEC 2022 – 7 –
4 Apparatus

The shock-testing apparatus shall be capable of providing shock pulses with a peak

acceleration of up to 29 000 m/s , a velocity change of 1,00 m/s to 5,44 m/s and a pulse

duration between 0,3 ms and 8,0 ms to the body of the device. For free-state testing, a velocity

change of 1,25 m/s to 5,44 m/s and a pulse duration between 0,3 ms and 2,0 ms is sufficient.

Conversely, for mounted-state testing, apparatus capable of a velocity change of 1,00 m/s to

5,44 m/s and a pulse duration between 5,0 ms and 8,0 ms to the body of the device is sufficient.

The acceleration pulse shall be a half-sine waveform with an allowable deviation from specified

peak acceleration not greater than ± 10 %. The test velocity change shall be ± 10 % of the

specified level. The pulse duration shall be measured between the points at 10 % of the peak

acceleration during rise time and 10 % of the peak acceleration during decay time. Absolute

tolerances of the pulse duration shall be ± 15 % of the specified duration. The test equipment

transducer shall have a natural frequency greater than 5 times the frequency of the shock pulse

being established, and measured through a low-pass filter having a bandwidth greater than

5 times the frequency of the shock pulse being established. Filtering shall not be used in lieu

of good measurement setup and procedure practices.

Appropriate equipment calibration shall be considered prior to any testing to ensure

conformance to the specified targets and acceptable tolerances. Reserving a set of known good

units is recommended for pre-test calibration exercise whenever new samples are to be tested.

If calibration tests are conducted regularly, then following periodical preventive maintenance

should suffice for the equipment to meet the target and tolerance limits.
5 Procedure
5.1 Apparatus set-up

The shock-testing apparatus shall be attached to a sturdy laboratory table or equivalent base

and levelled before use. Means shall be provided to prevent the shock from being repeated due

to “bounce” in the apparatus. In the free state unless otherwise specified, the device or

subassembly shall be subjected to a total of 30 shocks, which are five shock pulses of the peak

acceleration, velocity change and pulse duration specified in the selected service condition (see

Table 1) in each of the positive and negative directions of three orthogonal axes (X, Y and Z).

If shock testing is required in the mounted state, the subassembly shall be subjected to a total

of 12 shocks, which are two shock pulses of the peak acceleration, velocity change and pulse

duration specified in the selected service condition (see Table 2) in each of the positive and

negative directions of three orthogonal axes (X, Y and Z). Figure 1 and Figure 2 define the

device orientation, positive and negative directions for the three orthogonal axes.

The values associated with the service conditions of Table 1 and Table 2 are related by the

following formulae:
2At
(1)
Δv=
0,5 ∆v
( )
(2)
9,81
---------------------- Page: 9 ----------------------
– 8 – IEC 60749-10:2022 © IEC 2022
where
Δv is the velocity change,
A is the acceleration level (peak),
t is the duration of pulse,
H is the equivalent drop height.
Figure 1 – Live-bug orientation with solder spheres of device facing
downward in either free or mounted state
Figure 2 – Dead-bug orientation with solder spheres of device
facing upward in either free or mounted state

There are two types of tests that can be performed, based on the test information needed. One

is testing of a device or subassembly in the free-state, and another is testing of a subassembly

in a mounted-state.

Devices or subassemblies subjected to the test shall be randomly selected and typical of

production. In the free-state, the device or subassembly shall be rigidly attached to the test

apparatus, so that the full specified shock level is transmitted to the device or subassembly

body. If the mounted state test is performed, the method of mounting to the test apparatus shall

be typical of the usage condition. If device or subassembly rework, reuse, remounting, burn in,

or other stressful process is possible, such a process or processes shall be applied to the

device or subassembly prior to the shock test. Use of such processes in the test hardware

preparation shall be documented.
---------------------- Page: 10 ----------------------
IEC 60749-10:2022 © IEC 2022 – 9 –
5.2 Device or subassembly in free-state

Devices or subassemblies to be tested in the free state shall be subjected to at least one of the

service conditions (A to H) shown in Table 1, which shall be documented. The designated shock

shall be applied to the device or subassembly body in a manner to simulate expected impacts

during processing, packaging, and shipment. The device or subassembly shall be rigidly

attached to the test apparatus in such a manner that it experiences the full-specified shock level

at the device or subassembly body. At least five shocks in each of two directions of three

orthogonal axes shall be applied (minimum total of 30 shocks) at the severity of the designated

service condition.
Table 1 – Device or subassembly free state test levels
Acceleration level Equivalent drop
Duration of pulse Velocity change
height
(peak)
Test condition
(g) ms m/s m
m/s
H 28 450 (2 900) 0,3 5,43 1,50
G 19 620 (2 000) 0,4 4,99 1,27
B 14 720 (1 500) 0,5 4,68 1,12
F 8 830 (900) 0,7 3,93 0,79
A 4 910 (500) 1,0 3,12 0,50
E 3 340 (340) 1,2 2,55 0,33
D 1 960 (200) 1,5 1,87 0,18
C 980 (100) 2,0 1,25 0,08
a 2

g, standard gravity has a value of 9,81 m/s and multiples of g are used as an alternative unit of acceleration

level
5.3 Subassembly in mounted state

If required, subassemblies shall also be tested in a mounted state, subject to at least one of

the service conditions (1 to 14) shown in Table 2, which shall be documented. The designated

shock shall be applied to the subassembly mounted to the test apparatus with fixtures that allow

flexure to simulate the usage conditions, and in a manner such that the full specified shock

level is transmitted to the subassembly body. Preferred methods to support the subassembly

are a slotted/clamping 'picture frame', or a raised-boss bolted fixture with contact points in four

regions not closer than one inch from any device. The subassembly, supporting method, test

fixture mounting dimensions, and one or more of the lowest resonant frequencies of the

subassembly shall be documented. At least two shocks in each of two directions of three

orthogonal axes shall be applied (minimum total of 12 shocks) at the severity of the designated

service condition.

The optimum test is performed when the subassembly is mounted in a manner that simulates

the application configuration. If that information is unknown or unavailable, a recommended

printed wiring board for testing the device(s) of the subassembly is the JEDEC standard thermal

card (as described in JEDEC Standards JESD51-9, JESD51-10, and JESD51-11), which shall

be modified to include device and connection functionality circuitry.

Alternately, if the size or construction of the JEDEC thermal card is not suitable for the given

device(s), a printed wiring board shall be used with the dimensions, materials, and construction

typical for the device subassembly usage, and shall include electrical circuitry to test for

functionality, continuity, and damage of the device on the subassembly. The dimensions and

construction of the printed wiring board shall be documented. Test results using subassembly

application hardware are most relevant and should take precedence over results obtained using

test vehicles.
---------------------- Page: 11 ----------------------
– 10 – IEC 60749-10:2022 © IEC 2022
Table 2 – Subassembly mounted state test levels
Acceleration level
Equivalent drop
Duration of pulse Velocity change
(peak) height
Test condition
2 a
m/s (g) ms m/s m
1 1 070 (109) 8.0 5,44 1,51
2 1 060 (108) 7.5 5,06 1,30
3 1 050 (107) 7.0 4,68 1,11
4 1 030 (105) 6.5 4,26 0,93
5 1 010 (103) 6.0 3,86 0,76
6 932 (95) 5.8 3,44 0,60
7 844 (86) 5.6 3,01 0,46
8 706 (72) 5.4 2,43 0,30
9 657 (67) 5.3 2,22 0,25
10 598 (61) 5.2 1,98 0,20
11 530 (54) 5.1 1,72 0,15
12 441 (45) 5.0 1,40 0,10
13 383 (39) 5.0 1,22 0,08
14 314 (32) 5.0 1,00 0,05
a 2

g, standard gravity has a value of 9,81 m/s and multiples of g are used as an alternative unit of acceleration

level
5.4 Measurements

Hermeticity tests, if required, visual examination and electrical measurements (consisting of

parametric and functional tests) shall be performed.
6 Failure criteria

A device or subassembly shall be considered as a failure if hermeticity requirements, where

applicable, cannot be demonstrated, if parametric limits are exceeded or if functionality cannot

be demonstrated under the conditions specified in the applicable procurement document.

Mechanical damage, such as cracking, chipping or breaking of portions of the device shall also

be considered a failure provided such damage was not caused by fixturing or handling and the

damage is critical to performance in the specific application. Subassembly failure criteria may

include, but are not limited to, solder connections to the printed wiring board, compliant pin

leads, adhesive, encapsulation, or underfill that materially affect device or subassembly

reliability.
---------------------- Page: 12 ----------------------
IEC 60749-10:2022 © IEC 2022 – 11 –
7 Summary
The following details shall be specified in the applicable procurement document:
a) test service condition, for each test performed;
b) electrical measurements;
c) sample size and accept number;
d) disposition of failures;
e) hermetic leak rate (if applicable);
f) description of mounted state test vehicle and fixture (if applicable);
g) description of device pre-test stress history (if applicable).
---------------------- Page: 13 ----------------------
– 12 – IEC 60749-10:2022 © IEC 2022
Bibliography
JESD22-B110, JEDEC Standard, Mechanical shock – device and subassembly

JESD51-9, JEDEC Standard, Test boards for area array surface mount package thermal

measurements

JESD51-10, JEDEC Standard, Test boards for through-hole perimeter leaded package thermal

measurements

JESD51-11, JEDEC Standard, Test boards for through-hole are array leaded package thermal

measurement
___________
---------------------- Page: 14 ----------------------
– 14 – IEC 60749-10:2022 © IEC 2022
SOMMAIRE

AVANT-PROPOS .................................................................................................................. 15

1 Domaine d’application .................................................................................

...

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