IEC 62037-5:2013
(Main)Passive RF and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters
Passive RF and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters
IEC 62037-5:2013 defines test fixtures and procedures recommended for measuring levels of passive intermodulation generated by filters, typically used in wireless communication systems. The purpose is to define qualification and acceptance test methods for filters for use in low intermodulation (low IM) applications.
Dispositifs RF et à micro-ondes passifs, mesure du niveau d'intermodulation - Partie 5: Mesure de l'intermodulation passive dans les filtres
La CEI 62037-5:2013 définit les dispositifs et les procédures d'essai recommandés pour mesurer les niveaux d'intermodulation passive générés par les filtres, généralement utilisés dans les systèmes de communication sans fil. L'objectif est de définir des méthodes d'essai de qualification et d'acceptation pour les filtres destinés à être utilisés dans des applications d'intermodulation basse (IM basse).
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IEC 62037-5 ®
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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About the IEC
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International Standards for all electrical, electronic and related technologies.
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IEC 62037-5 ®
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
M
ICS 33.040.20 ISBN 978-2-83220-580-8
– 2 – 62037-5 © IEC:2013(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Abbreviations . 5
4 General comments on PIM testing of filter assemblies . 5
4.1 Sources of error: back-to-back filters . 5
4.2 Environmental and dynamic PIM testing . 6
4.3 General test procedure . 7
5 Example test equipment schematics for filter testing . 7
5.1 General . 7
5.2 Transmit band testing . 7
5.3 Receive band testing: dual high-power carriers . 8
5.4 Receive band testing: injected interferer . 10
Figure 1 – Typical receive band PIM test set-up . 6
Figure 2 – Typical test equipment schematic for measuring transmit-band, forward,
passive IM products on an N-port DUT using two high-power carriers . 8
Figure 3 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using two high-power carriers . 9
Figure 4 – Typical test equipment schematic for measuring receive-band, reverse,
passive IM products on an N-port DUT, using two high-power carriers . 9
Figure 5 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using two high-power carriers . 10
Figure 6 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using the injected interferer technique . 11
Figure 7 – Typical test equipment schematic for measuring receive-band, reverse,
passive IM products on an N-port DUT, using the injected interferer technique . 11
Figure 8 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using the injected interferer technique . 12
Table 1 – Summary table referencing example test equipment schematics for
measuring PIM on filter-type devices . 7
62037-5 © IEC:2013(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –
Part 5: Measurement of passive intermodulation in filters
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62037-5 has been prepared by technical committee 46: Cables,
wires, waveguides, r.f. connectors, r.f. and microwave passive components and accessories.
The text of this standard is based on the following documents:
FDIS Report on voting
46/409/FDIS 46/421/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62037-5 © IEC:2013(E)
A list of all the parts in the IEC 62037 series, published under the general title Passive RF
and microwave devices, Intermodulation level measurement can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
62037-5 © IEC:2013(E) – 5 –
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –
Part 5: Measurement of passive intermodulation in filters
1 Scope
This part of IEC 62037 defines test fixtures and procedures recommended for measuring
levels of passive intermodulation generated by filters, typically used in wireless
communication systems. The purpose is to define qualification and acceptance test methods
for filters for use in low intermodulation (low IM) applications.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62037-1:2012, Passive r.f. and microwave devices, intermodulation level measurement –
Part 1: General requirements and measuring methods
3 Abbreviations
DUT Device under test
IM Intermodulation
PIM Passive intermodulation
4 General comments on PIM testing of filter assemblies
4.1 Sources of error: back-to-back filters
Testing filter assemblies for PIM may be error prone if certain precautionary guidelines are
not followed. Since PIM can be a frequency-dependent phenomena, mathematically related to
the harmonics of the input signals and combinations thereof, consideration should be given
not only to the behaviour of the test set-up under fundamental stimulation, but also its
harmonic performance. In particular, consider a receive-band PIM test set-up as shown in
Figure 1. As shown, this set-up could be used to measure the PIM in a two-port device under
test (DUT); however, the accuracy of the measurement could be in question due to the back-
to-back filters (diplexers) used.
– 6 – 62037-5 © IEC:2013(E)
Back-to-Back
filters
(diplexers)
High-power
Low IM
Tx-band termination
Diplexer Diplexer
signals
2-Port
DUT
Reverse- Forward-
direction, Rx- direction, Rx-
band PIM band PIM
To Rx-band
receiver
IEC 2477/12
Figure 1 – Typical receive band PIM test set-up
While the diplexers certainly appear as a matched load around the fundamental frequencies
and receive-band IM products, they may be very poorly matched at harmonics of the
fundamentals. A poor match will set up a standing wave at the harmonic frequencies which
may re-illuminate any PIM sources within the DUT with higher-than-typical current densities.
Furthermore, the measured IM response will become highly dependent upon the electrical
length of the DUT because the locations of the peaks and valleys of any standing waves will
move with respect to the PIM sources as the electrical length of the DUT changes.
4.2 Environmental and dynamic PIM testing
Environmental and dynamic PIM testing, which may include placing vibrational or thermal
stresses upon filter assemblies while concurrently measuring the PIM produced, may not give
accurate or repeatable results. There are several significant factors affecting the results of
these types of PIM tests.
a) DUT/test system isolation – it is highly desirable that any environmental and dynamic
stresses placed upon a DUT be isolated from the test system such that there are no
measurable residual effects. This not only addresses the practical issues of test system
reliability and maintenance, but it directly affects the issue of measurement repeatability.
That is, should a particular piece
...
IEC 62037-5 ®
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 5: Mesure de l’intermodulation passive dans les filtres
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
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International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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IEC 62037-5 ®
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 5: Mesure de l’intermodulation passive dans les filtres
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX M
ICS 33.040.20 ISBN 978-2-8322-1346-9
– 2 – 62037-5 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Abbreviations . 5
4 General comments on PIM testing of filter assemblies . 5
4.1 Sources of error: back-to-back filters . 5
4.2 Environmental and dynamic PIM testing . 6
4.3 General test procedure . 7
5 Example test equipment schematics for filter testing . 7
5.1 General . 7
5.2 Transmit band testing . 7
5.3 Receive band testing: dual high-power carriers . 8
5.4 Receive band testing: injected interferer . 10
Figure 1 – Typical receive band PIM test set-up . 6
Figure 2 – Typical test equipment schematic for measuring transmit-band, forward,
passive IM products on an N-port DUT using two high-power carriers . 8
Figure 3 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using two high-power carriers . 9
Figure 4 – Typical test equipment schematic for measuring receive-band, reverse,
passive IM products on an N-port DUT, using two high-power carriers . 9
Figure 5 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using two high-power carriers . 10
Figure 6 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using the injected interferer technique . 11
Figure 7 – Typical test equipment schematic for measuring receive-band, reverse,
passive IM products on an N-port DUT, using the injected interferer technique . 11
Figure 8 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using the injected interferer technique . 12
Table 1 – Summary table referencing example test equipment schematics for
measuring PIM on filter-type devices . 7
62037-5 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –
Part 5: Measurement of passive intermodulation in filters
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62037-5 has been prepared by technical committee 46: Cables,
wires, waveguides, r.f. connectors, r.f. and microwave passive components and accessories.
This bilingual version (2014-01) corresponds to the monolingual English version, published in
2013-01.The text of this standard is based on the following documents:
FDIS Report on voting
46/409/FDIS 46/421/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.This publication has been
drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62037-5 © IEC:2013
A list of all the parts in the IEC 62037 series, published under the general title Passive RF
and microwave devices, Intermodulation level measurement can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced b
...
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