IEC 62037-5:2013
(Main)Passive RF and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters
Passive RF and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters
IEC 62037-5:2013 defines test fixtures and procedures recommended for measuring levels of passive intermodulation generated by filters, typically used in wireless communication systems. The purpose is to define qualification and acceptance test methods for filters for use in low intermodulation (low IM) applications.
Dispositifs RF et à micro-ondes passifs, mesure du niveau d'intermodulation - Partie 5: Mesure de l'intermodulation passive dans les filtres
La CEI 62037-5:2013 définit les dispositifs et les procédures d'essai recommandés pour mesurer les niveaux d'intermodulation passive générés par les filtres, généralement utilisés dans les systèmes de communication sans fil. L'objectif est de définir des méthodes d'essai de qualification et d'acceptation pour les filtres destinés à être utilisés dans des applications d'intermodulation basse (IM basse).
General Information
Standards Content (sample)
IEC 62037-5
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 5: Mesure de l’intermodulation passive dans les filtres
IEC 62037-5:2013-01(EN-FR)
---------------------- Page: 1 ----------------------
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IEC 62037-5
Edition 1.0 2013-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Passive RF and microwave devices, intermodulation level measurement –
Part 5: Measurement of passive intermodulation in filters
Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 5: Mesure de l’intermodulation passive dans les filtres
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX M
ICS 33.040.20 ISBN 978-2-8322-1346-9
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical CommissionMarque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – 62037-5 © IEC:2013
CONTENTS
FOREWORD ........................................................................................................................... 3
1 Scope ............................................................................................................................... 5
2 Normative references ....................................................................................................... 5
3 Abbreviations ................................................................................................................... 5
4 General comments on PIM testing of filter assemblies ...................................................... 5
4.1 Sources of error: back-to-back filters ....................................................................... 5
4.2 Environmental and dynamic PIM testing .................................................................. 6
4.3 General test procedure ............................................................................................ 7
5 Example test equipment schematics for filter testing ......................................................... 7
5.1 General ................................................................................................................... 7
5.2 Transmit band testing .............................................................................................. 7
5.3 Receive band testing: dual high-power carriers ....................................................... 8
5.4 Receive band testing: injected interferer ................................................................ 10
Figure 1 – Typical receive band PIM test set-up ...................................................................... 6
Figure 2 – Typical test equipment schematic for measuring transmit-band, forward,
passive IM products on an N-port DUT using two high-power carriers ..................................... 8
Figure 3 – Typical test equipment schematic for measuring receive-band, forward,passive IM products on an N-port DUT, using two high-power carriers .................................... 9
Figure 4 – Typical test equipment schematic for measuring receive-band, reverse,passive IM products on an N-port DUT, using two high-power carriers .................................... 9
Figure 5 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using two high-power carriers ................................................... 10
Figure 6 – Typical test equipment schematic for measuring receive-band, forward,passive IM products on an N-port DUT, using the injected interferer technique ..................... 11
Figure 7 – Typical test equipment schematic for measuring receive-band, reverse,passive IM products on an N-port DUT, using the injected interferer technique ..................... 11
Figure 8 – Typical test equipment schematic for measuring receive-band, passive IM
products on an N-port DUT, using the injected interferer technique ....................................... 12
Table 1 – Summary table referencing example test equipment schematics formeasuring PIM on filter-type devices ...................................................................................... 7
---------------------- Page: 4 ----------------------62037-5 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –
Part 5: Measurement of passive intermodulation in filters
FOREWORD
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62037-5 has been prepared by technical committee 46: Cables,
wires, waveguides, r.f. connectors, r.f. and microwave passive components and accessories.
This bilingual version (2014-01) corresponds to the monolingual English version, published in
2013-01.The text of this standard is based on the following documents:FDIS Report on voting
46/409/FDIS 46/421/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.The French version of this standard has not been voted upon.This publication has been
drafted in accordance with the ISO/IEC Directives, Part 2.---------------------- Page: 5 ----------------------
– 4 – 62037-5 © IEC:2013
A list of all the parts in the IEC 62037 series, published under the general title Passive RF
and microwave devices, Intermodulation level measurement can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 6 ----------------------
62037-5 © IEC:2013 – 5 –
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –
Part 5: Measurement of passive intermodulation in filters
1 Scope
This part of IEC 62037 defines test fixtures and procedures recommended for measuring
levels of passive intermodulation generated by filters, typically used in wireless
communication systems. The purpose is to define qualification and acceptance test methods
for filters for use in low intermodulation (low IM) applications.2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including anyamendments) applies.
IEC 62037-1:2012, Passive r.f. and microwave devices, intermodulation level measurement –
Part 1: General requirements and measuring methods3 Abbreviations
DUT Device under test
IM Intermodulation
PIM Passive intermodulation
4 General comments on PIM testing of filter assemblies
4.1 Sources of error: back-to-back filters
Testing filter assemblies for PIM may be error prone if certain precautionary guidelines are
not followed. Since PIM can be a frequency-dependent phenomena, mathematically related to
the harmonics of the input signals and combinations thereof, consideration should be given
not only to the behaviour of the test set-up under fundamental stimulation, but also its
harmonic performance. In particular, consider a receive-band PIM test set-up as shown in
Figure 1. As shown, this set-up could be used to measure the PIM in a two-port device under
test (DUT); however, the accuracy of the measurement could be in question due to the back-
to-back filters (diplexers) used.---------------------- Page: 7 ----------------------
– 6 – 62037-5 © IEC:2013
Back-to-Back
filters
(diplexers)
High-power
Low IM
Tx-band termination
Diplexer Diplexer
signals
2-Port
DUT
Reverse- Forward-
direction, Rx- direction, Rx-
band PIM band PIM
To Rx-band
receiver
IEC 2477/12
Figure 1 – Typical receive band PIM test set-up
While the diplexers certainly appear as a matched load around the fundamental frequencies
and receive-band IM products, they may be very poorly matched at harmonics of the
fundamentals. A poor match will set up a standing wave at the harmonic frequencies which
may re-illuminate any PIM sources within the DUT with higher-than-typical current densities.
Furthermore, the measured IM response will become highly dependent upon the electrical
length of the DUT because the locations of the peaks and valleys of any standing waves will
move with respect to the PIM sources as the electrical length of the DUT changes.
4.2 Environmental and dynamic PIM testingEnvironmental and dynamic PIM testing, which may include placing vibrational or thermal
stresses upon filter assemblies while concurrently measuring the PIM produced, may not give
accurate or repeatable results. There are several significant factors affecting the results of
these types of PIM tests.a) DUT/test system isolation – it is highly desirable that any environmental and dynamic
stresses placed upon a DUT be isolated from the test system such that there are no
measurable residual effects. This not only addresses the practical issues of test system
reliability and maintenance, but it directly affects the issue of measurement repeatability.
That is, should a particular piece of the test system require replacement after a set
number of trials, then the results of subsequent measurements may be skewed by the
performance of the replaced part.b) Measurement repeatability – it should be possible to repeat the results obtained from a
particular measurement within a specific precision. However, the inherent sensitivity of the
PIM response may prevent a desired precision from being achieved.c) Stress repeatability – the particular stress placed upon the DUT shall be repeatable both
between tests upon the same DUT and tests between different DUTs. However, in the
experience of many, it is likely that the repeatability of the particular stress will be far
worse than that of the particular PIM test results so that the standard specifying the stress
may not be unnecessarily rigorous.Based upon these factors, measuring PIM from a filter assembly whilst it undergoes thermal
or vibrational stresses is not currently recommended.A less vigorous form of dynamic testing may be performed on a filter assembly, in order to
demonstrate that stability of the PIM level is maintained after certain vibrational stresses have
been applied. This style of dynamic test can take the form of tapping the assembly with an
instrument that will not damage the surface of the assembly, such as a length of nylon rod or
hard rubber hammer.---------------------- Page: 8 ----------------------
62037-5 © IEC:2013 – 7 –
4.3 General test procedure
An appropriate test set-up can be selected from the example schematics described in
Clause 4, according to the specific test requirements called for. The procedure is as follows:
a) calibrate the test set-up for correct carrier signal level and IM receiver level as described
in Clause 7 of IEC 62037-1:2012;b) connect the filter DUT in the test set-up;
c) measure the IM performance of the DUT on the receiver.
The results obtained should be expressed in one of the forms indicated in Clause 8 of
IEC 62037-1:2012.5 Example test equipment schematics for filter testing
5.1 General
Several example schematics are presented. Each figure corresponds to a particular test
scenario as indicated in the matrix in Table 1. It will be noted that some of the example
schematics are modifications of the test configurations shown in Figure 1 and Figure 2 of
IEC 62037-1:2012. These modifications allow the operator to satisfactorily perform a range of
tests which are more specific to the requirement of filter assemblies.It is imperative that the residual PIM level of the test system be verified prior to measurement
of the filter assembly. It is strongly recommended that this level be at least 10 dB below the
PIM level requirement of the filter assembly, in order to minimize errors due to the system
itself. This measurement can be carried out in the following example set-ups by precluding the
DUT from the measurement system and monitoring the resultant PIM level under the normal
test conditions. The only systems which deviate slightly from this are Figure 5 and Figure 8
and notes are provided for these two set-ups, indicating the test point at which the system
residual intermodulation distortion can be measured with the DUT removed.Table 1 – Summary table referencing example test equipment schematics
for measuring PIM on filter-type devices
Tx band Rx band
Measurement type 2 high-power carriers 2 high-power carriers 1 high-power carrier +
injected interfererN-port, forward IM Figure 2 Figure 3 Figure 6
N-port, reverse IM Figure 4 Figure 7
N-port, receive port IM Figure 5 Figure 8
Figure 5 and Figure 8 outline equipment set-ups which measure the PIM present at a receive
port of the filter assembly. These set-ups are distinct from those measuring PIM in the reverse
direction (Figure 4 and Figure 7) and can give quite different results. It is therefore important
that consideration is given to using the appropriate measurement system, in order to measure
the required PIM performance.5.2 Transmit band testing
Passive IM testing within the transmit band is typically performed on isolators and other
relatively high PIM components. For this test, two carriers are combined into a single
transmission line and then passed through the DUT. Once these are through the DUT, it is
advisable to sufficiently attenuate the two carriers to prevent the generation of active IM
products and possible damage within the receiver. A low noise amplifier is typically not
---------------------- Page: 9 ----------------------– 8 – 62037-5 © IEC:2013
required due to the high PIM signal levels present from the DUT in these tests. This is
described in Figure 2.Low IM
Power directional
Low IM
RF source f1
coupler
termination
amplifier
N-Port
Combiner
DUT
RF source f2
Thru
IM out
Power
amplifier
Low IM
BP filter
Receiver or
spectrum
analyser
IEC 2478/12
The combiner port-to-port isolation plus band stop/low pass filters should be optimized to set the test bench system
residual to an acceptable level.Consideration should be given to the possible generation of IM products within the receiver/spectrum analyser and
whether a sufficient dynamic range can be obtained. An optional IM band pass filter may be used to allow these
conditions to be met.Unused DUT ports shall be terminated in a matched load.
The low IM directional coupler could alternatively be replaced by an appropriate diplexer.
a) In this instance, it is strongly recommended that the replacement diplexer has a good VSWR in both the Tx
and Rx bands.b) Due to the potentially reflective nature of the replacement diplexer and DUT, it should also be recognized
that there would be a mechanism that supports multipathing.Figure 2 – Typical test equipment schematic for measuring transmit-band, forward,
passive IM products on an N-port DUT using two high-power carriers5.3 Receive band testing: dual high-power carriers
When testing for PIM products in the receive band, a much greater measurement sensitivity is
required than for transmit band testing. For this reason, a low-noise amplifier and bandpass
filter are typically utilized before the measurement receiver (or spectrum analyser).
Example schematics for both forward and reverse PIM testing on N-port devices are shown in
Figure 3, Figure 4 and Figure 5.---------------------- Page: 10 ----------------------
62037-5 © IEC:2013 – 9 –
Low IM
Power directional Low IM
RF source f1
coupler termination
amplifier
Diplexer
N-Port
Combiner
DUT
Power
Thru
RF source f2
amplifier
IM out
Low IM
BP filter
Receiver or
spectrum
analyser
Low noise
IEC 2479/12
amp lifier
The low IM directional coupler could alternatively be replaced by an appropriate diplexer.
a) In this instance, it is strongly recommended that the replacement diplexer has a good VSWR in both the Tx
and Rx bands.b) Due to the potentially reflective nature of the replacement diplexer and DUT, it should also be recognized
that there would be a mechanism that supports multipathing.The combiner and diplexer could alternatively be replaced by an appropriate triplexer.
a) In this instance, it is strongly recommended that the replacement triplexer has a good VSWR in both the
Tx and Rx bands.b) Due to the potentially reflective nature of the replacement triplexer and DUT, it should also be recognized
that there would be a mechanism that supports multipathing.Figure 3 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using two high-power carriers
Power
RF source f1 Low IM
amplifier
termination
Diplexer N-Port
Combiner
DUT
Power
RF source f2
amplifier
Low IM
BP filter
Receiver or
spectrum
analyser
Low noise
amplifier IEC 2480/12
Figure 4 – Typical test equipment schematic for measuring receive-band, reverse,
passive IM products on an N-port DUT, using two high-power carriers
---------------------- Page: 11 ----------------------
– 10 – 62037-5 © IEC:2013
Power
Low IM
RF source f1
amplifier
termination
Diplexer N-Port
Combiner
DUT
Power
RF source f2
amplifier
Receive
Low IM
PIM
BP filter
signal
Receiver or
path
spectrum
analyser
Low noise
IEC 2481/12
amp lifier
Point A can be used as a test point to monitor the system residual level (with the DUT removed). To be terminated
during DUT measurement.The combiner and diplexer could alternatively be replaced by an appropriate triplexer.
a) In this instance, it is strongly recommended that the replacement triplexer has a good VSWR in both the
Tx and Rx bands.b) Due to the potentially reflective nature of the replacement triiplexer and DUT, it should also be recognized
that there would be a mechanism that supports multipathing.Figure 5 – Typical test equipment schematic for measuring receive-band,
passive IM products on an N-port DUT, using two high-power carriers
Remarks to Figure 4 and Figure 5:
1) The combiner port-to-port isolation plus diplexer should be optimized to set the test bench system residual to
an acceptable level.2) Consideration should be given to the possible generation of IM products within the receiver/spectrum analyser
and whether a sufficient dynamic range can be obtained. An optional IM band pass filter plus low noise
amplifier may be used to allow these conditions to be met.3) Due to the potentially reflective nature of the diplexer and DUT, it should be recognized that there is a
mechanism that supports multipathing.4) It is strongly recommended that the diplexer has a good VSWR in both the Tx and Rx bands.
5) Unused DUT ports shall be terminated in a matched load.5.4 Receive band testing: injected interferer
To simulate the PIM performance of filters due to signals originating both internal to the
system and external to the system, injected interferer testing may be performed. For these
tests, one carrier remains at full power. The other carrier is typically reduced in power by
some 20 dB to 40 dB relative to the strongest carrier. Typical test equipment schematics are
shown in Figure 6, Figure 7 and Figure 8.---------------------- Page: 12 ----------------------
62037-5 © IEC:2013 – 11 –
f1 BP filter
Injected interferer carrier
Low IM
load
Power Low IM
RF source f1
termination
amplifier
Diplexer
N-Port
DUT
Power
RF source f2
amplifier
Low IM
dual-Directional
coupler
f2 BP filter
Forward
Low IM
PIM
BP filter
signal
Receiver or
path
spectrum
analyser
Low noise
IEC 2482/12
amp lifier
The low IM dual directional coupler could alternatively be replaced by an appropriate diplexer.
a) In this instance, it is strongly recommended that the replacement diplexer has a good VSWR in both the Tx
and Rx bands.b) Due to the potentially reflective nature of the replacement diplexer and DUT, it should also be recognized
that there would be a mechanism that supports multipathing.Figure 6 – Typical test equipment schematic for measuring receive-band, forward,
passive IM products on an N-port DUT, using the injected interferer technique
f1 BP filter
Injected interferer carrier
Low IM
load
Power Low IM
RF source f1
termination
ampli
...
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