Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are include in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.
This edition includes the following significant technical changes with respect to the previous edition:
- the frequency range of 150 kHz to 1 GHz has been deleted from the title;
- the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
- Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2 of Annex A;
- the general test board description has been moved to Annex D.

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 1: Conditions générales et définitions

IEC 61967-1:2018 est disponible sous forme de IEC 61967-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 61967-1:2018 fournit des informations générales et des définitions sur la mesure des perturbations électromagnétiques conduites et rayonnées par les circuits intégrés. Elle décrit également les conditions de mesure, l'appareillage et le montage d'essai, ainsi que les procédures d'essai et le contenu des rapports d'essai. L'Annexe A fournit des tableaux de comparaison des méthodes d'essai permettant de choisir la ou les méthodes de mesure appropriées. Le présent document a pour objet de définir des conditions générales afin d'établir un environnement d'essai uniforme et d'obtenir une mesure quantitative des perturbations RF par les circuits intégrés (CI). Il décrit les paramètres fondamentaux supposés avoir une incidence sur les résultats des essais. Tout écart par rapport au présent document est consigné de manière explicite dans les rapports d'essai. Les résultats des mesures peuvent être utilisés notamment à des fins de comparaison. La mesure de la tension et du courant des émissions RF conduits ou des perturbations RF rayonnées provenant d'un circuit intégré dans des conditions contrôlées, fournit des informations sur les perturbations RF potentielles dans une application du circuit intégré. La gamme de fréquences applicable est décrite dans chaque partie de l'IEC 61967. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- la gamme de fréquences 150 kHz à 1 GHz a été supprimée du titre;
- un palier de fréquences au-dessus de 1 GHz a été ajouté dans le Tableau 1, le Tableau 2 et au Paragraphe 5.4;
- le Tableau A.1 a été divisé en deux tableaux et l'IEC 61967-8 a été ajoutée au Tableau A.2 de l'Annexe A;
- la description générale de la carte d'essai a été déplacée à l'Annexe D.

General Information

Status
Published
Publication Date
11-Dec-2018
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
12-Dec-2018
Ref Project

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IEC 61967-1
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
IEC 61967-1:2018-12(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61967-1
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6284-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61967-1:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Test conditions .............................................................................................................. 10

4.1 General ................................................................................................................. 10

4.2 Ambient conditions................................................................................................ 10

4.2.1 General ......................................................................................................... 10

4.2.2 Ambient temperature ..................................................................................... 11

4.2.3 Ambient RF field strength .............................................................................. 11

4.2.4 Other ambient conditions ............................................................................... 11

4.2.5 IC stability over time ...................................................................................... 11

5 Test equipment .............................................................................................................. 11

5.1 General ................................................................................................................. 11

5.2 Shielding ............................................................................................................... 11

5.3 RF measuring instrument ...................................................................................... 11

5.3.1 General ......................................................................................................... 11

5.3.2 Measuring receiver ........................................................................................ 11

5.3.3 Spectrum analyser ......................................................................................... 12

5.3.4 Other RBW for narrowband emissions ........................................................... 12

5.3.5 Emission type, detector type and sweep speed .............................................. 12

5.3.6 Video bandwidth ............................................................................................ 12

5.3.7 Verification of calibration for the RF measuring instrument ............................ 12

5.4 Frequency range ................................................................................................... 13

5.5 Preamplifier or attenuator ..................................................................................... 13

5.6 System gain .......................................................................................................... 13

5.7 Other components ................................................................................................ 13

6 Test set-up .................................................................................................................... 13

6.1 General ................................................................................................................. 13

6.2 Test circuit board .................................................................................................. 13

6.3 IC pin loading........................................................................................................ 13

6.4 Power supply requirements – Test board power supply ......................................... 14

6.5 IC specific considerations ..................................................................................... 14

6.5.1 IC supply voltage ........................................................................................... 14

6.5.2 IC decoupling ................................................................................................ 14

6.5.3 Activity of IC .................................................................................................. 14

6.5.4 Guidelines regarding IC operation ................................................................. 14

7 Test procedure .............................................................................................................. 15

7.1 Ambient RF noise check ....................................................................................... 15

7.2 Operational check ................................................................................................. 15

7.3 Specific procedures .............................................................................................. 15

8 Test report ..................................................................................................................... 15

8.1 General ................................................................................................................. 15

8.2 Ambient RF noise ................................................................................................. 15

8.3 Description of device ............................................................................................ 15

8.4 Description of set-up ............................................................................................. 16

---------------------- Page: 4 ----------------------
IEC 61967-1:2018 © IEC 2018 – 3 –

8.5 Description of software ......................................................................................... 16

8.6 Data presentation ................................................................................................. 16

8.6.1 General ......................................................................................................... 16

8.6.2 Graphical presentation ................................................................................... 16

8.6.3 Measurement data ......................................................................................... 16

8.6.4 Data processing ............................................................................................. 16

8.7 RF emission limits ................................................................................................. 16

8.8 Interpretation of results ......................................................................................... 16

8.8.1 Comparison between IC(s) using the same test method ................................. 16

8.8.2 Comparison between different test methods .................................................. 16

8.8.3 Correlation to module test methods ............................................................... 16

Annex A (informative) Test method comparison tables ......................................................... 17

Annex B (informative) Flow chart of a counter test code ....................................................... 19

Annex C (informative) Description of worst-case application software .................................. 20

Annex D (informative) General test board description .......................................................... 21

D.1 General ................................................................................................................. 21

D.2 Board description – Mechanical ............................................................................ 21

D.3 Board description – Electrical ................................................................................ 21

D.4 Ground planes ...................................................................................................... 21

D.5 Package pins ........................................................................................................ 22

D.5.1 General ......................................................................................................... 22

D.5.2 DIL packages ................................................................................................ 22

D.5.3 SOP, PLCC, QFP packages ........................................................................... 22

D.5.4 PGA packages ............................................................................................... 22

D.5.5 BGA packages ............................................................................................... 22

D.6 Via diameters ........................................................................................................ 22

D.7 Via distance .......................................................................................................... 22

D.8 Additional components .......................................................................................... 22

D.9 Supply decoupling................................................................................................. 22

D.9.1 General ......................................................................................................... 22

D.9.2 IC decoupling capacitors ............................................................................... 23

D.9.3 Power supply decoupling for the test board ................................................... 23

D.10 I/O load ................................................................................................................. 23

Bibliography .......................................................................................................................... 25

Figure B.1 – Test code flow chart .......................................................................................... 19

Figure D.1 – Example of an emission test board ................................................................... 24

Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings .......... 11

Table 2 – Spectrum analyser bands and RBW default settings .............................................. 12

Table 3 – IC pin loading recommendations ........................................................................... 14

Table A.1 – Conducted emission ........................................................................................... 17

Table A.2 – Radiated emission ............................................................................................. 18

Table D.1 – Position of vias over the board ........................................................................... 21

---------------------- Page: 5 ----------------------
– 4 – IEC 61967-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 1: General conditions and definitions
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

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agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61967-1 has been prepared by subcommittee 47A: Integrated

circuits, of IEC technical committee 47: Semiconductor devices.

This second edition cancels and replaces the first edition published in 2002. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) the frequency range of 150 kHz to 1 GHz has been deleted from the title;
b) the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;

c) Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2

of Annex A;
d) the general test board description has been moved to Annex D.
---------------------- Page: 6 ----------------------
IEC 61967-1:2018 © IEC 2018 – 5 –
The text of this International Standard is based on the following documents:
FDIS Report on voting
47A/1062/FDIS 47A/1066/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts of the IEC 61967 series, under the general title Integrated circuits –

Measurement of electromagnetic emissions, can be found on the IEC website.

Future standards in this series will carry the new general title as cited above. Titles of existing

standards in this series will be updated at the time of the next edition.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 7 ----------------------
– 6 – IEC 61967-1:2018 © IEC 2018
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 1: General conditions and definitions
1 Scope

This part of IEC 61967 provides general information and definitions on the measurement of

conducted and radiated electromagnetic disturbances from integrated circuits. It also provides

a description of measurement conditions, test equipment and set-up as well as the test

procedures and content of the test reports. Test method comparison tables are included in

Annex A to assist in selecting the appropriate measurement method(s).

The object of this document is to describe general conditions in order to establish a uniform

testing environment and to obtain a quantitative measure of RF disturbances from integrated

circuits (IC). Critical parameters that are expected to influence the test results are described.

Deviations from this document are noted explicitly in the individual test report. The

measurement results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF

disturbances, coming from an integrated circuit under controlled conditions, yields information

about the potential for RF disturbances in an application of the integrated circuit.

The applicable frequency range is described in each part of IEC 61967.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

CISPR 16-1-1, Specification for radio disturbance and immunity measuring apparatus and

Methods – Part 1-1: Radio disturbance and immunity measuring apparatus – Measuring

apparatus
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
artificial network

network presenting a reference load impedance (simulated) to the DUT (e.g. extended power

or communication lines) across which the RF disturbance voltage is measured and which

isolates the apparatus from the power supply or loads in a given frequency range
---------------------- Page: 8 ----------------------
IEC 61967-1:2018 © IEC 2018 – 7 –
Note 1 to entry: This note applies to the French language only.
3.2
associated equipment

transducers (e.g. probes, networks and antennae) connected to a measuring receiver or test

generator, also transducers used in the signal or disturbance transmission path between a

DUT and measuring equipment or a (test-) signal generator
3.3
broadband disturbance
broadband emission

electromagnetic disturbance which has a bandwidth greater than that of a particular

measuring apparatus, receiver or susceptible device

Note 1 to entry: For some purposes, particular spectral components of a broadband disturbance may be

considered as narrowband disturbances.

Note 2 to entry: Emission that has a bandwidth greater than that of a particular measuring apparatus or receiver.

[SOURCE: IEC 60050-161:1990, 161-06-11, modified – Note 2 to entry and the second

preferred term "broadband emission" have been added.]
3.4
common mode voltage
asymmetrical disturbance voltage

mean of the phasor voltages appearing between each conductor and a specified reference,

usually earth or frame

[SOURCE: IEC 60050-161:1990, 161-04-09, modified – The word "disturbance" has been

added to the admitted term.]
3.5
common mode current

vector sum of the currents flowing through two or more conductors at a specified cross-

section of a mathematical plane intersected by these conductors
3.6
conducted emission

transient and/or other disturbance observed on the external terminals of a device during its

normal operation
3.7
continuous disturbance

electromagnetic disturbance the effects of which on a particular device or equipment cannot

be resolved into a succession of distinct effects

Note 1 to entry: RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver that

causes a deflection on the meter of a measuring receiver in quasi-peak detection mode that does not decrease

immediately.

[SOURCE: IEC 60050-161:1990, 161-02-11, modified – Note 1 to entry has been added.]

3.8
DUT
device under test
device, equipment or system being evaluated

Note 1 to entry: As used in this document, DUT refers to a semiconductor device being tested.

Note 2 to entry: This note applies to the French language only.
---------------------- Page: 9 ----------------------
– 8 – IEC 61967-1:2018 © IEC 2018
3.9
die shrink

reduction of die size by using an advanced fabrication process including finer lithography

node and masks
3.10
differential mode current

in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the

magnitude of the difference of the phasors representing the currents in each conductor

[SOURCE: IEC 60050-161:1990, 161-04-38]
3.11
differential mode voltage
voltage between any two of a specified set of active conductors
[SOURCE: IEC 60050-161:1990, 161-04-08, modified – The second preferred term
"symmetrical voltage" has been removed.]
3.12
discontinuous disturbance

electromagnetic disturbance, the effects of which on a particular device or equipment can be

resolved into a succession of distinct effects

Note 1 to entry: It is recognised that this definition does not characterise the disturbance independently of the

effect that it produces. As a practical matter, any measure of a disturbance should be relatable to its effect on a

susceptible device.

Note 2 to entry: For counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a

measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak

detection mode.

[SOURCE: IEC 60050-161:1990, 161-02-28, modified – Note 2 to entry has been added.]

3.13
electrically small PCB

printed circuit board with length and width shorter than λ/2, for example 100 mm to 150 mm

at 1 GHz
3.14
EMC
electromagnetic compatibility

ability of an apparatus or system to function satisfactorily in its electromagnetic environment

without introducing intolerable electromagnetic disturbances to anything in that environment

3.15
electromagnetic emission
phenomenon by which electromagnetic energy emanates from a source
3.16
electromagnetic radiation
radiated emission

1) phenomenon by which energy in the form of electromagnetic waves emanates from a

source into space
2) energy transferred through space in the form of electromagnetic waves

[SOURCE: IEC 60050-161:1990, 161-01-10, modified – The second preferred term "radiated

emission" has been added and the Note to entry has been omitted.]
...

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