IEC 61967-1:2018

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are include in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.
This edition includes the following significant technical changes with respect to the previous edition:
- the frequency range of 150 kHz to 1 GHz has been deleted from the title;
- the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
- Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2 of Annex A;
- the general test board description has been moved to Annex D.

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 1: Conditions générales et définitions

L'IEC 61967-1:2018 fournit des informations générales et des définitions sur la mesure des perturbations électromagnétiques conduites et rayonnées par les circuits intégrés. Elle décrit également les conditions de mesure, l'appareillage et le montage d'essai, ainsi que les procédures d'essai et le contenu des rapports d'essai. L'Annexe A fournit des tableaux de comparaison des méthodes d'essai permettant de choisir la ou les méthodes de mesure appropriées. Le présent document a pour objet de définir des conditions générales afin d'établir un environnement d'essai uniforme et d'obtenir une mesure quantitative des perturbations RF par les circuits intégrés (CI). Il décrit les paramètres fondamentaux supposés avoir une incidence sur les résultats des essais. Tout écart par rapport au présent document est consigné de manière explicite dans les rapports d'essai. Les résultats des mesures peuvent être utilisés notamment à des fins de comparaison. La mesure de la tension et du courant des émissions RF conduits ou des perturbations RF rayonnées provenant d'un circuit intégré dans des conditions contrôlées, fournit des informations sur les perturbations RF potentielles dans une application du circuit intégré. La gamme de fréquences applicable est décrite dans chaque partie de l'IEC 61967. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- la gamme de fréquences 150 kHz à 1 GHz a été supprimée du titre;
- un palier de fréquences au-dessus de 1 GHz a été ajouté dans le Tableau 1, le Tableau 2 et au Paragraphe 5.4;
- le Tableau A.1 a été divisé en deux tableaux et l'IEC 61967-8 a été ajoutée au Tableau A.2 de l'Annexe A;
- la description générale de la carte d'essai a été déplacée à l'Annexe D.

General Information

• Status: Published
• Publication Date: 11-Dec-2018
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 9 - TC 47/SC 47A/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 14-Dec-2018
• Completion Date: 12-Dec-2018

Relations

• Revises: IEC 61967-1:2002 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61967-1 ®
Edition 2.0 2018-12
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz –
Part 1: General conditions and definitions

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 61967-1 ®
Edition 2.0 2018-12
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to

1 GHz –
Part 1: General conditions and definitions

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.200 ISBN 978-2-8322-6355-6

– 2 – IEC 61967-1:2018 RLV © IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test conditions . 12
4.1 General . 12
4.2 Ambient conditions. 12
4.2.1 General . 12
4.2.2 Ambient temperature . 12
4.2.3 Ambient RF field strength . 12
4.2.4 Other ambient conditions . 12
4.2.5 IC stability over time . 12
5 Test equipment . 12
5.1 General . 12
5.2 Shielding . 12
5.3 RF measuring instrument . 12
5.3.1 General . 12
5.3.2 Measuring receiver . 13
5.3.3 Spectrum analyser . 13
5.3.4 Other RBW for narrowband emissions . 13
5.3.5 Emission type, detector type and sweep speed . 13
5.3.6 Video bandwidth . 13
5.3.7 Verification of calibration for the RF measuring instrument . 14
5.4 Frequency range . 14
5.5 Preamplifier or attenuator . 14
5.6 System gain . 14
5.7 Other components . 14
6 Test set-up . 14
6.1 General . 14
6.2 Test circuit board . 14
6.3 IC pin loading. 15
6.4 Power supply requirements – Test board power supply . 15
6.5 IC specific considerations . 15
6.5.1 IC supply voltage . 15
6.5.2 IC decoupling . 15
6.5.3 Activity of IC . 16
6.5.4 Guidelines regarding IC operation . 16
7 Test procedure . 16
7.1 Ambient RF noise check . 16
7.2 Operational check . 16
7.3 Specific procedures . 16
8 Test report . 16
8.1 General . 16
8.2 Ambient RF noise . 16
8.3 Description of device . 17

8.4 Description of set-up . 17
8.5 Description of software . 17
8.6 Data presentation . 17
8.6.1 General . 17
8.6.2 Graphical presentation . 17
8.6.3 Software for data capture Measurement data . 17
8.6.4 Data processing . 17
8.7 RF emission limits . 17
8.8 Interpretation of results . 17
8.8.1 Comparison between IC(s) using the same test method . 17
8.8.2 Comparison between different test methods . 17
8.8.3 Correlation to module test methods . 18
Annex A (informative) Test method comparison tables . 19
Annex B (informative) Flow chart of a counter test code . 22
Annex C (informative) Description of worst-case application software . 23
Annex D (informative) General basic test board specification description . 24
D.1 General . 24
D.2 Board description – Mechanical . 24
D.3 Board description – Electrical . 24
D.4 Ground planes . 24
D.5 Package pins . 25
D.5.1 General . 25
D.5.2 DIL packages . 25
D.5.3 SOP, PLCC, QFP packages . 25
D.5.4 PGA packages . 25
D.5.5 BGA packages . 25
D.6 Via type diameters . 25
D.7 Via distance . 25
D.8 Additional components . 26
D.9 Supply decoupling. 26
D.9.1 General . 26
D.9.2 IC decoupling capacitors . 26
D.9.3 Power supply decoupling for the test board . 26
D.10 I/O load . 26
Bibliography . 28

Figure B.1 – Test code flow chart . 22
Figure D.1 – General basic Example of an emission test board . 27

Table – Test method comparison .
Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings . 13
Table 2 – Spectrum analyser bands and RBW default settings . 13
Table 3 – IC pin loading recommendations . 15
Table A.1 – Conducted emission . 20
Table A.2 – Radiated emission . 21
Table D.1 – Position of vias over the board . 24

– 4 – IEC 61967-1:2018 RLV © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz to 1 GHz –
Part 1: General conditions and definitions

FOREWORD
1) The Internationa
...

IEC 61967-1 ®
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

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Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

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The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

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IEC 61967-1 ®
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6284-9
– 2 – IEC 61967-1:2018 © IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test conditions . 10
4.1 General . 10
4.2 Ambient conditions. 10
4.2.1 General . 10
4.2.2 Ambient temperature . 11
4.2.3 Ambient RF field strength . 11
4.2.4 Other ambient conditions . 11
4.2.5 IC stability over time . 11
5 Test equipment . 11
5.1 General . 11
5.2 Shielding . 11
5.3 RF measuring instrument . 11
5.3.1 General . 11
5.3.2 Measuring receiver . 11
5.3.3 Spectrum analyser . 12
5.3.4 Other RBW for narrowband emissions . 12
5.3.5 Emission type, detector type and sweep speed . 12
5.3.6 Video bandwidth . 12
5.3.7 Verification of calibration for the RF measuring instrument . 12
5.4 Frequency range . 13
5.5 Preamplifier or attenuator . 13
5.6 System gain . 13
5.7 Other components . 13
6 Test set-up . 13
6.1 General . 13
6.2 Test circuit board . 13
6.3 IC pin loading. 13
6.4 Power supply requirements – Test board power supply . 14
6.5 IC specific considerations . 14
6.5.1 IC supply voltage . 14
6.5.2 IC decoupling . 14
6.5.3 Activity of IC . 14
6.5.4 Guidelines regarding IC operation . 14
7 Test procedure . 15
7.1 Ambient RF noise check . 15
7.2 Operational check . 15
7.3 Specific procedures . 15
8 Test report . 15
8.1 General . 15
8.2 Ambient RF noise . 15
8.3 Description of device . 15
8.4 Description of set-up . 16

8.5 Description of software . 16
8.6 Data presentation . 16
8.6.1 General . 16
8.6.2 Graphical presentation . 16
8.6.3 Measurement data . 16
8.6.4 Data processing . 16
8.7 RF emission limits . 16
8.8 Interpretation of results . 16
8.8.1 Comparison between IC(s) using the same test method . 16
8.8.2 Comparison between different test methods . 16
8.8.3 Correlation to module test methods . 16
Annex A (informative) Test method comparison tables . 17
Annex B (informative) Flow chart of a counter test code . 19
Annex C (informative) Description of worst-case application software . 20
Annex D (informative) General test board description . 21
D.1 General . 21
D.2 Board description – Mechanical . 21
D.3 Board description – Electrical . 21
D.4 Ground planes . 21
D.5 Package pins . 22
D.5.1 General . 22
D.5.2 DIL packages .
...