IEC 60068-2-58:2004

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)

La présente partie de la CEI 60068 décrit l'essai Td applicable aux composants pour montage en surface (CMS) qui sont destinés à être montés sur des substrats. La présente norme fournit les procédures normalisées pour les alliages de brasure contenant du plomb (Pb) et pour les alliages de brasure sans plomb. La présente norme fournit des procédures normalisées pour déterminer la brasabilité et la résistance à la chaleur de brasage des alliages de brasure sans plomb. La présente norme fournit des procédures normalisées pour déterminer la brasabilité, la dissolution de la métallisation et la résistance à la chaleur de brasage des alliages de brasure qui sont des brasures étain-plomb eutectiques ou quasi eutectiques.

General Information

• Status: Published
• Publication Date: 14-Jul-2004
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 27-Mar-2015

Relations

• Revised: IEC 60068-2-58:2015 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 05-Sep-2023
• Revises: IEC 60068-2-58:1999 - Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 60068-2-58
Third edition
2004-07
Environmental testing –
Part 2-58:
Tests – Test Td:
Test methods for solderability, resistance to
dissolution of metallization and to soldering
heat of surface mounting devices (SMD)
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
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INTERNATIONAL IEC
STANDARD 60068-2-58
Third edition
2004-07
Environmental testing –
Part 2-58:
Tests – Test Td:
Test methods for solderability, resistance to
dissolution of metallization and to soldering
heat of surface mounting devices (SMD)
© IEC 2004 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
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For price, see current catalogue

– 2 – 60068-2-58 © IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope and object.5
2 Normative references .5
3 Terms and definitions .6
4 Grouping of soldering processes using lead-free solder alloys.6
5 Preconditioning .7
6 Solder bath method .7
6.1 Test apparatus and materials for the solder bath method .7
6.2 Test procedure for solder bath method .8
7 Solder reflow methods .9
7.1 Test apparatus and materials for solder reflow methods .9
7.2 Test procedure for the solder reflow method.11
8 Test conditions .12
8.1 Test conditions for lead-free solder alloys .12
8.2 Test conditions for lead containing solder alloy .14
9 Final measurements .16
9.1 Flux removal .16
9.2 Recovery conditions .16
9.3 Evaluation .16
10 Information to be given in the relevant specification .18
Annex A (normative) Criteria for visual examination .19
Annex B (informative) Guidance.21
Annex C (informative) Quick view of the test conditions .23
Bibliography.25
Figure 1 – Examples of immersion .9
Figure 2 – Reflow temperature profile .12
Figure 3 – Identification of areas on metallic termination.17
Figure A.1 – Evaluation of wetting.20
Table 1 – Grouping of soldering processes related to lead-free solder alloys .7
Table 2 – Severities (duration and temperatures) – Solder bath method – Lead-free
solder alloys .13
Table 3 – Reflow temperature profile for wetting – Lead-free solder alloys.13
Table 4 – Reflow temperature profile for resistance to soldering heat – Lead-free
solder alloys .14
Table 5 – Severities (duration and temperature) .14
Table 6 – Reflow temperature profile for wetting – Lead containing solder alloys .15
Table 7 – Reflow temperature profile for resistance to soldering heat – Lead containing
solder alloys .16
Table C.1 – Overview of the temperature and duration conditions.24

60068-2-58 © IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-58 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This edition includes the following significant technical changes with respect to the previous
edition:
- expansion of the scope so that it includes lead-free solder alloy in addition to the existing
tin-lead eutectic or near eutectic solder alloy (the structure of the document has been
changed accordingly);
- addition of the definitions of "solderability" and "resistance to soldering heat" for SMDs;
- specification of the reflow temperature profiles for the resistance to soldering heat using
lead-free solder;
- addition of an Annex C enabling a quick overview of the test conditions.

– 4 – 60068-2-58 © IEC:2004(E)
The text of this standard is based on the following documents:
FDIS Report on voting
91/447/FDIS 91/459/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version may be issued at a later date.

60068-2-58 © IEC:2004(E) – 5 –
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
1 Scope and object
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which
are intended to mount on substrates. This standard provides the standard procedures for
solder alloys containing lead (Pb) and for lead-free solder alloys.
This standard provides standard procedures for determining the solderability and resistance
of soldering heat to lead-free solder alloys.
This standard provides standard procedures for determining the solderability, dissolution of
metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic
or near eutectic tin lead solders.
The procedures in this standard include the solder bath method and reflow method. The
solder bath method is applicable to the SMD designed for flow soldering and the SMD
designed for reflow soldering when the solder bath (dipping) method is appropriate.
The reflow method is applicable to the SMD designed for reflow soldering, to determine the
suitability of SMD for reflow soldering and when the solder bath (dipping) method is not
appropriate.
The objective of this standard is to ensure that component lead or termination solderability
meets the applicable solder joint requirements of IEC 61191-2 using each of the soldering
methods specified in IEC 61760-1. In addition, test methods are provided to ensure that the
component body can resist against the heat load to which it is exposed during soldering.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Environmental testing – Part 2
...

IEC 60068-2-58
Edition 3.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
Essais d’environnement –
Partie 2-58: Essais – Essai Td : Méthodes d’essai de la soudabilité, résistance de
la métallisation à la dissolution et résistance à la chaleur de brasage des
composants pour montage en surface (CMS)

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IEC 60068-2-58
Edition 3.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
Essais d’environnement –
Partie 2-58: Essais – Essai Td : Méthodes d’essai de la soudabilité, résistance de
la métallisation à la dissolution et résistance à la chaleur de brasage des
composants pour montage en surface (CMS)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
U
CODE PRIX
ICS 19.040; 31.190 ISBN 2-8318-7842-X
– 2 – 60068-2-58 © CEI:2004
SOMMAIRE
AVANT-PROPOS.4
1 Domaine d'application et objet.8
2 Références normatives.8
3 Termes et définitions .10
4 Ensemble des procédés de brasage utilisant des alliages de brasure sans plomb .10
5 Préconditionnement.12
6 Méthode du bain de brasage .12
6.1 Appareillage d'essai et matériaux pour la méthode du bain de brasage .12
6.2 Procédure d'essai pour méthode de bain de brasage.14
7 Méthodes de refusion de soudure.16
7.1 Appareillage d'essai et matériaux pour les méthodes de refusion de soudure.16
7.2 Procédure d'essai pour la méthode de refusion de soudure .20
8 Conditions d'essais .22
8.1 Conditions d’essai pour les alliages de soudure de brasure sans plomb .22
8.2 Conditions d’essai pour les alliages de brasure contenant du plomb.26
9 Mesures finales .30
9.1 Nettoyage du flux .30
9.2 Conditions de reprise .30
9.3 Évaluation .32
10 Renseignements devant figurer dans la spécification applicable.34

Annexe A (normative) Critères pour examen visuel.38
Annexe B (informative) Guide .42
Annexe C (informative) Vue d'ensemble des conditions d’essais.48

Bibliographie.52

Figure 1 – Exemples d’immersion .16
Figure 2 – Profil de température de refusion .22
Figure 3 – Identification des zones sur les bornes métalliques .32
Figure A.1 – Évaluation du mouillage.40

Tableau 1 – Ensemble des procédés de brasage se rapportant aux alliages de brasure
sans plomb .12
Tableau 2 – Sévérités (durées et températures) – Méthode de bain de brasage –
Alliages de brasure sans plomb .24
Tableau 3 – Profil de température de refusion pour le mouillage – Alliages de brasure
sans plomb .24
Tableau 4 – Profil de température de refusion pour la résistance à la chaleur de
brasage – Alliages de brasure sans plomb.26
Tableau 5 – Sévérités (durée et température) .26
Tableau 6 – Profil de température de refusion pour le mouillage – Alliages de brasure
contenant du plomb .28
Tableau 7 – Profil de température de fusion pour la résistance à la chaleur de brasage
– Alliages de brasure contenant du plomb.30
Tableau C.1 – Aperçu des conditions de température et de durée.50

60068-2-58 © IEC:2004 – 3 –
CONTENTS
FOREWORD.5
1 Scope and object.9
2 Normative references .9
3 Terms and definitions .11
4 Grouping of soldering processes using lead-free solder alloys.11
5 Preconditioning .13
6 Solder bath method .13
6.1 Test apparatus and materials for the solder bath method .13
6.2 Test procedure for solder bath method .15
7 Solder reflow methods .17
7.1 Test apparatus and materials for solder reflow methods .17
7.2 Test procedure for the solder reflow method.21
8 Test conditions .23
8.1 Test conditions for lead-free solder alloys .23
8.2 Test conditions for lead containing solder alloy .27
9 Final measurements .31
9.1 Flux removal .31
9.2 Recovery conditions .31
9.3 Evaluation .33
10 Information to be given in the relevant specification .35

Annex A (normative) Criteria for visual examination .39
Annex B (informative) Guidance.43
Annex C (informative) Overview of test conditions .49

Bibliography.53

Figure 1 – Examples of immersion .17
Figure 2 – Reflow temperature profile .23
Figure 3 – Identification of areas on metallic termination.33
Figure A.1 – Evaluation of wetting.41

Table 1 – Grouping of soldering processes related to lead-free solder alloys .13
Table 2 – Severities (duration and temperatures) – Solder bath method – Lead-free
solder alloys .25
Table 3 – Reflow temperature profile for wetting – Lead-free solder alloys.25
Table 4 – Reflow temperature profile for resistance to soldering heat – Lead-free
solder alloys .27
Table 5 – Severities (duration and t
...